Patents by Inventor Isaac GOLDTHWAITE

Isaac GOLDTHWAITE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Assembly and Method for Performing In-Situ Endpoint Detection When Backside Milling Silicon Based Devices
    Publication number: 20220223484
    Abstract: An assembly for monitoring a semiconductor device under test comprising a mill configured to mill the device, a sensor configured to measure an electrical characteristic of the device, and a computer configured to determine the amount of strain in the device from the electrical characteristic when the mill is milling the device and detect an endpoint of milling at a circuit within the device. In use the endpoints of the milling process of the semiconductor device are detected measuring an electrical characteristic of the device with a sensor during milling determining the amount of strain in the device from the electrical characteristic and detecting an endpoint of the milling process within the device based on the amount of strain.
    Type: Application
    Filed: March 30, 2022
    Publication date: July 14, 2022
    Inventors: Jeremiah J. SCHLEY, Thomas KENT, Katie T. LISZEWSKI, Isaac GOLDTHWAITE
  • Assembly and method for performing in-situ endpoint detection when backside milling silicon based devices
    Patent number: 11315840
    Abstract: An assembly for monitoring a semiconductor device under test comprising a mill configured to mill the device, a sensor configured to measure an electrical characteristic of the device, and a computer configured to determine the amount of strain in the device from the electrical characteristic when the mill is milling the device and detect an endpoint of milling at a circuit within the device. In use the endpoints of the milling process of the semiconductor device are detected measuring an electrical characteristic of the device with a sensor during milling determining the amount of strain in the device from the electrical characteristic and detecting an endpoint of the milling process within the device based on the amount of strain.
    Type: Grant
    Filed: May 22, 2020
    Date of Patent: April 26, 2022
    Assignee: Battelle Memorial Institute
    Inventors: Jeremiah J. Schley, Thomas Kent, Katie Liszewski, Isaac Goldthwaite
  • Assembly and Method for Performing In-Situ Endpoint Detection When Backside Milling Silicon Based Devices
    Publication number: 20200373211
    Abstract: An assembly for monitoring a semiconductor device under test comprising a mill configured to mill the device, a sensor configured to measure an electrical characteristic of the device, and a computer configured to determine the amount of strain in the device from the electrical characteristic when the mill is milling the device and detect an endpoint of milling at a circuit within the device. In use the endpoints of the milling process of the semiconductor device are detected measuring an electrical characteristic of the device with a sensor during milling determining the amount of strain in the device from the electrical characteristic and detecting an endpoint of the milling process within the device based on the amount of strain.
    Type: Application
    Filed: May 22, 2020
    Publication date: November 26, 2020
    Inventors: Jeremiah J. SCHLEY, Thomas KENT, Katie LISZEWSKI, Isaac GOLDTHWAITE