Abstract: Methods of forming shaped structures on a surface are provided. The methods utilize 3D stencils in conjunction with depositing material(s) on a surface. The surface can be non-planar. In some exemplary embodiments, a method of forming a shaped structure on a surface includes placing a 3D stencil onto a non-planar surface such that a non-planar facing side of the stencil conformally covers the non-planar surface, and depositing a material onto the non-planar surface over which the 3D stencil is placed. The deposited material becomes the shaped structure that has at least a layer facing the non-planar surface that conforms to such surface. At least the non-planar facing side of the stencil maintains the shape that is congruent with the non-planar surface when no force is applied to both the non-planar facing side and an opposed opposing side of the stencil. Stencils, stencil masks, kits, and other methods are also provided.

Abstract: Systems, devices, and methods for three-dimensional printing are provided. The systems, devices, and methods provide for high throughput printing by allowing for parallel extrusion within a single vertical layer of the printed object, i.e., parallel extrusion within an x-y coordinate plane. Any advancement of an extruder can be limited to movement along a single axis, or even no axis at all, so that printing occurs more quickly. In some embodiments, the extruder can include a printing plate that includes a plurality of apertures defined by conductive elements extending in a grid-like manner. The printer can be designed such that material is disposed to a build platform through the apertures only when the aperture is heated on all four sides, for instance by running current through the conductive elements that define the aperture. Other systems, devices, and methods for three-dimensional printing are also provided.

Abstract: A new 3D stencil mask guides deposition of a shaped structure, typically an electromagnetic device component, onto a non-planar surface. The 3D stencil mask includes islands and bridges from prior art two-dimensional lettering stencils, but raises the islands and stencils above the side of the 3D stencil mask facing a non-planar surface, forming undercuts, so that material particles, such as from vacuum metal deposition, will form connected shapes. The 3D stencil mask is also configures so that the dimensions of the resulting electromagnetic structures are altered from a simple projected image of a structure designed for a planar surface so that the electromagnetic properties of the deposited structure are more nearly the same as those of a corresponding structure on a planar surface.

Abstract: Systems, devices, and methods for three-dimensional printing are provided. The systems, devices, and methods provide for high throughput printing by allowing for parallel extrusion within a single vertical layer of the printed object, i.e., parallel extrusion within an x-y coordinate plane. Any advancement of an extruder can be limited to movement along a single axis, or even no axis at all, so that printing occurs more quickly. In some embodiments, the extruder can include a printing plate that includes a plurality of apertures defined by conductive elements extending in a grid-like manner. The printer can be designed such that material is disposed to a build platform through the apertures only when the aperture is heated on all four sides, for instance by running current through the conductive elements that define the aperture. Other systems, devices, and methods for three-dimensional printing are also provided.