Abstract: An information handling system includes a printed circuit board (PCB), a barrier frame, thermal potting material that fills the barrier frame, and a heat removing structure embedded into the thermal potting material. The barrier frame encloses a first device, and extends to also enclose a second location of the PCB. The thermal potting material surrounds the first device. The heat removing structure includes a first pad co-located with the first device, a second pad co-located with the second location, and a thermally conductive connection between the first pad and the second pad. The heat removing structure may remove heat generated by the first device to the second pad.

Abstract: An information handling system includes a printed circuit board (PCB), a barrier frame, thermal potting material that fills the barrier frame, and a heat removing structure embedded into the thermal potting material. The barrier frame encloses a first device, and extends to also enclose a second location of the PCB. The thermal potting material surrounds the first device. The heat removing structure includes a first pad co-located with the first device, a second pad co-located with the second location, and a thermally conductive connection between the first pad and the second pad. The heat removing structure may remove heat generated by the first device to the second pad.

Abstract: An information handling system includes a first device including a first heat generating region, a second device including a second heat generating region, and a cooling device. The cooling device has a first hot surface on a first side of the cooling device, a first cold surface on a second side of the cooling device, a second hot surface on the second side of the cooling device, and a second cold surface on the first side of the cooling device. The first heat generating region is thermally attached to the first hot surface. First heat from the first heat generating region is transmitted to the first cold surface. The second heat generating region is thermally attached to the second hot surface. Second heat from the second heat generating region is transmitted to the second cold surface.

Abstract: An expandable starch-based component is extruded through a random extruder together with a colored component having a color unlike that of said starch-based component. The starch-based component may include cereal grains such as rice or corn meal or components derived therefrom. The colored component may include colored starches such as blue corn meal; seeds; and/or micropellets made from fine particle ingredients. When combined, the components form a color-comprising mixture that can be extruded into colored or colorful collets. The color-comprising mixture comprises between about 2% to about 10% colored component. The produced bi-colored collets may then be cooked, optionally seasoned and packaged for consumption.

Abstract: The present invention generally relates to the production of direct expanded farinaceous food products without the use of a drying apparatus such as an oven and without the use of traditionally used sugar to eliminate such drying steps. A farinaceous material combined with a plasticizer component in the form of trehalose is extruded to form a direct expanded shelf-stable snack food product. Snack food products made with trehalose can be incorporated into an outer shell of a composite center-filled or co-extruded product.

Abstract: A heat dissipation system for use with a computer chip includes a heat sink with a fan mounted aslant to the lateral side thereof. The heat sink includes a base having a first surface and a second surface. The computer chip is positioned in contact with the first surface. A heat dissipation unit is mounted on the second surface of the base. The heat dissipation unit includes a plurality of heat dissipation fins. An air-conducting device has a shape of an inverted U and is used to cover the heat dissipation unit. A fan is mounted aslant to a lateral side of the heat dissipation unit. The heat dissipation unit includes a plurality of rectangular dissipation fins. The fins are mutually parallel and are collocated above the base. The heat dissipation unit includes a predetermined number of heat dissipation fins having a common inclination to form an accommodating area on the lateral side of the heat dissipation unit.

Abstract: A heat dissipation system for use with a computer chip includes a heat sink with a fan mounted aslant to the lateral side thereof. The heat sink includes a base having a first surface and a second surface. The computer chip is positioned in contact with the first surface. A heat dissipation unit is mounted on the second surface of the base. The heat dissipation unit includes a plurality of heat dissipation fins. An air-conducting device has a shape of an inverted U and is used to cover the heat dissipation unit. A fan is mounted aslant to a lateral side of the heat dissipation unit. The heat dissipation unit includes a plurality of rectangular dissipation fins. The fins are mutually parallel and are collocated above the base. The heat dissipation unit includes a predetermined number of heat dissipation fins having a common inclination to form an accommodating area on the lateral side of the heat dissipation unit.