Abstract: The present disclosure provides a layering structure that permits integration of epitaxially oriented perovskite oxides, such as bismuth ferrite (BiFeO3), epitaxially oriented barium titanate (BaTiO3), epitaxially oriented (SrTiO3), or their superstructures (BTO/STO) or solid solutions, onto a Si substrate through a perovskite buffer layer. The structure can retain thermal process-sensitive dopant positions and other thermal process window-sensitive features through atomic layer deposition of an oxide perovskite. Also provided are methods of preparing these layered structures.

Abstract: Provided is the dielectric response of atomic layer-deposited and annealed polymorphic BaTiO3 and BaTiO3—AlO3 bi-layer thin films based on nanocrystalline BaTiO3 containing the perovskite and hexagonal polymorphs. Also provided are BaTiCb films having tuned Curie temperatures. Also provide are nano-grained films, comprising: a BaTiO3 film component comprising a Ba/Ti ratio of between about 0.8 and 1.06, a transition temperature of the nano-grained film being dependent on the Ba/Ti ratio, and the nano-grained film exhibiting a diffused phase transition, optionally whereby a temperature density of a dielectric constant of the nano-grained film is minimized.

Abstract: Provided is the dielectric response of atomic layer-deposited and annealed polymorphic BaTiO3 and BaTiO3—Al2O3 bi-layer thin films based on nanocry stalline BaTiO3 containing the perovskite and hexagonal polymorphs. Also provided are BaTiO3 films having tuned Curie temperatures. Further provided are capacitive components, comprising: a plurality of films, the plurality of films comprising: a first grained film component, the first grained film component comprising at least one of SrTiO3, BaTiO3, and (Ba, Sr)TiO3, and the first grained film component being characterized as being at least partially polymorphic crystalline in nature; a second film component contacting the first grained film component, the second film component optionally comprising Al2O3, and the first grained film component optionally defining an average grain size of less than about 10 micrometers.