Patents by Inventor Isabelle Desoutter

Isabelle Desoutter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Disposable electronic chip device and process of manufacture
    Publication number: 20020148110
    Abstract: An electronic chip device includes an interface support film having a support film and at least one flat conductive interface placed on the support film, as well as a microcircuit connected to the interface. The interface support film possesses such properties that it can be creased or folded on itself without deterioration. The support film possesses a thickness of less than 75 &mgr;m, the best results being obtained with a thickness of between 10 &mgr;m and 30 &mgr;m. Preferably the support film is selected from among polypropylene (PP), polyethylene (PE), polyethylene teraphtalate (PET). In one embodiment, the device includes a compensation film placed on the support film. The compensation film has a recess containing the microcircuit and its connections. The recess can contain a material to encapsulate the microcircuit and its connections.
    Type: Application
    Filed: June 5, 2002
    Publication date: October 17, 2002
    Inventors: Rene-Paul Blanc, Isabelle Desoutter, Pierre Garnier, Philippe Martin
  • Disposable electronic chip device and process of manufacture
    Patent number: 6437985
    Abstract: An electronic chip device includes an interface support film having a support film and at least one flat conductive interface placed on the support film, as well as a microcircuit connected to the interface. The interface support film possesses such properties that it can be creased or folded on itself without deterioration. The support film possesses a thickness of less than 75 &mgr;m, the best results being obtained with a thickness of between 10 &mgr;m and 30 &mgr;m. Preferably the support film is selected from among polypropylene (PP), polyethylene (PE), polyethylene teraphtalate (PET). In one embodiment, the device includes a compensation film placed on the support film. The compensation film has a recess containing the microcircuit and its connections. The recess can contain a material to encapsulate the microcircuit and its connections.
    Type: Grant
    Filed: March 24, 2000
    Date of Patent: August 20, 2002
    Assignee: Gemplus
    Inventors: Rene-Paul Blanc, Isabelle Desoutter, Pierre Garnier, Philippe Martin