Patents by Inventor Isaac Harari

Isaac Harari has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5882165
    Abstract: An integrated modular multiple chamber vacuum processing system is disclosed. The system includes a load lock, may include an external cassette elevator, and an internal load lock wafer elevator, and also includes stations about the periphery of the load lock for connecting one, two or several vacuum process chambers to the load lock chamber. A robot is mounted within the load lock and utilizes a concentric shaft drive system connected to an end effector via a dual four-bar link mechanism for imparting selected R--.THETA. movement to the blade to load and unload wafers at the external elevator, internal elevator and individual process chambers. The system is uniquely adapted for enabling various types of IC processing including etch, deposition, sputtering and rapid thermal annealing chambers, thereby providing the opportunity for multiple step, sequential processing using different processes.
    Type: Grant
    Filed: September 10, 1997
    Date of Patent: March 16, 1999
    Assignee: Applied Materials, Inc.
    Inventors: Dan Maydan, Sasson Somekh, David Nin-Kou Wang, David Cheng, Masato Toshima, Isaac Harari, Peter D. Hoppe
  • Patent number: 5292393
    Abstract: An integrated modular multiple chamber vacuum processing system is disclosed. The system includes a load lock, may include an external cassette elevator, and an internal load lock wafer elevator, and also includes stations about the periphery of the load lock for connecting one, two or several vacuum process chambers to the load lock chamber. A robot is mounted within the load lock and utilizes a concentric shaft drive system connected to an end effector via a dual four-bar link mechanism for imparting selected R-.theta. movement to the blade to load and unload wafers at the external elevator, internal elevator and individual process chambers. The system is uniquely adapted for enabling various types of IC processing including etch, deposition, sputtering and rapid thermal annealing chambers, thereby providing the opportunity for multiple step, sequential processing using different processes.
    Type: Grant
    Filed: December 16, 1991
    Date of Patent: March 8, 1994
    Assignee: Applied Materials, Inc.
    Inventors: Dan Maydan, Sasson Somekh, David N. Wang, David Cheng, Masato Toshima, Isaac Harari, Peter D. Hoppe
  • Patent number: 4951601
    Abstract: An integrated modular multiple chamber vacuum processing system is disclosed. The system includes a load lock, may include an external cassette elevator, and an internal load lock wafer elevator, and also includes stations about the periphery of the load lock for connecting one, two or several vacuum process chambers to the load lock chamber. A robot is mounted within the load lock and utilizes a concentric shaft drive system connected to an end effector via a dual four-bar link mechanism for imparting selected R-.theta. movement to the blade to load and unload wafers at the external elevator, internal elevator and individual process chambers. The system is uniquely adapted for enabling various types of IC processing including etch, deposition, sputtering and rapid thermal annealing chambers, thereby providing the opportunity for multiple step, sequential processing using different processes.
    Type: Grant
    Filed: June 23, 1989
    Date of Patent: August 28, 1990
    Assignee: Applied Materials, Inc.
    Inventors: Dan Maydan, Sasson Somekh, David N. Wang, David Cheng, Masato Toshima, Isaac Harari, Peter D. Hoppe