Abstract: A semiconductor device, includes a housing; at least one semiconductor die which forms at least one semiconductor component, the semiconductor die being disposed within the housing; one or more first pins extending from the housing; and one or more bond wires electrically connecting the one or more first pins with the at least one semiconductor component. A heat slug is thermally coupled to the semiconductor die and at least partly disposed within the housing. One or more second pins extends from the housing and is connected to the heat slug. An electronics device includes a printed circuit board and the semiconductor device connected thereto.

Abstract: An electronics housing is provided. The electronics housing includes a first enclosure portion, a bending portion unitarily formed with the first enclosure portion, and a second enclosure portion unitarily formed with the bending portion. The bending portion is configured to be bent from an initial position to a final position. The first and second enclosure portions cooperate to define an internal cavity therebetween when the bending portion is in the final position. An engine control unit and a method of forming an engine control unit are also provided.