Abstract: Systems and methods for providing heat management solution. In one implementation, a heat spread or laminate is provided. The heat spreader or laminate includes a thermal expansion defining material such as Nickel-Iron alloy sheet or Molybdenum or Copper-Molybdenum alloy sheet or Copper-Tungsten alloy sheet or Copper-Graphite sheet or Graphite sheet with holes to contain high thermal conductive alloy such as Copper-Silver or Silver filler and high thermal conductive outer metal sheets such as Oxygen Free High Conductive copper. One of Oxygen Free High Conductive copper has corresponding hole patterns matched to the thermal expansion defining material sheets with holes. The thermal expansion layer with high thermal conductive filler is sandwiched between the high thermal conductive metal sheets.

Abstract: Systems and methods for providing a housing for an optical device. In one implementation, a frame for a device package is provided. The frame includes a rectangular sheet. The rectangular sheet includes an aperture, a curved interface along an interior of the aperture, an elongated portion along an outer edge of the frame, and a curved portion coupled between the elongated portion and the curved interface. In another implementation, a frame assembly for a device package is provided. The frame assembly includes a frame. The frame includes a rectangular sheet. The rectangular sheet includes an aperture, a curved interface along an interior of the aperture, an elongated portion along an outer edge of the frame, and a curved portion coupled between the elongated portion and the curved interface. The frame assembly also includes a optical window fused to the curved interface of the frame.