Patents by Inventor Isaku Arii

Isaku Arii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6613680
    Abstract: A method of manufacturing a semiconductor device provided with a first insulating film and a barrier film on a conductive region and an opening portion in the first insulating film and the barrier film, the method comprising the steps of: forming a first opening portion in the barrier film reaching the first insulating film; forming a second insulating film at least on the first insulating film in the first opening portion; and forming a second opening portion smaller than the first opening portion and reaching the conductive region by simultaneously boring a hole into the first insulating film and the second insulating film in the first opening portion.
    Type: Grant
    Filed: July 19, 2001
    Date of Patent: September 2, 2003
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Toshiyuki Tohda, Isaku Arii
  • Publication number: 20020039837
    Abstract: A method of manufacturing a semiconductor device provided with a first insulating film and a barrier film on a conductive region and an opening portion in the first insulating film and the barrier film, the method comprising the steps of: forming a first opening portion in the barrier film reaching the first insulating film; forming a second insulating film at least on the first insulating film in the first opening portion; and forming a second opening portion smaller than the first opening portion and reaching the conductive region by simultaneously boring a hole into the first insulating film and the second insulating film in the first opening portion.
    Type: Application
    Filed: July 19, 2001
    Publication date: April 4, 2002
    Inventors: Toshiyuki Tohda, Isaku Arii