Patents by Inventor Irina Poukhova

Irina Poukhova has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Selective removal of dielectric materials and plating process using same
    Patent number: 7332068
    Abstract: A metal is provided on a polymeric component and the component is subjected to a removal process such as plasma or liquid etching in the presence of an electric field. The etchant selectively attacks the polymer at the boundary between the metal and the polymer, thereby forming gaps alongside the metal. A cover metal may be plated onto the metal in the gaps. The cover metal protects the principal metal during subsequent etching procedures.
    Type: Grant
    Filed: May 28, 2004
    Date of Patent: February 19, 2008
    Assignee: Tessera, Inc.
    Inventors: Belgacem Haba, Irina Poukhova, Masud Beroz
  • Selective removal of dielectric materials and plating process using same
    Publication number: 20040217088
    Abstract: A metal is provided on a polymeric component and the component is subjected to a removal process such as plasma or liquid etching in the presence of an electric field. The etchant selectively attacks the polymer at the boundary between the metal and the polymer, thereby forming gaps alongside the metal. A cover metal may be plated onto the metal in the gaps. The cover metal protects the principal metal during subsequent etching procedures.
    Type: Application
    Filed: May 28, 2004
    Publication date: November 4, 2004
    Applicant: Tessera, Inc.
    Inventors: Belgacem Haba, Irina Poukhova, Masud Beroz
  • Selective removal of dielectric materials and plating process using same
    Patent number: 6758984
    Abstract: A metal is provided on a polymeric component and the component is subjected to a removal process such as plasma or liquid etching in the presence of an electric field. The etchant selectively attacks the polymer at the boundary between the metal and the polymer, thereby forming gaps alongside the metal. A cover metal may be plated onto the metal in the gaps. The cover metal protects the principal metal during subsequent etching procedures.
    Type: Grant
    Filed: September 4, 2001
    Date of Patent: July 6, 2004
    Assignee: Tessera, Inc.
    Inventors: Belgacem Haba, Irina Poukhova, Masud Beroz
  • Selective removal of dielectric materials and plating process using same
    Publication number: 20020011421
    Abstract: A metal is provided on a polymeric component and the component is subjected to a removal process such as plasma or liquid etching in the presence of an electric field. The etchant selectively attacks the polymer at the boundary between the metal and the polymer, thereby forming gaps alongside the metal. A cover metal may be plated onto the metal in the gaps. The cover metal protects the principal metal during subsequent etching procedures.
    Type: Application
    Filed: September 4, 2001
    Publication date: January 31, 2002
    Inventors: Belgacem Haba, Irina Poukhova, Masud Beroz
  • Selective removal of dielectric materials and plating process using same
    Patent number: 6334942
    Abstract: A metal is provided on a polymeric component and the component is subjected to a removal process such as plasma or liquid etching in the presence of an electric field. The etchant selectively attacks the polymer at the boundary between the metal and the polymer, thereby forming gaps alongside the metal. A cover metal may be plated onto the metal in the gaps. The cover metal protects the principal metal during subsequent etching procedures.
    Type: Grant
    Filed: February 9, 1999
    Date of Patent: January 1, 2002
    Assignee: Tessera, Inc.
    Inventors: Belgacem Haba, Irina Poukhova, Masud Beroz