Patents by Inventor Irina Daynov

Irina Daynov has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low current fuse
    Patent number: 9847203
    Abstract: A multi layer fuse device includes a substrate and an elongated fuse element, having a pair of contact pads formed therewith at opposed longitudinal ends thereof formed on one surface of the substrate. A pair of passivation layers are provided covering the fuse and contact pads. Windows may be opened through both passivation layers above both of the contact pads, and conductive electrode material is electroplated through the windows to contact the contact pads and to extend partially above a top surface of the passivation layers. Exposed electroplated material may be coated with solderable conductive material or a surface mount termination may be provided. Electroplated material may cover a portion of the fuse surface prior to application of the passivation layers and extend to an end of the substrate so that windows are not required.
    Type: Grant
    Filed: October 11, 2011
    Date of Patent: December 19, 2017
    Assignee: AVX Corporation
    Inventors: Alona Goldstein, Irina Daynov, Herzl Ovadia, Elinor O'Neill, Michael Dakhyia, Evgeny Glickman
  • LOW CURRENT FUSE
    Publication number: 20120092123
    Abstract: A multi layer fuse device includes a substrate and an elongated fuse element, having a pair of contact pads formed therewith at opposed longitudinal ends thereof formed on one surface of the substrate. A pair of passivation layers are provided covering the fuse and contact pads. Windows may be opened through both passivation layers above both of the contact pads, and conductive electrode material is electroplated through the windows to contact the contact pads and to extend partially above a top surface of the passivation layers. Exposed electroplated material may be coated with solderable conductive material or a surface mount termination may be provided. Electroplated material may cover a portion of the fuse surface prior to application of the passivation layers and extend to an end of the substrate so that windows are not required.
    Type: Application
    Filed: October 11, 2011
    Publication date: April 19, 2012
    Applicant: AVX CORPORATION
    Inventors: Alona Goldstein, Irina Daynov, Herzl Ovadia, Elinor O'Neill, Michael Dakhyia
  • High voltage, laminated thin film surface mount fuse and manufacturing method therefor
    Patent number: 5296833
    Abstract: A surface mount fuse device comprising an alumina-glass-fuse-glass-alumina laminated structure provides high voltage ratings and superior mechanical and thermal properties.
    Type: Grant
    Filed: April 16, 1993
    Date of Patent: March 22, 1994
    Assignee: AVX Corporation
    Inventors: Barry N. Breen, Michael Dakhiya, Irina Daynov