Patents by Inventor Isaac N. Silva

Isaac N. Silva has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Test head manipulator configured to address uncontrolled test head rotation
    Patent number: 11498207
    Abstract: An example test head manipulator includes a tower having a base and a track, where the track is vertical relative to the base, and arms to enable support for the test head. The arms are connected to the track to move the test head vertically relative to the tower, and the arms are configured to control rotation of the test head. Each of the arms includes a cam that is rotatable, and at least one plunger in contact with the cam and that is configured to contact the test head. Rotation of the cam is controllable to move the at least one plunger to offset an uncontrolled rotation the test head.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: November 15, 2022
    Assignee: Teradyne, Inc.
    Inventor: Isaac N. Silva
  • TEST HEAD MANIPULATOR CONFIGURED TO ADDRESS UNCONTROLLED TEST HEAD ROTATION
    Publication number: 20220219315
    Abstract: An example test head manipulator includes a tower having a base and a track, where the track is vertical relative to the base, and arms to enable support for the test head. The arms are connected to the track to move the test head vertically relative to the tower, and the arms are configured to control rotation of the test head. Each of the arms includes a cam that is rotatable, and at least one plunger in contact with the cam and that is configured to contact the test head. Rotation of the cam is controllable to move the at least one plunger to offset an uncontrolled rotation the test head.
    Type: Application
    Filed: January 8, 2021
    Publication date: July 14, 2022
    Inventor: Isaac N. Silva
  • Thermal control of a probe card assembly
    Patent number: 11280827
    Abstract: An example test system includes a test head and a probe card assembly connected to the test head. The probe card assembly includes: a probe card having electrical contacts, a stiffener connected to the probe card to impart rigidity to the probe card, and a heater to heat to at least part of the probe card assembly. A prober is configured to move a device under test (DUT) into contact with the electrical contacts of the probe card assembly.
    Type: Grant
    Filed: February 29, 2016
    Date of Patent: March 22, 2022
    Assignee: TERADYNE, INC.
    Inventors: Kevin A. Thompson, Isaac N Silva
  • THERMAL CONTROL OF A PROBE CARD ASSEMBLY
    Publication number: 20170248632
    Abstract: An example test system includes a test head and a probe card assembly connected to the test head. The probe card assembly includes: a probe card having electrical contacts, a stiffener connected to the probe card to impart rigidity to the probe card, and a heater to heat to at least part of the probe card assembly. A prober is configured to move a device under test (DUT) into contact with the electrical contacts of the probe card assembly.
    Type: Application
    Filed: February 29, 2016
    Publication date: August 31, 2017
    Inventors: Kevin A. Thompson, Isaac N. Silva