Abstract: A method for packaging an image sensor includes the steps of: providing a substrate having an upper surface and a lower surface; mounting a frame layer to the upper surface of the substrate to form a chamber together with the substrate; mounting a photosensitive chip to the upper surface of the substrate and within the chamber, and electrically connecting the photosensitive chip to the substrate; mounting a transparent layer to the frame layer with a B-stage adhesive applied therebetween; pre-baking the B-stage adhesive to slightly adhere the transparent layer to the frame layer; testing the image sensor to determine whether the image sensor is passed or failed; and post-baking the passed image sensor to completely cure the B-stage adhesive so that the transparent layer is firmly adhered to the frame layer.

Abstract: An image sensor module includes a substrate, a frame layer, a photosensitive chip, a transparent layer and a lens barrel. The substrate has a plurality of lead frame arranged in a matrix to form an upper surface, which is formed with a opening, and a lower surface, which is formed with a cavity penetrated from the opening. The frame layer is integrally formed with the substrate, and arranged at the periphery of the upper surface of the substrate to define a chamber together with the substrate, an internal thread being formed on the inner wall of the chamber. The photosensitive chip is mounted within the cavity of the substrate, and electrically coupled each of the lead frames in a flip chip manner. The transparent layer is covered onto the upper surface of the substrate to cover the opening.

Abstract: An image sensor module includes a substrate, a frame layer, a photosensitive chip, a transparent layer and a lens barrel. The substrate has a plurality of lead frame arranged in a matrix to form an upper surface, which is formed with a opening, and a lower surface, which is formed with a cavity penetrated from the opening. The frame layer is integrally formed with the substrate, and arranged at the periphery of the upper surface of the substrate to define a chamber together with the substrate, an internal thread being formed on the inner wall of the chamber. The photosensitive chip is mounted within the cavity of the substrate, and electrically coupled each of the lead frames in a flip chip manner. The transparent layer is covered onto the upper surface of the substrate to cover the opening.

Abstract: A package structure of an image sensor module for electrically connecting to a printed circuit board includes a transparent layer, an image sensing chip, a lens holder and a lens barrel. A plurality of signal input terminals and signal output terminals are formed on the transparent layer. The electrical circuits are formed on the image sensing chip, each of the electrical circuits is formed with bonding pads and is electrically connected to the transparent layer by way of flip chip bonding. A lens holder is formed with a through hole, an internal thread is formed on an inner wall of the through hole. The lens holder is mounted to the upper surface of the transparent layer. A lens barrel is arranged within the through hole of the lens holder and is formed with an external thread, which is screwed to the internal thread of the lens holder, the lens barrel is formed with a chamber and an opening communicating with the chamber.

Abstract: A method for packaging an image sensor includes the steps of: providing a substrate having an upper surface and a lower surface; mounting a frame layer to the upper surface of the substrate to form a chamber together with the substrate; mounting a photosensitive chip to the upper surface of the substrate and within the chamber, and electrically connecting the photosensitive chip to the substrate; mounting a transparent layer to the frame layer with a B-stage adhesive applied therebetween; pre-baking the B-stage adhesive to slightly adhere the transparent layer to the frame layer; testing the image sensor to determine whether the image sensor is passed or failed; and post-baking the passed image sensor to completely cure the B-stage adhesive so that the transparent layer is firmly adhered to the frame layer.