Abstract: A surface mount coupler device is provided having a device body with a plurality of terminations located thereon. The coupler device is particularly useful in high frequency circuits to provide coupling between two circuit lines without direct electrical contact. For example, the device may provide coupling between a feedback control loop and an amplifier output section in a RF transmitter. The device body is built up on a rigid insulative substrate. During manufacture, one or more layers of insulative polymer are applied to the insulative substrate. The insulative polymer defines conductor channels in which primary and secondary conductors are located. The primary and secondary conductors are electrically connected to a respective pair of the terminations located on the device body. A sealing cover, preferably glass, is located above the polymeric insulative layers.

Abstract: A surface mount filter device is provided having a device body with a plurality of terminations located thereon. Capacitors and inductors are located on the same chip to create a variety of LC filters, such as LPF, HPF, BPF and BRF, or combinations of these options, as well as LC resonator structures. The chip is preferably built by thin film technology, which allows a considerable reduction in component or circuit size. The device body is constructed having a rigid insulative substrate to which a first conductive pattern having one or more first capacitor plates is applied. A dielectric is located over the first conductive pattern, and itself supports a second conductive pattern defining the opposed capacitor plates. One or more layers of insulative polymer are located above the dielectric layer, and have conductor channels in which conductive material is located. The conductive material in the conductive channels forms the coil of the on-chip inductor.