Abstract: An on-chip impedance matching includes a transistor and a tank circuit. The transistor is operably coupled to receive an input signal. The tank circuit is operably coupled to the transistor, wherein a tap of the tank circuit provides an output of the on-chip impedance matching power amplifier, wherein the tank circuit is tuned with respect to an antenna load of the on-chip impedance matching power amplifier.

Abstract: An integrated RF front-end architecture is disclosed. Such an integrated RF front-end architecture includes a multi-tap balun, a low noise amplifier and a power amplifier core. The multi-tap balun includes a single-ended primary winding and a symmetrical multi-tap secondary winding, wherein the single-ended primary winding is operably coupled to an antenna. The low noise amplifier is coupled to a first set of taps of the symmetrical multi-tap secondary winding. The power amplifier core is coupled to a second set of taps of the symmetrical multi-tap secondary winding and can be a two stage amplifier having a driver stage and an output stage. The multi-tap balun, low noise amplifier and power amplifier core can be on-chip components or can be fabricated to be discrete components on a printed circuit board.

Abstract: A radio frequency circuit includes a first differential RF path and a second differential path. The first differential RF path includes at least one RF block that includes a first differential section and a second differential section, wherein the first differential section is symmetrical with the second differential section. The second differential RF path includes at least one RF block that includes a first differential section and a second differential section, wherein the first differential section is symmetrical with the second differential section. The first and second half differential sections of the at least one RF block of the first differential RF path are symmetrically placed on at least one layer around the first and second half differential sections of the at least one RF block of the second differential RF path, wherein the first and second half differential sections of the at least one RF block of the second differential RF path are fabricated on the at least one layer.

Abstract: An on-chip multiple tap transformer balun includes a 1st winding and a 2nd winding having two portions. The 1st winding is on a 1st layer of an integrated circuit and is operably coupled for a single ended signal. The 1st and 2nd portions of the 2nd winding are on a 2nd layer of the integrated circuit. The 1st portion of the 2nd winding includes a 1st node, a 2nd node, and a tap. The 1st node is operably coupled to receive a 1st leg of a 1st differential signal and the 2nd node is coupled to a reference potential. The tap of the 1st portion is operably coupled for a 1st leg of a 2nd differential signal. The 2nd portion of the 2nd winding includes a 1st node, 2nd node, and tap. The 1st node is operably coupled to receive a 2nd leg of the 1st differential signal and the 2nd node is operably coupled to the reference potential. The tap of the 2nd portion is coupled for a 2nd leg of the 2nd differential signal.

Abstract: An on-chip impedance matching includes a transistor, an inductor, and a capacitive divider. The gate of the transistor is operably coupled to receive input signals; the source of the transistor is coupled to a first DC voltage potential; and the drain of the transistor is operably coupled to the inductor. The other end of the inductor is operably coupled to a second DC voltage potential. The capacitive divider includes matched capacitors that, in combination with the inductor, provide for substantially lossless on-chip impedance matching, where a tap of the capacitive divider provides an output of the on-chip impedance matching power amplifier. In addition, the capacitance of the capacitive divider and the inductance of the inductor are tuned to provide a tank circuit for the on-chip impedance matching power amplifier.

Abstract: An integrated RF front-end architecture is disclosed. Such an integrated RF front-end architecture includes a multi-tap balun, a low noise amplifier and a power amplifier core. The multi-tap balun includes a single-ended primary winding and a symmetrical multi-tap secondary winding, wherein the single-ended primary winding is operably coupled to an antenna. The low noise amplifier is coupled to a first set of taps of the symmetrical multi-tap secondary winding. The power amplifier core is coupled to a second set of taps of the symmetrical multi-tap secondary winding and can be a two stage amplifier having a driver stage and an output stage. The multi-tap balun, low noise amplifier and power amplifier core can be on-chip components or can be fabricated to be discrete components on a printed circuit board.

Abstract: An on-chip multiple tap transformer balun includes a 1st winding and a 2nd winding having two portions. The 1st winding is on a 1st layer of an integrated circuit and is operably coupled for a single ended signal. The 1st and 2nd portions of the 2nd winding are on a 2nd layer of the integrated circuit. The 1st portion of the 2nd winding includes a 1st node, a 2nd node, and a tap. The 1st node is operably coupled to receive a 1st leg of a 1st differential signal and the 2nd node is coupled to a reference potential. The tap of the 1st portion is operably coupled for a 1st leg of a 2nd differential signal. The 2nd portion of the 2nd winding includes a 1st node, 2nd node, and tap. The 1st node is operably coupled to receive a 2nd leg of the 1st differential signal and the 2nd node is operably coupled to the reference potential. The tap of the 2nd portion is coupled for a 2nd leg of the 2nd differential signal.

Abstract: An on-chip multiple tap transformed balun includes a 1st winding and a 2nd winding having two portions. The 1st winding is on a 1st layer of an integrated circuit and is operably coupled for a single ended signal. The 1st and 2nd portions of the 2nd winding are on a 2nd layer of the integrated circuit. The 1st portion of the 2nd winding includes a 1st node, a 2nd node, and a tap. The 1st node is operably coupled to receive a 1st leg of a 1st differential signal and the 2nd node is coupled to a reference potential. The tap of the 1st portion is operably coupled for a 1st leg of a 2nd differential signal. The 2nd portion of the 2nd winding includes a 1st node, 2nd node, and tap. The 1st node is operably coupled to receive a 2nd leg of the 1st differential signal and the 2nd node is operably coupled to the reference potential. The tap of the 2nd portion is coupled for a 2nd leg of the 2nd differential signal.

Abstract: An on-chip multiple tap transformer balun includes a 1st winding and a 2nd winding having two portions. The 1st winding is on a 1st layer of an integrated circuit and is operably coupled for a single ended signal. The 1st and 2nd portions of the 2nd winding are on a 2nd layer of the integrated circuit. The 1st portion of the 2nd winding includes a 1st node, a 2nd node, and a tap. The 1st node is operably coupled to receive a 1st leg of a 1st differential signal and the 2nd node is coupled to a reference potential. The tap of the 1st portion is operably coupled for a 1st leg of a 2nd differential signal. The 2nd portion of the 2nd winding includes a 1st node, 2nd node, and tap. The 1st node is operably coupled to receive a 2nd leg of the 1st differential signal and the 2nd node is operably coupled to the reference potential. The tap of the 2nd portion is coupled for a 2nd leg of the 2nd differential signal.

Abstract: An on-chip impedance matching includes a transistor, an inductor, and a capacitive divider. The gate of the transistor is operably coupled to receive input signals; the source of the transistor is coupled to a first DC voltage potential; and the drain of the transistor is operably coupled to the inductor. The other end of the inductor is operably coupled to a second DC voltage potential. The capacitive divider includes matched capacitors that, in combination with the inductor, provide for substantially lossless on-chip impedance matching, where a tap of the capacitive divider provides an output of the on-chip impedance matching power amplifier. In addition, the capacitance of the capacitive divider and the inductance of the inductor are tuned to provide a tank circuit for the on-chip impedance matching power amplifier.