Patents by Inventor Isabella Para

Isabella Para has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Local semiconductor wafer thinning
    Patent number: 10043676
    Abstract: A local thinning process is employed on the backside of a semiconductor substrate such as a wafer in order to improve the thermal performance of the electronic device built on or in the front side of the wafer.
    Type: Grant
    Filed: October 15, 2015
    Date of Patent: August 7, 2018
    Assignee: VISHAY GENERAL SEMICONDUCTOR LLC
    Inventors: Sanfilippo Carmelo, Luigi Merlin, Isabella Para, Giovanni Richieri
  • LOCAL SEMICONDUCTOR WAFER THINNING
    Publication number: 20170110329
    Abstract: A local thinning process is employed on the backside of a semiconductor substrate such as a wafer in order to improve the thermal performance of the electronic device built on or in the front side of the wafer.
    Type: Application
    Filed: October 15, 2015
    Publication date: April 20, 2017
    Inventors: Sanfilippo Carmelo, Luigi Merlin, Isabella Para, Giovanni Richieri