Abstract: Optical fiber array apparatus comprising housing front mask having a matrix of fiber seating openings each opening having one or more side walls. An optical fiber extends through each opening and means presses the fiber side surface into engagement with the one or more side walls to precisely position and secure the fiber. Bonding material then fills all voids in and around the opeining. In one embodiment, a clamping wafer behind the front mask moves to clamp the fibers to the front mask opening walls. In another, the front mask defines flexing arms with distal ends that clamp fibers to opening walls and in yet another elongated flexible members lie along front mask slots to clamp fibers in openings that communicate into the slots.

Abstract: A high density optical fiber array assembly and assembly method includes a housing securing a front array mask etched with extreme precision to define openings arranged in a predetermined pattern. A series of guide plates form a series of fiber guide channels that align with the mask openings, which plates are stacked within the housing so that the bottom of one acts as a cover for the channels of another. Fibers can be tool inserted along the channels as one group, such as a row of fibers, or manually inserted and advanced sequentially. Alternately, the mask and guide plate stack are mounted to and within a mounting block and the mounting block assembly inserted into the assembly housing substantially all remaining voids in the housing are filled with bonding material.

Abstract: A system of making high density optical fiber arrays that includes securing the optical fiber ends in the housing front mask openings, then lapping the fiber ends and front mask forward surface to angle the fiber end front surfaces so that reflected wave energy does not interfere with optical signal data when transmitted during use. The opening pattern is preferably 2×2 to 128×128 or higher. Several alternate lap tool designs are disclosed including translational and rotating laps formed from solid bodies or a series of stacked plates. Standard slurry grinding and polishing compounds can be applied as desired. If a layer of epoxy originally covers the mask front face, it is removed by the lap tool as the fiber ends are lapped.

Abstract: A high density optical fiber array assembly and assembly method includes a housing securing a front array mask etched with extreme precision to define openings arranged in a predetermined pattern. A series of guide plates form a series of fiber guide channels that align with the mask openings, which plates are stacked within the housing so that the bottom of one acts as a cover for the channels of another. Fibers can be tool inserted along the channels as one group, such as a row of fibers, or manually inserted and advanced sequentially. Alternately, the mask and guide plate stack are mounted to and within a mounting block and the mounting block assembly inserted into the assembly housing substantially all remaining voids in the housing are filled with bonding material.

Abstract: A high density optical fiber array assembly and assembly method includes a housing securing a front array mask etched with extreme precision to define openings arranged in a predetermined pattern. A series of guide plates form a series of fiber guide channels that align with the mask openings, which plates are stacked within the housing so that the bottom of one acts as a cover for the channels of another. Fibers can be tool inserted along the channels as one group, such as a row of fibers, or manually inserted and advanced sequentially. Alternately, the mask and guide plate stack are mounted to and within a mounting block and the mounting block assembly inserted into the assembly housing substantially all remaining voids in the housing are filled with bonding material.

Abstract: A system of making high density optical fiber arrays that includes securing the optical fiber ends in the housing front mask openings, then lapping the fiber ends and front mask forward surface to angle the fiber end front surfaces so that reflected wave energy does not interfere with optical signal data when transmitted during use. The opening pattern is preferably 2×2 to 128×128 or higher. Several alternate lap tool designs are disclosed including translational and rotating laps formed from solid bodies or a series of stacked plates. Standard slurry grinding and polishing compounds can be applied as desired. If a layer of epoxy originally covers the mask front face, it is removed by the lap tool as the fiber ends are lapped.

Abstract: An optical fiber array connector in which the tolerance of the diameter of the mask openings are not factors in the overall positioning of the plurality of fibers. The array includes a mask element with rear and forward surfaces and a plurality of openings that communicate through these surfaces. A plurality of optical fibers include fiber ends having substantially truncated conical side surfaces that extend through the openings and engage the portions of the mask openings nearest the mask rear surface. A method includes preparing the fibers to form a conical surface at their distal ends, preparing the openings in the primary mask each with a diameter less than the diameter of the fiber cladding or second layer, inserting the conical fiber ends until the conical surfaces engage the mask opening walls, applying bonding material to the mask forward surface and exposed tips, grinding and polishing the exposed tips and bonding material surface to truncate the cones and expose the fiber core diameters.

Abstract: Solar resistant fused silica optical fiber is made by heating the starter rod, drawing the fiber, and preferably immediately diffusing hydrogen into the fiber, then promptly covering the hydrogen diffused fiber with hermetic coating to trap the hydrogen within the fiber. The presence of hydrogen in the fiber neutralizes UV radiation induced defects and because the hydrogen can only migrate through the fiber ends, the life of the solar resistant fiber for transmission wavelengths is increased by several years over conventional solar resistant fiber.

Abstract: The area of a surface-emitting LED is reduced, and hence the number of LEDs which can be obtained from a single wafer is increased, by a chip design in which the light-emitting spot is positioned asymmetrically toward one corner of the chip. Preferably, an L-shaped contact is formed on the light output surface so that light-emitting spot emerges from between the legs of the L.

Abstract: Proposed is a method of fabricating III-V and II-VI compound semiconductors and a resulting product where there is formed on the surface a coating which can function as a diffusion mask and/or a passivation layer. The coating is a silicon layer deposited by a method which does not damage the semiconductor surface.

Abstract: Presented is a dual wavelength structure wherein two edge-emitting devices are bonded with p-regions adjacent. The bonding medium is a conductive compound that forms a common electrode between the devices. Each device is separately addressable. Efficient coupling of emitted light into a single fiber is accomplished by restricting the vertical and horizontal separation of the light emitting stripes.

Abstract: Electrical contacts with low specific-contact resistance to In-based Group III-V compound semiconductors (e.g., p-InGaAsP) are formed by electron beam depositing a thin Pt layer directly on the semiconductor and sintering at about 450.degree.-525.degree. C. for about 5-30 minutes. Light emitting diodes without dark spot defects can be fabricated using this technique.

Abstract: Disclosed is an indium-containing semiconductor device which includes an ohmic contact formed by application of successive layers of Au-Sn-Cr-Au. The combination of Sn and Cr layers provides an effective barrier to the diffusion of indium to the surface of the contact so that bonding to the contact is not impeded.

Abstract: A process is described for doping compound semiconductors using a metal fluoride (e.g., ZnF.sub.2) as the source of dopant. The anhydrous metal fluoride is put down on the surface of the compound semiconductor, capped with a suitable encapsulant and heat treated to promote the diffusion. The heat treatment can be carried out in air without danger of surface damage to the compound semiconductor. Also, the diffusion is better controlled as to depth of diffusion and boundary delineation.

Abstract: A process is described for fabricating various optical devices including photodiodes in which a protective dielectric layer is put down on the surface of the device prior to heating to temperatures over about 250-300 degrees C. Such devices have excellent performance characteristics including low dark current and low noise figures.

Abstract: A fabrication technique is described for making various devices in which a type of glass is used as a surface protection layer. The glass layers are put down by particle bombardment (generally sputtering) of a borosilicate glass target. Devices with such surface layers are also described. Such glass layers are highly advantageous as encapsulating material, diffusion barrier layers, etc., particularly for optical type devices and certain semiconductor devices. Particularly important is the preparation procedure for the glass target used in the bombardment process. The glass layers are moisture stable, act as excellent barriers against diffusion, and are usable up to quite high temperatures without cracking or peeling. The glass layers also provide long-term protection against atmosphere components including water vapor, oxygen, atmosphere pollution contaminants, etc.

Abstract: Display devices are described which contain organic quinones or diones as active material. These devices exhibit high optical contrast, pleasing and striking colors and unusually low power consumption. Particularly advantageous is the fact that these display devices may exhibit non-linear behavior (sharp thresholds) which permit multiplexing. This is highly advantageous in display device applications.

Abstract: A process for hermetically sealing an optical fiber to a metal housing is described. An optical fiber 12 is threaded through a thick-walled metal tube 10 which has a bore 11 of slightly larger diameter than the fiber. The tube and fiber are inserted in a pneumatically operated collet and uniform radial pressure is applied to the tube to form a unitary hermetic assembly. Metal tube 10 is characterized in that it has or, prior to forming the assembly, is annealed to have a Rockwell hardness of less that 15 T 15. At this value the metal is soft and the pressure required to cause the metal to cold flow around the fiber is less than that required to break the fiber. The tube is then soldered or otherwise secured in a hole in the housing, thus completing the hermetic seal. Such a seal is useful in hermetic packaging of optical devices. It is advantageous over the prior art for its simplicity and inexpensiveness. The technique is suited to high yield mass production of reliable seals.

Abstract: An electrodeposition display device is described which uses an electrolyte containing silver species and certain anion species including iodide and bromide. The electrolyte also contains an opacifier made up of solid semiconductor substance and solid insulator substance. Such display devices have high contrast, large viewing angle and a pleasing variety of colors including blue, red and brown.

Abstract: An electrodeposition display device is described which uses an electrolyte containing silver species and certain anion species including iodide bromide or chloride. The electrolyte also contains a substituted ammonium halide such as tetrabutyl ammonium iodide. Such display devices have high contrast, large viewing angle and rapid redissolution of the display.