Abstract: Fitment assembly (10) for one or a plurality of food or beverage containers (20), each container comprising at least one ingredient for the preparation of a food or beverage product, the fitment assembly (10) comprising at least one fluid inlet (12) communicating with at least one injection hole (14) through which a fluid can be supplied into the food or beverage containers, and at least one dispensing outlet (13) through which the food or beverage product is dispensed. The fitment assembly (10) comprises two parts relatively moveable with respect to each other such that this relative movement opens or closes the communication of the inner volume of the containers with the fitment assembly (10) and/or further opens or closes the communication of the dispensing outlet (13) with the exterior of the fitment assembly.

Abstract: Fitment assembly (10) for one or a plurality of food or beverage containers (20), each container comprising at least one ingredient for the preparation of a food or beverage product, the fitment assembly (10) comprising at least one fluid inlet (12) communicating with at least one injection hole (14) through which a fluid can be supplied into the food or beverage containers, and at least one dispensing outlet (13) through which the food or beverage product is dispensed; the fitment assembly (10) comprising two parts rotatable relative to each other such that this relative rotation opens or closes, totally or up to a certain degree, the at least one dispensing outlet (13). The invention further relates to a pack (40) comprising a fitment assembly (10) as described and at least one food or beverage container (20) to which the fitment assembly (10) is attached.

Abstract: The invention relates to a method for fixing a miniaturized component, especially comprising a micro-optical element, to a pre-determined fixing section of a baseplate by means of a soldered joint. Said baseplate comprises an upper side and a lower side, and the component comprises a base surface. At least the fixing section of the baseplate is coated on the upper side by a metallic layer which is applied at least in the fixing section in a continuously plane manner and thus without interruptions. Solder material is applied at least to the fixing section coated with the metallic layer. In one step of the method, the component is arranged above the fixing section, the base surface of the component being positioned above the solder material in such a way that they do not touch, are vertically interspaced and form an intermediate region between each other.

Abstract: The invention relates to a method, a device and a system for fixing a miniaturized component—especially carrying or containing at least one optical element—to a carrier plate in a highly-precise manner, by means of a soldered joint, a welded joint or an adhesive joint. Said component is positioned above the carrier plate in a relation to outer reference points by means of a gripper pertaining to a robot station. A joint is then created between the component and the carrier plate, the joint seam hardening under contraction between the component and the carrier plate, thus exerting a vertical tractive force on the gripper holding the component. At the same time as the contraction, the gripper is vertically displaced towards the carrier plate in a controlled or regulated manner, optionally up to a defined nominal position, and actively yields to the contraction such that the creation of high tensions is largely avoided and the position does not change when the component is detached from the gripper.

Abstract: The invention relates to a method, a device and a system for fixing a miniaturized component—especially carrying or containing at least one optical element—to a carrier plate in a highly-precise manner, by means of a soldered joint, a welded joint or an adhesive joint. Said component is positioned above the carrier plate in a relation to outer reference points by means of a gripper pertaining to a robot station. A joint is then created between the component and the carrier plate, the joint seam hardening under contraction between the component and the carrier plate, thus exerting a vertical tractive force on the gripper holding the component. At the same time as the contraction, the gripper is vertically displaced towards the carrier plate in a controlled or regulated manner, optionally up to a defined nominal position, and actively yields to the contraction such that the creation of high tensions is largely avoided and the position does not change when the component is detached from the gripper.

Abstract: The invention relates to a method for fixing a miniaturized component, especially comprising a micro-optical element, to a pre-determined fixing section of a baseplate by means of a soldered joint. Said baseplate comprises an upper side and a lower side, and the component comprises a base surface. At least the fixing section of the baseplate is coated on the upper side by a metallic layer which is applied at least in the fixing section in a continuously plane manner and thus without interruptions. Solder material is applied at least to the fixing section coated with the metallic layer. In one step of the method, the component is arranged above the fixing section, the base surface of the component being positioned above the solder material in such a way that they do not touch, are vertically interspaced and form an intermediate region between each other.