Patents by Inventor Irfan Jamil
Irfan Jamil has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230205196Abstract: A method includes identifying sets of sensor data associated with wafers processed via wafer processing equipment and identifying sets of metrology data associated with the wafers processed via the wafer processing equipment. The method further includes generating sets of aggregated sensor-metrology data, each of the sets of aggregated sensor-metrology data including a respective set of sensor data and a respective set of metrology data. The method further includes causing, based on the sets of aggregated sensor-metrology data, performance of a corrective action associated with the wafer processing equipment.Type: ApplicationFiled: February 27, 2023Publication date: June 29, 2023Inventors: Sidharth Bhatia, Garrett H. Sin, Heng-Cheng Pai, Pramod Nambiar, Ganesh Balasubramanian, Irfan Jamil
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Patent number: 11592812Abstract: Methods, systems, and non-transitory computer readable medium are described for sensor metrology data integration. A method includes receiving sets of sensor data and sets of metrology data. Each set of sensor data includes corresponding sensor values associated with producing corresponding product by manufacturing equipment and a corresponding sensor data identifier. Each set of metrology data includes corresponding metrology values associated with the corresponding product manufactured by the manufacturing equipment and a corresponding metrology data identifier. The method further includes determining common portions between each corresponding sensor data identifier and each corresponding metrology data identifier. The method further includes, for each of the sensor-metrology matches, generating a corresponding set of aggregated sensor-metrology data and storing the sets of aggregated sensor-metrology data to train a machine learning model.Type: GrantFiled: February 14, 2020Date of Patent: February 28, 2023Assignee: Applied Materials, Inc.Inventors: Sidharth Bhatia, Garrett H. Sin, Heng-Cheng Pai, Pramod Nambiar, Ganesh Balasubramanian, Irfan Jamil
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Patent number: 11541024Abstract: The present invention relates to a composition for injectable formulation, the composition comprising: —An aqueous solution of ibuprofen and arginine with a molar ratio of ibuprofen:arginine comprised between 1:1.1 and 1:2.1; —An aqueous solution of a diuretic compound comprising between 3.9% and 4.35% w/v of the diuretic compound. The present invention also concerns a pharmaceutical composition comprising said composition and the use of said composition and said pharmaceutical composition.Type: GrantFiled: July 27, 2017Date of Patent: January 3, 2023Assignee: AMBAH IP LIMITEDInventor: Irfan Jamil
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Publication number: 20200328066Abstract: A system and method for forming a film includes generating a plasma in a processing volume of a processing chamber to form the film on a substrate. The processing chamber may include a gas distributor configured to generate the plasma in the processing volume. Further, a barrier gas is provided into the processing volume to form a gas curtain around a plasma located in the processing volume. The barrier gas is supplied by a gas supply source through an inlet port disposed along a first side of the processing chamber. Further, an exhaust port is disposed along the first side of the processing chamber and the plasma and the barrier gas is purged via the exhaust port.Type: ApplicationFiled: March 25, 2020Publication date: October 15, 2020Inventors: Byung Seok KWON, Dong Hyung LEE, Prashant Kumar KULSHRESHTHA, Kwangduk Douglas LEE, Ratsamee LIMDULPAIBOON, Irfan JAMIL, Pyeong Youn ROH, Jun MA, Amit Kumar BANSAL, Tuan Anh NGUYEN, Juan Carlos ROCHA-ALVAREZ
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Publication number: 20200264335Abstract: Methods, systems, and non-transitory computer readable medium are described for sensor metrology data integration. A method includes receiving sets of sensor data and sets of metrology data. Each set of sensor data includes corresponding sensor values associated with producing corresponding product by manufacturing equipment and a corresponding sensor data identifier. Each set of metrology data includes corresponding metrology values associated with the corresponding product manufactured by the manufacturing equipment and a corresponding metrology data identifier. The method further includes determining common portions between each corresponding sensor data identifier and each corresponding metrology data identifier. The method further includes, for each of the sensor-metrology matches, generating a corresponding set of aggregated sensor-metrology data and storing the sets of aggregated sensor-metrology data to train a machine learning model.Type: ApplicationFiled: February 14, 2020Publication date: August 20, 2020Inventors: Sidharth Bhatia, Garrett H. Sin, Heng-Cheng Pai, Pramod Nambiar, Ganesh Balasubramanian, Irfan Jamil
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Patent number: 10510518Abstract: Embodiments of the invention generally relate to methods of dry stripping boron-carbon films. In one embodiment, alternating plasmas of hydrogen and oxygen are used to remove a boron-carbon film. In another embodiment, co-flowed oxygen and hydrogen plasma is used to remove a boron-carbon containing film. A nitrous oxide plasma may be used in addition to or as an alternative to either of the above oxygen plasmas. In another embodiment, a plasma generated from water vapor is used to remove a boron-carbon film. The boron-carbon removal processes may also include an optional polymer removal process prior to removal of the boron-carbon films. The polymer removal process includes exposing the boron-carbon film to NF3 to remove from the surface of the boron-carbon film any carbon-based polymers generated during a substrate etching process.Type: GrantFiled: November 6, 2015Date of Patent: December 17, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Kwangduk Douglas Lee, Sudha Rathi, Ramprakash Sankarakrishnan, Martin Jay Seamons, Irfan Jamil, Bok Hoen Kim
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Publication number: 20190183823Abstract: The present invention relates to a composition for injectable formulation, the composition comprising:- An aqueous solution of ibuprofen and arginine with a molar ratio of ibuprofen:arginine comprised between 1:1.1 and 1:2.1;- An aqueous solution of a diuretic compound comprising between 3.9% and 4.35% w/v of the diuretic compound. The present invention also concerns a pharmaceutical composition comprising said composition and the use of said composition and said pharmaceutical composition.Type: ApplicationFiled: July 27, 2017Publication date: June 20, 2019Inventor: Irfan Jamil
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Publication number: 20160133443Abstract: Embodiments of the invention generally relate to methods of dry stripping boron-carbon films. In one embodiment, alternating plasmas of hydrogen and oxygen are used to remove a boron-carbon film. In another embodiment, co-flowed oxygen and hydrogen plasma is used to remove a boron-carbon containing film. A nitrous oxide plasma may be used in addition to or as an alternative to either of the above oxygen plasmas. In another embodiment, a plasma generated from water vapor is used to remove a boron-carbon film. The boron-carbon removal processes may also include an optional polymer removal process prior to removal of the boron-carbon films. The polymer removal process includes exposing the boron-carbon film to NF3 to remove from the surface of the boron-carbon film any carbon-based polymers generated during a substrate etching process.Type: ApplicationFiled: January 19, 2016Publication date: May 12, 2016Inventors: Kwangduk Douglas LEE, Sudha RATHI, Ramprakash SANKARAKRISHNAN, Martin Jay SEAMONS, Irfan JAMIL, Bok Hoen KIM
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Patent number: 9299581Abstract: Embodiments of the invention generally relate to methods of dry stripping boron-carbon films. In one embodiment, alternating plasmas of hydrogen and oxygen are used to remove a boron-carbon film. In another embodiment, co-flowed oxygen and hydrogen plasma is used to remove a boron-carbon containing film. A nitrous oxide plasma may be used in addition to or as an alternative to either of the above oxygen plasmas. In another embodiment, a plasma generated from water vapor is used to remove a boron-carbon film. The boron-carbon removal processes may also include an optional polymer removal process prior to removal of the boron-carbon films. The polymer removal process includes exposing the boron-carbon film to NF3 to remove from the surface of the boron-carbon film any carbon-based polymers generated during a substrate etching process.Type: GrantFiled: April 26, 2012Date of Patent: March 29, 2016Assignee: Applied Materials, Inc.Inventors: Kwangduk Douglas Lee, Sudha Rathi, Ramprakash Sankarakrishnan, Martin Jay Seamons, Irfan Jamil, Bok Hoen Kim
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Publication number: 20160064209Abstract: Embodiments of the invention generally relate to methods of dry stripping boron-carbon films. In one embodiment, alternating plasmas of hydrogen and oxygen are used to remove a boron-carbon film. In another embodiment, co-flowed oxygen and hydrogen plasma is used to remove a boron-carbon containing film. A nitrous oxide plasma may be used in addition to or as an alternative to either of the above oxygen plasmas. In another embodiment, a plasma generated from water vapor is used to remove a boron-carbon film. The boron-carbon removal processes may also include an optional polymer removal process prior to removal of the boron-carbon films. The polymer removal process includes exposing the boron-carbon film to NF3 to remove from the surface of the boron-carbon film any carbon-based polymers generated during a substrate etching process.Type: ApplicationFiled: November 6, 2015Publication date: March 3, 2016Inventors: Kwangduk Douglas LEE, Sudha RATHI, Ramprakash SANKARAKRISHNAN, Martin Jay SEAMONS, Irfan JAMIL, Bok Hoen KIM
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Publication number: 20140216498Abstract: Embodiments of the invention generally relate to methods of dry stripping boron-carbon films. In one embodiment, alternating plasmas of hydrogen and oxygen are used to remove a boron-carbon film. In another embodiment, co-flowed oxygen and hydrogen plasma is used to remove a boron-carbon containing film. A nitrous oxide plasma may be used in addition to or as an alternative to either of the above oxygen plasmas. In another embodiment, a plasma generated from water vapor is used to remove a boron-carbon film. The boron-carbon removal processes may also include an optional polymer removal process prior to removal of the boron-carbon films. The polymer removal process includes exposing the boron-carbon film to NF3 to remove from the surface of the boron-carbon film any carbon-based polymers generated during a substrate etching process.Type: ApplicationFiled: February 6, 2013Publication date: August 7, 2014Inventors: Kwangduk Douglas LEE, Sudha RATHI, Ramprakash SANKARAKRISHNAN, Martin Jay SEAMONS, Irfan JAMIL, Bok Hoen KIM
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Publication number: 20120285492Abstract: Embodiments of the invention generally relate to methods of dry stripping boron-carbon films. In one embodiment, alternating plasmas of hydrogen and oxygen are used to remove a boron-carbon film. In another embodiment, co-flowed oxygen and hydrogen plasma is used to remove a boron-carbon containing film. A nitrous oxide plasma may be used in addition to or as an alternative to either of the above oxygen plasmas. In another embodiment, a plasma generated from water vapor is used to remove a boron-carbon film. The boron-carbon removal processes may also include an optional polymer removal process prior to removal of the boron-carbon films. The polymer removal process includes exposing the boron-carbon film to NF3 to remove from the surface of the boron-carbon film any carbon-based polymers generated during a substrate etching process.Type: ApplicationFiled: April 26, 2012Publication date: November 15, 2012Applicant: Applied Materials, Inc.Inventors: Kwangduk Douglas Lee, Sudha Rathi, Ramprakash Sankarakrishnan, Martin Jay Seamons, Irfan Jamil, Bok Hoen Kim