Abstract: A method and apparatus for encapsulating an integrated circuit die and leadframe assembly. A prepackaged sproutless mold compound insert 71 is placed in a rectangular receptacle 91 in a bottom mold chase 81. The receptacle is coupled to a plurality of die cavities 85 by runners 87. Leadframe strip assemblies containing leadframes, integrated circuit dies, and bond wires coupling the leadframes and dies are placed over the bottom mold chase 81 such that the integrated circuit dies are each centered over a bottom mold die cavity 85. A top mold chase 90 is placed over the bottom mold chase 81 and the mold compound package 71. The top mold chase 90 has die cavities 95 corresponding to those in the bottom mold chase 81. The mold compound insert 71 is preferably packaged in a plastic film 75 which has heat sealed edges 77. The mold compound is forced through the package 75 and heat seals 77 during the molding process by the pressure applied by a rectangular plunger 101.

Abstract: A method and apparatus for providing a prepackaged mold compound for use in encapsulating integrated circuit die and leadframe assemblies. A piece of mold compound 71 is placed in a receptacle 91 in a bottom mold chase 83. The receptacle 91 is coupled to a group of die cavities 85 by runners 87. Leadframe strip assemblies containing leadframes, integrated circuit dies, and bond wires coupling the leadframes and dies are placed over the bottom mold chase 83 such that the integrated circuit dies are each centered over a bottom mold die cavity 85. A top mold chase 93 is placed over the bottom mold chase and the prepackaged mold compound 71. The prepackaged mold compound 71 is a piece of mold compound 73 packaged in a plastic film which has sealed edges 77. The edges are peelable seals, which are released during the molding process. The mold compound 73 is then forced through the seals during the molding process by the pressure applied by a plunger 101.

Abstract: A method and apparatus for encapsulating an integrated circuit die and leadframe assembly using dambarless leadframes. Dambarless leadframe 191 is formed having leads 193 that are widened in the region near the package edge such that the interlead spacing between adjacent leads is less than a predetermined minimum distance. Lower and upper mold release films 67 and 65 are stretched over a plurality of die cavities formed in bottom and top mold chases 179 and 173. The release films can be further stretched into the die cavities by a vacuum. Leadframe strip assemblies containing the dambarless leadframes, each holding integrated circuit dies 189, are placed such that the integrated circuit dies are each centered over a bottom mold die cavity 63 and over the bottom mold release films 65.

Abstract: A method and apparatus for encapsulating an integrated circuit die and leadframe assembly. A prepackaged sproutless mold compound insert 71 is placed in a rectangular receptacle 91 in a bottom mold chase 81. The receptacle is coupled to a plurality of die cavities 85 by runners 87. Leadframe strip assemblies containing leadframes, integrated circuit dies, and bond wires coupling the leadframes and dies are placed over the bottom mold chase 81 such that the integrated circuit dies are each centered over a bottom mold die cavity 85. A top mold chase 90 is placed over the bottom mold chase 81 and the mold compound package 71. The top mold chase 90 has die cavities 95 corresponding to those in the bottom mold chase 81. The mold compound insert 71 is preferably packaged in a plastic film 75 which has heat sealed edges 77. The mold compound is forced through the package 75 and heat seals 77 during the molding process by the pressure applied by a rectangular plunger 101.

Abstract: A method and apparatus for encapsulating an integrated circuit die and leadframe assembly using dambarless leadframes. Dambarless leadframe 191 is formed having leads 193 that are widened in the region near the package edge such that the interlead spacing between adjacent leads is less than a predetermined minimum distance. Lower and upper mold release films 67 and 65 are stretched over a plurality of die cavities formed in bottom and top mold chases 179 and 173. The release films can be further stretched into the die cavities by a vacuum. Leadframe strip assemblies containing the dambarless leadframes, each holding integrated circuit dies 189 are placed such that the integrated circuit dies are each centered over a bottom mold die cavity 63 and over the bottom mold release films 65.

Abstract: A method and apparatus for providing a prepackaged mold compound for use in encapsulating integrated circuit die and leadframe assemblies. A piece of mold compound 71 is placed in a receptacle 91 in a bottom mold chase 83. The receptacle 91 is coupled to a group of die cavities 85 by runners 87. Leadframe strip assemblies containing leadframes, integrated circuit dies, and bond wires coupling the leadframes and dies are placed over the bottom mold chase 83 such that the integrated circuit dies are each centered over a bottom mold die cavity 85. A top mold chase 93 is placed over the bottom mold chase and the prepackaged mold compound 71. The prepackaged mold compound 71 is a piece of mold compound 73 packaged in a plastic film which has sealed edges 77. The edges are peelable seals, which are released during the molding process. The mold compound 73 is then forced through the seals during the molding process by the pressure applied by a plunger 101.

Abstract: A method and apparatus for encapsulating an integrated circuit die and leadframe assembly. A prepackaged mold compound insert 71 is placed in a rectangular receptacle 91 in a bottom mold chase 81. The receptacle is coupled to a plurality of die cavities 85 by runners 87. Leadframe strip assemblies containing leadframes, integrated circuit dies, and bond wires coupling the leadframes and dies are placed over the bottom mold chase 81 such that the integrated circuit dies are each centered over a bottom mold die cavity 85. A top mold chase 90 is placed over the bottom mold chase 81 and the mold compound package 71. The top mold chase 90 has die cavities 95 corresponding to those in the bottom mold chase 81. The mold compound insert 71 is packaged in a plastic film 75 which has heat sealed edges 77. The mold compound is forced through the package 75 and heat seals 77 during the molding process by the pressure applied by a rectangular plunger 101.

Abstract: Method for pressing a plastic (6), which cures by means of a reaction, from a displacement chamber (4) via at least one injection channel (3) and a gate (2) to a mould cavity (1), said method at least comprising the following steps: pressurising the plastic (6) with an amount of a pressing auxiliary (7) in the displacement chamber (4); pressing the plastic (6) into the mould cavity (1); and allowing the plastic to cure under pressure in the mould cavity, the pressing auxiliary (7) being plastically deformable under the conditions of pressing and the amount thereof being sufficient to be pressed to the vicinity of the gate (2) of the mould cavity (1). Preferably the pressing auxiliary (7) is a thermoplastic.

Abstract: Method for packing a measured quantity of thermosetting resin, intended for encapsulating a component such as an integrated circuit by introducing this quantity into a flexible plastics covering which can be sealed airtight, and packing for a measured quantity of thermosetting resin intended for encapsulating a component.

Abstract: An automatic continuously cycleable molding system wherein a plurality of mold sets are transported in predetermined timed cycles through a series of work stations wherein the various molding, curing and workpiece handling operations are accomplished, and wherein the mold sets are recirculatingly moved through the system for repeated usage.

Abstract: An automatic continuously cycleable molding system wherein a plurality of mold sets are transported in predetermined timed cycles through a series of work stations wherein the various molding, curing and workpiece handling operations are accomplished, and wherein the mold sets are recirculatingly moved through the system for repeated usage.

Abstract: A method and apparatus for cold runner transfer molding. Insulating and/or cooling means are provided so that the mold runnerblock is kept sufficiently cool to prevent curing of the plastic molding compound therein. By the addition of a plunger near the gate of the mold, a quasi-continuous molding operation may be effected. Local preheating of the molding material at the gate locale may be used to liquefy a feedstock which has travelled through the cold-runners in powdered form.

Abstract: An automatic continuously cycleable molding system wherein a plurality of mold sets are transported in predetermined timed cycles through a series of work stations wherein the various molding, curing and workpiece handling operations are accomplished, and wherein the mold sets are recirculatingly moved through the system for repeated usage.

Abstract: An apparatus and method for handling a workpiece includes the combination of a first workpiece position for checking the presence of a workpiece and a second subsequent position for checking the orientation of a workpiece. An orientation device adjacent the orientation checking position orients the workpiece to a proper position for subsequent transportation to a third workpiece position such that acceptable workpieces may be segregatably removed to a subsequent handling location.

Abstract: An automatic continuously cycleable molding system wherein a plurality of mold sets are transported in predetermined timed cycles through a series of work stations wherein the various molding, curing and workpiece handling operations are accomplished, and wherein the mold sets are recirculatingly moved through the system for repeated usage.

Abstract: Apparatus is provided for bending one or two complete rows of leads on a dual-in-line semiconductor package at one time without damaging the leads. The leads of the dual-in-line package are initially in their manufactured position, extending horizontally from the sides of the package and generally parallel to the top and bottom surface thereof. A support anvil is placed under the portion of the lead which is sealed in the semiconductor package, and a punch or bending member is disposed immediately adjacent the outside edge of the handle for performing the actual bending. A sheet of relatively thin metal is formed into a U-shaped channel and the bending member inserted therein before lowering so that as the bending member is lowered, no portion thereof touches the surface of the leads being bent. The sheet of thin metal buffers the bending operation and is interposed between the bottom and side of the bending member and the face of the leads for preventing scratching or damage thereto.

Abstract: A method and apparatus for cleaning at least selected surfaces of a mold apparatus to remove plastic residue and surface contaminates and impurities to enable the molds to be used in a continuous in-line type process for encapsulating lead frame assemblies or similar semi-conductor circuits. After the molds are separated and the large pieces of excess plastic are broken away, they are transported to a vacuum chamber and electrically coupled as, or at least proximate, the cathode. The vacuum chamber is evacuated and an inert ionizable gas such as argon is admitted. An electrical field is established between the anode and cathode to create a plasma or glow discharge causing the gas to ionize. The positive ions are accelerated by the electrical field toward the cathode and bombard at least selected areas of the mold portion to be cleaned for removing surface contaminates and producing an extremely clean surface to enable the mold portion to be used again and again in a continuous cyclical or in-line process.