Abstract: An electrolytic etching method for etching treating an object to be etched by an electrochemical reaction through an electrolyte between the object to be etched and an etching electrode, where the contact angle of the electrolyte to the object to be etched is not more than 70°. This electrolytic etching method can etch the object in a non-contact manner, can reduce the cost, number of steps, and processing time, and can enhance the patterning accuracy.

Abstract: An offset printing method comprises the steps of: a process for suspending a sheet-shaped or belt-shaped blanket by supporting both ends thereof at the leading and trailing ends thereof in the printing direction; and a process for performing ink reception from a plate to the blanket and also transferring ink from the blanket to a work, by pressing the blanket by a pressuring jig from an upwards direction down onto a plate or work situated below and sweeping in the printing direction. An offset printing apparatus is configured so as to carry out this method.

Abstract: Provided is an electrolytic etching method for etching treating an object to be etched by an electrochemical reaction through an electrolyte between the object to be etched and an etching electrode, wherein the contact angle of the electrolyte to the object to be etched is not more than 70°. Thus provided is an electrolytic etching method that can etch the object in a non-contact manner, that can reduce the cost, the number of steps, and the processing time, and that can enhance the patterning accuracy.

Abstract: A photovoltaic device of this invention has a semiconductor layer for generating a photovoltaic power and a collector electrode formed on the semiconductor layer to collect the power generated by the semiconductor layer. A conductive layer containing a conductive powder is formed on at least one side of the collector electrode closer to the semiconductor layer, and a metal layer is formed on the side away from the semiconductor layer. The metal layer covers the surface of the conductive layer away from the semiconductor layer.

Abstract: Laser light having a wavelength where a thin-film semiconductor layer can absorb the laser light is applied on the side of the thin-film semiconductor layer to join a semiconductor-holding member and a metal member by welding. Materials can be joined at a sufficiently high strength and with long term stability especially when a metal member of the same or different type is welded to a conductive substrate which is a part of a photovoltaic device.

Abstract: An etching apparatus is described comprising a substrate holding segment for holding a substrate with a portion to be etched, an electrolytic bath for maintaining an electrolyte solution therein, a locomotive mechanism for moving the substrate holding segment in order to immerse the substrate held on the substrate holding segment in the electrolyte solution maintained in the electrolytic bath, and a counter electrode holding segment for holding a counter electrode having a pattern corresponding a desired etching pattern to be formed at the portion to be etched of the substrate. The counter electrode is positioned to oppose the substrate held on the substrate holding segment.

Abstract: A method for etching an object having a portion to be etched on the surface thereof, comprising a step of immersing said object in an electrolyte solution such that said object serves as a negative electrode; a step of arranging a counter electrode having a pattern corresponding to a desired etching pattern to be formed at said portion to be etched of said object in said electrolyte solution so as to maintain a predetermined interval between said counter electrode and said object, and a step of applying a direct current or a pulse current between said object and said counter electrode to etch said portion to be etched of said object into a pattern corresponding to said pattern of said counter electrode.

Abstract: A photovoltaic device of this invention has a semiconductor layer for generating a photovoltaic power and a collector electrode formed on the semiconductor layer to collect the power generated by the semiconductor layer. A conductive layer containing a conductive powder is formed on at least one side of the collector electrode closer to the semiconductor layer, and a metal layer is formed on the side away from the semiconductor layer. The metal layer covers the surface of the conductive layer away from the semiconductor layer.

Abstract: A vibration wave motor which produces a relative movement between a vibrator and a member which is in contact with the vibrator via friction surfaces by means of a traveling vibration wave produced in the vibrator. In the motor, a friction surface of either one of the vibrator and frictional member is made of a material subjected to a hard alumite processing, and at least a friction surface of another one of the vibrator and frictional member is made of an ultrahard material consisting of a nickel-phosphorus-base alloy which contains at least one kind of material selected from the group consisting of silicon carbide, boron carbide, titanium boride and boron nitride.

Abstract: A sheet coil in the form of a conductor on an insulating substrate has a mending metal portion at a side portion forming the conductor gap so as to narrow the gap width. The sheet coil can be produced by forming a coil pattern on a base material made up of an insulating substrate and a metal layer laminated thereon by using a photosensitive material. The portion of the metal layer not covered with the photosensitive material is removed by etching, and, while the photosensitive material remains, a metal plating treatment is carried out so as to narrow the etched width of the metal layer.