Patents by Inventor Isamu Chimoto

Isamu Chimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6123184
    Abstract: A parts alignment device includes: an input port introducing chip-like parts having a magnetic-substance electrode; a storage chamber storing the parts introduced through the input port; a wall made of non-magnetic material, the wall defining a back surface of the storage chamber; an arc-like guide made of non-magnetic material and provided at least above the storage chamber; an intake port provided in connection with the guide and taking in only parts aligned in a predetermined direction from the parts; a parts passageway connected to the intake port and provided toward downstream of the intake port; a rotary plate made of non-magnetic material and provided at the rear of the wall so as to rotate in a parts taking-in direction of the intake port; and a magnet provided on the rotary plate. The magnet attracts the parts both in a direction of the guide and in a direction of the wall simultaneously by a magnetic force thereof.
    Type: Grant
    Filed: August 6, 1998
    Date of Patent: September 26, 2000
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Mikio Yasuda, Isamu Chimoto, Takeshi Nishiguchi
  • Patent number: 5468919
    Abstract: A printed circuit board device comprises bar-like connectors made of a metal material and having a predetermined length and a predetermined width. Each bar-like connector has a plating of a highly electrically conductive, anti-corrosion metal coated over the side surface(s) thereof but not the end surfaces. Each bar-like connector may be more smooth on the side surface(s) than on the end surfaces. Each bar-like connector is fixedly connected at both ends by an electrically conductive bonding agent to a pair of lands on a printed circuit board, respectively, to provide electrical conduction between the two lands. Accordingly, connection faults caused by the Manhattan phenomenon are eliminated and the cost of SMT production is reduced.
    Type: Grant
    Filed: April 12, 1994
    Date of Patent: November 21, 1995
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Minoru Shiozaki, Mikio Yasuda, Isamu Chimoto, Kameki Ishimoto