Abstract: Provided herein are heterocyclic derivative compounds and pharmaceutical compositions comprising said compounds that are useful for the treatment of retinal binding protein (RBP4) related diseases, such as macular degeneration and the like.

Abstract: Disclosed herein are related to memory device including an adaptive word line control circuit. In one aspect, the memory device includes a memory cell and a word line driver coupled to the memory cell through a word line. In one aspect, the memory device includes an adaptive word line control circuit including two or more diodes connected in series, where one of the two or more diodes is coupled to the word line.

Abstract: A method and apparatus for an assisted metal routing is disclosed. Embodiments may include: determining an initial block mask having a first inner vertex for forming a metal routing layer of an integrated circuit (IC); adding an assistant metal portion within the metal routing layer; and determining a modified block mask based on the assistant metal portion for forming the metal routing layer.

Abstract: A method and apparatus for an assisted metal routing is disclosed. Embodiments may include: determining an initial block mask having a first inner vertex for forming a metal routing layer of an integrated circuit (IC); adding an assistant metal portion within the metal routing layer; and determining a modified block mask based on the assistant metal portion for forming the metal routing layer.

Abstract: An approach for providing MOL constructs using diffusion contact structures is disclosed. Embodiments include: providing a first diffusion region in a substrate; providing, via a first lithography process, a first diffusion contact structure; providing, via a second lithography process, a second diffusion contact structure; and coupling the first diffusion contact structure to the first diffusion region and the second diffusion contact structure. Embodiments include: providing a second diffusion region in the substrate; providing a diffusion gap region between the first and second diffusion regions; providing the diffusion contact structure over the diffusion gap region; and coupling, via the diffusion contact structure, the first and second diffusion regions.

Abstract: An approach for providing MOL constructs using diffusion contact structures is disclosed. Embodiments include: providing a first diffusion region in a substrate; providing, via a first lithography process, a first diffusion contact structure; providing, via a second lithography process, a second diffusion contact structure; and coupling the first diffusion contact structure to the first diffusion region and the second diffusion contact structure. Embodiments include: providing a second diffusion region in the substrate; providing a diffusion gap region between the first and second diffusion regions; providing the diffusion contact structure over the diffusion gap region; and coupling, via the diffusion contact structure, the first and second diffusion regions.

Abstract: An approach for providing MOL constructs using diffusion contact structures is disclosed. Embodiments include: providing a first diffusion region in a substrate; providing, via a first lithography process, a first diffusion contact structure; providing, via a second lithography process, a second diffusion contact structure; and coupling the first diffusion contact structure to the first diffusion region and the second diffusion contact structure. Embodiments include: providing a second diffusion region in the substrate; providing a diffusion gap region between the first and second diffusion regions; providing the diffusion contact structure over the diffusion gap region; and coupling, via the diffusion contact structure, the first and second diffusion regions.

Abstract: An approach for providing MOL constructs using diffusion contact structures is disclosed. Embodiments include: providing a first diffusion region in a substrate; providing, via a first lithography process, a first diffusion contact structure; providing, via a second lithography process, a second diffusion contact structure; and coupling the first diffusion contact structure to the first diffusion region and the second diffusion contact structure. Embodiments include: providing a second diffusion region in the substrate; providing a diffusion gap region between the first and second diffusion regions; providing the diffusion contact structure over the diffusion gap region; and coupling, via the diffusion contact structure, the first and second diffusion regions.

Abstract: One illustrative device disclosed herein includes a continuous active region defined in a semiconducting substrate, first and second transistors formed in and above the continuous active region, each of the first and second transistors comprising a plurality of doped regions formed in the continuous active region, a conductive isolating electrode positioned above the continuous active region between the first and second transistors and a power rail conductively coupled to the conductive isolating electrode.

Abstract: One illustrative device disclosed herein includes a continuous active region defined in a semiconducting substrate, first and second transistors formed in and above the continuous active region, each of the first and second transistors comprising a plurality of doped regions formed in the continuous active region, a conductive isolating electrode positioned above the continuous active region between the first and second transistors and a power rail conductively coupled to the conductive isolating electrode.

Abstract: A reusable, air-permeable packaging film formed of a layer of resilient and nontoxic material is disclosed. The packaging film includes a plurality of micro-gaps distributed within a pre-selected area on the packaging film, wherein each of the micro-gaps traverses thickness of the packaging film, and wherein, in a static state, i.e., no pressure/stress exerted on the packaging film, each of the micro-gaps comprises a split upper seam portion with edge ridges demonstrated on a top surface of the packaging film and a close lower seam portion communicating with the split upper seam portion. During microwaving, the pressure can be regulated at a relatively lower vapor transferring rate through the pre-selected area.

Abstract: A composite film for packaging foods enable to regulate pressure inside automatically when being heated and the progress of making it are provided. The composite film comprises a substrate film provided with a plurality of micro-gap regions processed by impressing process and an adhesive film attached to an airtight film. The composite film is applied to a food packaging devices which has an airtight structure. In use, the food packaging device can receive foods for microwave heating while the airtight film and the micro-gap region are used to prevent the food packaging device from breaking while preventing the steam vast losing and foods from becoming drier.

Abstract: A reusable, air-permeable packaging film formed of a layer of resilient and nontoxic material is disclosed. The packaging film includes a plurality of micro-gaps distributed within a pre-selected area on the packaging film, wherein each of the micro-gaps traverses thickness of the packaging film, and wherein, in a static state, i.e., no pressure/stress exerted on the packaging film, each of the micro-gaps comprises a split upper seam portion with edge ridges demonstrated on a top surface of the packaging film and a close lower seam portion communicating with the split upper seam portion. During microwaving, the pressure can be regulated at a relatively lower vapor transferring rate through the pre-selected area.

Abstract: A reusable, air-permeable packaging film formed of a layer of resilient and nontoxic material is disclosed. The packaging film includes a plurality of micro-gaps distributed within a pre-selected area on the packaging film, wherein each of the micro-gaps traverses thickness of the packaging film, and wherein, in a static state, i.e., no pressure/stress exerted on the packaging film, each of the micro-gaps comprises a split upper seam portion with edge ridges demonstrated on a top surface of the packaging film and a close lower seam portion communicating with the split upper seam portion. During microwaving, the pressure can be regulated at a relatively lower vapor transferring rate through the pre-selected area.

Abstract: A method for manufacturing a novel air permeable composite film is disclosed. The air permeable composite film has a polymer layer with a top face and a bottom face and a sealing layer covering the top face. The polymer layer is first perforated by virtue of an impression process to form a plurality of tiny gaps in it for air permeation. Then the sealing layer is coated on the top face of the polymer layer to fill the gaps. The differential pressure between the top face and bottom face of the polymer layer enlarges the gaps and makes the gaps become air permeable.

Abstract: Microwaveable food package and method of manufacturing the same are disclosed. The package comprises an airtight food region, a reversible vapor pressure regulating region, and a passage at a junction between both regions. The passage is airtight sealed in a nonoperating state. Whereby heating the food region with a foodstuff contained therein will increase a vapor pressure in the food region, swell the food region, open up the passage, direct hot steam to the pressure regulating region from the food region via the passage for releasing excessive pressure, swell the pressure regulating region, and cause hot steam to be automatically regulated by the pressure regulating region. Further, after heating stops, the cooling process will cause both swelled regions to contract, and return both regions to their original states. The package can be a container or bag.

Abstract: A reusable, air-permeable packaging film formed of a layer of resilient and nontoxic material is disclosed. The packaging film includes a plurality of micro-gaps distributed within a pre-selected area on the packaging film, wherein each of the micro-gaps traverses thickness of the packaging film, and wherein, in a static state, i.e., no pressure/stress exerted on the packaging film, each of the micro-gaps comprises a split upper seam portion with edge ridges demonstrated on a top surface of the packaging film and a close lower seam portion communicating with the split upper seam portion. During microwaving, the pressure can be regulated at a relatively lower vapor transferring rate through the pre-selected area.

Abstract: A method for manufacturing a novel air permeable composite film is disclosed. The air permeable composite film has a polymer layer with a top face and a bottom face and a sealing layer covering the top face. The polymer layer is first perforated by virtue of an impression process to form a plurality of tiny gaps in it for air permeation. Then the sealing layer is coated on the top face of the polymer layer to fill the gaps. The differential pressure between the top face and bottom face of the polymer layer enlarges the gaps and makes the gaps become air permeable.