Patents by Inventor Irina LYULINA
Irina LYULINA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11940740Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.Type: GrantFiled: June 9, 2022Date of Patent: March 26, 2024Assignee: ASML NETHERLANDS B.V.Inventors: Alexander Ypma, Jasper Menger, David Deckers, David Han, Adrianus Cornelis Matheus Koopman, Irina Lyulina, Scott Anderson Middlebrooks, Richard Johannes Franciscus Van Haren, Jochem Sebastiaan Wildenberg
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Publication number: 20240019788Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.Type: ApplicationFiled: August 10, 2023Publication date: January 18, 2024Applicant: ASML Netherlands B.V.Inventors: Alexander Ypma, Jasper Menger, David Deckers, David Han, Adrianus Cornelis Matheus Koopman, Irina Lyulina, Scott Anderson Middlebrooks, Richard Johannes Franciscus Van Haren, Jochem Sebastiaan Wildenberg
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Publication number: 20220326623Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.Type: ApplicationFiled: June 9, 2022Publication date: October 13, 2022Applicant: ASML Netherlands B.V.Inventors: Alexander YPMA, Jasper MENGER, David DECKERS, David HAN, Adrianus Cornelis Matheus KOOPMAN, Irina LYULINA, Scott Anderson MIDDLEBROOKS, Richard Johannes Franciscus VAN HAREN, Jochem Sebastiaan WILDENBERG
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Patent number: 11385550Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.Type: GrantFiled: May 1, 2020Date of Patent: July 12, 2022Assignee: ASML Netherlands B.V.Inventors: Alexander Ypma, Jasper Menger, David Deckers, David Han, Adrianus Cornelis Matheus Koopman, Irina Lyulina, Scott Anderson Middlebrooks, Richard Johannes Franciscus Van Haren, Jochem Sebastiaan Wildenberg
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Publication number: 20200264520Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.Type: ApplicationFiled: May 1, 2020Publication date: August 20, 2020Applicant: ASML Netherlands B.VInventors: Alexander YPMA, Jasper MENGER, David DECKERS, David HAN, Adrianus Cornelis Matheus KOOPMAN, Irina LYULINA, Scott Anderson MIDDLEBROOKS, Richard Johannes Franciscu VAN HAREN, Jochem Sebastiaan WILDENBERG
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Patent number: 10642162Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.Type: GrantFiled: March 13, 2019Date of Patent: May 5, 2020Assignee: ASML Netherlands B.V.Inventors: Alexander Ypma, Jasper Menger, David Deckers, David Han, Adrianus Cornelis Matheus Koopman, Irina Lyulina, Scott Anderson Middlebrooks, Richard Johannes Franciscus Van Haren, Jochem Sebastiaan Wildenberg
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Publication number: 20190278188Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.Type: ApplicationFiled: March 13, 2019Publication date: September 12, 2019Applicant: ASML Netherlands B.V.Inventors: Alexander YPMA, Jasper MENGER, David DECKERS, David HAN, Adrianus Cornelis Matheus KOOPMAN, Irina LYULINA, Scott Anderson MIDDLEBROOKS, Richard Johannes Franciscus VAN HAREN, Jochem Sebastiaan WILDENBERG
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Patent number: 10274834Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in said multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.Type: GrantFiled: March 8, 2018Date of Patent: April 30, 2019Assignee: ASML Netherlands B.V.Inventors: Alexander Ypma, Jasper Menger, David Deckers, David Han, Adrianus Cornelis Matheus Koopman, Irina Lyulina, Scott Anderson Middlebrooks, Richard Johannes Franciscus Van Haren, Jochem Sebastiaan Wildenberg
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Publication number: 20180253015Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in said multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.Type: ApplicationFiled: March 8, 2018Publication date: September 6, 2018Applicant: ASML Netherlands B.V.Inventors: Alexander Ypma, Jasper Menger, David Deckers, David Han, Adrianus Cornelis Matheus Koopman, Irina Lyulina, Scott Anderson Middlebrooks, Richard Johannes Franciscus Van Haren, Jochem Sebastiaan Wildenberg
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Patent number: 9946165Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in said multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.Type: GrantFiled: September 5, 2014Date of Patent: April 17, 2018Assignee: ASML NETHERLANDS B.V.Inventors: Alexander Ypma, Jasper Menger, David Deckers, David Han, Adrianus Cornelis Matheus Koopman, Irina Lyulina, Scott Anderson Middlebrooks, Richard Johannes Franciscus Van Haren, Jochem Sebastiaan Wildenberg
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Patent number: 9753377Abstract: A deformation pattern recognition method including providing one or more deformation patterns, each deformation pattern being associated with a deformation of a substrate that may be caused by a processing device; transferring a first pattern to a substrate, the first pattern including at least N alignment marks, wherein each alignment mark is positioned at a respective predefined nominal position; processing the substrate; measuring a position of N alignment marks and determining an alignment mark displacement for the N alignment marks by comparing the respective nominal position with the respective measured position; fitting at least one deformation pattern to the measured alignment mark displacements; determining an accuracy value for each fitted deformation pattern, the accuracy value being representative of the accuracy of the corresponding fit; using the determined accuracy value, determining whether an associated deformation pattern is present.Type: GrantFiled: June 27, 2013Date of Patent: September 5, 2017Assignee: ASML NETHERLANDS B.V.Inventors: Hakki Ergun Cekli, Irina Lyulina, Manfred Gawein Tenner, Richard Johannes Franciscus Van Haren, Stefan Cornelis Theodorus Van Der Sanden
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Patent number: 9454084Abstract: A method to determine the usefulness of an alignment mark of a first pattern in transferring a second pattern to a substrate relative to the first pattern already present on the substrate includes measuring the position of the alignment mark, modeling the position of the alignment mark, determining the model error between measured and modeled position, measuring a corresponding overlay error between first and second pattern and comparing the model error with the overlay error to determine the usefulness of the alignment mark. Subsequently this information can be used when processing next substrates thereby improving the overlay for these substrates. A lithographic apparatus and/or overlay measurement system may be operated in accordance with the method.Type: GrantFiled: April 23, 2013Date of Patent: September 27, 2016Assignee: ASML NETHERLANDS B.V.Inventors: Irina Lyulina, Franciscus Godefridus Casper Bijnen, Remi Daniel Marie Edart, Antoine Gaston Marie Kiers, Michael Kubis
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Publication number: 20160246185Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in said multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.Type: ApplicationFiled: September 5, 2014Publication date: August 25, 2016Applicant: ASML Netherlands B.V.Inventors: Alexander Ypma, Jasper Menger, David Deckers, David Han, Adrianus Cornelis Matheus Koopman, Irina Lyulina, Scott Anderson Middlebrooks, Richard Johannes Franciscus Van Haren, Jochem Sebastiaan Wildenberg
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Patent number: 9291916Abstract: A substrate is loaded onto a substrate support of a lithographic apparatus, after which the apparatus measures locations of substrate alignment marks. These measurements define first correction information allowing the apparatus to apply a pattern at one or more desired locations on the substrate. Additional second correction information is used to enhance accuracy of pattern positioning, in particular to correct higher order distortions of a nominal alignment grid. The second correction information may be based on measurements of locations of alignment marks made when applying a previous pattern to the same substrate. The second correction information may alternatively or in addition be based on measurements made on similar substrates that have been patterned prior to the current substrate.Type: GrantFiled: February 4, 2015Date of Patent: March 22, 2016Assignee: ASML Netherlands B.V.Inventors: Stefan Cornelis Theodorus Van Der Sanden, Richard Johannes Franciscus Van Haren, Hubertus Johannes Gertrudus Simons, Remi Daniel Marie Edart, Xiuhong Wei, Irina Lyulina, Michael Kubis
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Publication number: 20150205213Abstract: A deformation pattern recognition method including providing one or more deformation patterns, each deformation pattern being associated with a deformation of a substrate that may be caused by a processing device; transferring a first pattern to a substrate, the first pattern including at least N alignment marks, wherein each alignment mark is positioned at a respective predefined nominal position; processing the substrate; measuring a position of N alignment marks and determining an alignment mark displacement for the N alignment marks by comparing the respective nominal position with the respective measured position; fitting at least one deformation pattern to the measured alignment mark displacements; determining an accuracy value for each fitted deformation pattern, the accuracy value being representative of the accuracy of the corresponding fit; using the determined accuracy value, determining whether an associated deformation pattern is present.Type: ApplicationFiled: June 27, 2013Publication date: July 23, 2015Applicant: ASML Netherlands B.V.Inventors: Hakki Ergun Cekli, Irina Lyulina, Manfred Gawein Tenner, Richard Johannes Franciscus Van Haren, Stefan Cornelis Theodorus Van Der Sanden
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Publication number: 20150153656Abstract: A substrate is loaded onto a substrate support of a lithographic apparatus, after which the apparatus measures locations of substrate alignment marks. These measurements define first correction information allowing the apparatus to apply a pattern at one or more desired locations on the substrate. Additional second correction information is used to enhance accuracy of pattern positioning, in particular to correct higher order distortions of a nominal alignment grid. The second correction information may be based on measurements of locations of alignment marks made when applying a previous pattern to the same substrate. The second correction information may alternatively or in addition be based on measurements made on similar substrates that have been patterned prior to the current substrate.Type: ApplicationFiled: February 4, 2015Publication date: June 4, 2015Applicant: ASML Netherlands B.V.Inventors: Stefan Cornelis Theodorus VAN DER SANDEN, Richard Johanne Franciscus VAN HAREN, Hubertus Johannes Gertrudus SIMONS, Remi Daniel Marie EDART, Xiuhong WEI, Irina LYULINA, Michael KUBIS
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Publication number: 20150146188Abstract: A method to determine the usefulness of an alignment mark of a first pattern in transferring a second pattern to a substrate relative to the first pattern already present on the substrate includes measuring the position of the alignment mark, modeling the position of the alignment mark, determining the model error between measured and modeled position, measuring a corresponding overlay error between first and second pattern and comparing the model error with the overlay error to determine the usefulness of the alignment mark. Subsequently this information can be used when processing next substrates thereby improving the overlay for these substrates. A lithographic apparatus and/or overlay measurement system may be operated in accordance with the method.Type: ApplicationFiled: April 23, 2013Publication date: May 28, 2015Inventors: Irina Lyulina, Franciscus Godefridus Casper Bijnen, Remi Daniel Marie Edart, Antoine Gaston Marie Kiers, Michael Kubis
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Patent number: 8982347Abstract: A method is used to estimate a value representative for a level of alignment mark deformation on a processed substrate using an alignment system. The alignment sensor system is able to emit light at different measuring frequencies to reflect from an alignment mark on the substrate and to detect a diffraction pattern in the reflected light in order to measure an alignment position of the alignment mark. The two or more measuring frequencies are used to measure an alignment position deviation per alignment mark associated with each of the two or more measuring frequencies relative to an expected predetermined alignment position of the alignment mark. A value is determined representative for the spread in the determined alignment position deviations per alignment mark in order to estimate the level of alignment mark deformation.Type: GrantFiled: November 2, 2012Date of Patent: March 17, 2015Assignee: ASML Netherlands B.V.Inventors: Xiuhong Wei, Franciscus Godefridus Casper Bijnen, Richard Johannes Franciscus Van Haren, Marcus Adrianus Van De Kerkhof, Everhardus Cornelis Mos, Hubertus Johannes Gertrudus Simons, Remi Daniel Marie Edart, David Deckers, Nicole Schoumans, Irina Lyulina
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Patent number: 8976355Abstract: A substrate is loaded onto a substrate support of a lithographic apparatus, after which the apparatus measures locations of substrate alignment marks. These measurements define first correction information allowing the apparatus to apply a pattern at one or more desired locations on the substrate. Additional second correction information is used to enhance accuracy of pattern positioning, in particular to correct higher order distortions of a nominal alignment grid. The second correction information may be based on measurements of locations of alignment marks made when applying a previous pattern to the same substrate. The second correction information may alternatively or in addition be based on measurements made on similar substrates that have been patterned prior to the current substrate.Type: GrantFiled: August 29, 2012Date of Patent: March 10, 2015Assignee: ASML Netherlands B.V.Inventors: Stefan Cornelis Theodorus Van Der Sanden, Richard Johannes Franciscus Van Haren, Hubertus Johannes Gertrudus Simons, Remi Daniel Marie Edart, Xiuhong Wei, Michael Kubis, Irina Lyulina
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Publication number: 20130230797Abstract: A substrate is loaded onto a substrate support of a lithographic apparatus, after which the apparatus measures locations of substrate alignment marks. These measurements define first correction information allowing the apparatus to apply a pattern at one or more desired locations on the substrate. Additional second correction information is used to enhance accuracy of pattern positioning, in particular to correct higher order distortions of a nominal alignment grid. The second correction information may be based on measurements of locations of alignment marks made when applying a previous pattern to the same substrate. The second correction information may alternatively or in addition be based on measurements made on similar substrates that have been patterned prior to the current substrate.Type: ApplicationFiled: August 29, 2012Publication date: September 5, 2013Applicant: ASML Netherlands B.V.Inventors: Stefan Cornelis Theodorus VAN DER SANDEN, Richard Johannes Franciscu VAN HAREN, Hubertus Johannes Gertrudus SIMONS, Remi Daniel Marie EDART, Xiuhong WEI, Michael KUBIS, Irina LYULINA