Patents by Inventor Isabel-Roda Hirsekorn

Isabel-Roda Hirsekorn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COMPOSTION FOR DEPOSITING A PALLADIUM COATING ON A SUBSTRATE
    Publication number: 20230323542
    Abstract: The present invention is directed to a composition for depositing a palladium coating on a substrate, in particular on a nickel-coated substrate, the composition comprising: (i) palladium ions, (ii) chloride ions, (iii) ethylenediamine (EDA), (iv) ethylenediamine disuccinate (EDDS), and (v) at least one reducing agent.
    Type: Application
    Filed: August 31, 2021
    Publication date: October 12, 2023
    Inventors: Donny LAUTAN, Dmytro VOLOSHYN, Isabel-Roda HIRSEKORN, Dirk TEWS, Robert SPREEMANN
  • Method for electroless plating of tin and tin alloys
    Patent number: 9458541
    Abstract: The invention relates to a method for electroless (immersion) plating of tin and tin alloys having a thickness of ?1 ?m as a final finish in the manufacture of printed circuit boards, IC substrates, semiconductor wafers and the like. The method utilizes an electroless plated sacrificial layer of copper between the copper contact pad and the electroless plated tin layer which is dissolved completely during tin plating. The method compensates the undesired loss of copper from a contact pad during electroless plating of thick tin layers.
    Type: Grant
    Filed: August 24, 2010
    Date of Patent: October 4, 2016
    Assignee: Atotech Deutschland GmbH
    Inventors: Kilian Arnd, Jens Wegricht, Isabel-Roda Hirsekorn, Hans Jurgen Schreier
  • Electroless palladium plating bath composition
    Patent number: 8888903
    Abstract: The present invention concerns an aqueous plating bath composition for electroless deposition of palladium and/or palladium alloys and a method which utilises such aqueous plating bath compositions. The aqueous plating bath comprises a source of palladium ions, a reducing agent, a nitrogenated complexing agent which is free of phosphorous and at least one organic stabilising agent comprising 1 to 5 phosphonate residues. The aqueous plating bath and the method are particularly useful if the aqueous plating bath comprises copper ions.
    Type: Grant
    Filed: August 22, 2012
    Date of Patent: November 18, 2014
    Assignee: Atotech Deutschland GmbH
    Inventors: Isabel-Roda Hirsekorn, Jens Wegricht, Arnd Kilian
  • ELECTROLESS PALLADIUM PLATING BATH COMPOSITION
    Publication number: 20140242265
    Abstract: The present invention concerns an aqueous plating bath composition for electroless deposition of palladium and/or palladium alloys and a method which utilises such aqueous plating bath compositions. The aqueous plating bath comprises a source of palladium ions, a reducing agent, a nitrogenated complexing agent which is free of phosphorous and at least one organic stabilising agent comprising 1 to 5 phosphonate residues. The aqueous plating bath and the method are particularly useful if the aqueous plating bath comprises copper ions.
    Type: Application
    Filed: August 22, 2012
    Publication date: August 28, 2014
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Isabel-Roda Hirsekorn, Jens Wegricht, Arnd Kilian
  • Autocatalytic plating bath composition for deposition of tin and tin alloys
    Patent number: 8801844
    Abstract: An autocatalytic tin plating bath containing Sn2+ ions, Ti3+ ions as reducing agent, an organic complexing agent and phenanthroline or a derivative thereof as stabilizing agent is disclosed. The plating bath is suitable for manufacture of printed circuit boards, IC substrates and metallization of semiconductor wafers.
    Type: Grant
    Filed: January 11, 2012
    Date of Patent: August 12, 2014
    Assignee: Atotech Deutschland GmbH
    Inventors: Arnd Kilian, Jens Wegricht, Isabel-Roda Hirsekorn
  • AUTOCATALYTIC PLATING BATH COMPOSITION FOR DEPOSITION OF TIN AND TIN ALLOYS
    Publication number: 20130309404
    Abstract: An autocatalytic tin plating bath containing Sn2+ ions, Ti3+ ions as reducing agent, an organic complexing agent and phenanthroline or a derivative thereof as stabilizing agent is disclosed. The plating bath is suitable for manufacture of printed circuit boards, IC substrates and metallization of semiconductor wafers.
    Type: Application
    Filed: January 11, 2012
    Publication date: November 21, 2013
    Applicant: Atotech Deutschland GmbH
    Inventors: Arnd Kilian, Jens Wegricht, Isabel-Roda Hirsekorn
  • METHOD FOR ELECTROLESS PLATING OF TIN AND TIN ALLOYS
    Publication number: 20120148733
    Abstract: The invention relates to a method for electroless (immersion) plating of tin and tin alloys having a thickness of?1 ?m as a final finish in the manufacture of printed circuit boards, IC substrates, semiconductor wafers and the like. The method utilizes an electroless plated sacrificial layer of copper between the copper contact pad and the electroless plated tin layer which is dissolved completely during tin plating. The method compensates the undesired loss of copper from a contact pad during electroless plating of thick tin layers.
    Type: Application
    Filed: August 24, 2010
    Publication date: June 14, 2012
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Kilian Arnd, Jens Wegricht, Isabel-Roda Hirsekorn, Hans Jurgen Schreier