Patents by Inventor Isamu Hasegawa

Isamu Hasegawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230377230
    Abstract: A highly expressive image is output based on an input image. A style transfer program causes a processor to implement a distance estimation function of estimating a distance to a target included in an image, a region defining function of demarcating one or more regions from the image based on the estimated distance, and a style transfer function of performing a style transfer to the regions in the image.
    Type: Application
    Filed: May 18, 2023
    Publication date: November 23, 2023
    Inventors: Simon Francis STANNUS, Edgar HANDY, Isamu HASEGAWA, Youichiro Miyake
  • Patent number: 9948206
    Abstract: A multilevel power conversion device includes: N (N?1) direct current voltage sources; a first flying capacitor; a second flying capacitor; and a phase module of a M phase (M?2) being configured to output, from the output terminal, a potential of one of the input terminals, or a potential obtained by adding or subtracting the voltage of the capacitor to or from the potential of the one of the input terminals, by selectively controlling the respective switching elements in an ON/OFF manner.
    Type: Grant
    Filed: May 28, 2014
    Date of Patent: April 17, 2018
    Assignee: MEIDENSHA CORPORATION
    Inventors: Isamu Hasegawa, Takashi Kodama, Takeshi Kondo, Shota Urushibata, Hiromi Sako, Kenji Kobori, Shizunori Hamada, Keiichi Kodachi
  • Patent number: 9923369
    Abstract: Basic circuit of U phase includes first to fourth semiconductor elements (SU1.1 to SU1.4) connected between positive and negative ends of DC voltage source (DCC1), fifth semiconductor element (SU1.5) connected to a common connection point of the first and second semiconductor elements (SU1.1, SU1.2), and sixth semiconductor element (SU1.6) connected to a common connection point of the third and fourth semiconductor elements (SU1.3, SU1.4). Flying capacitor (FC1) is inserted between the fifth semiconductor element (SU1.5) and the sixth semiconductor element (SU1.6). Voltage selection circuits have the common connection points of the second and third semiconductor elements (SU1.2, SU1.3) of the respective basic circuits as input terminals, and includes semiconductor elements (SU1 to SU4) between the input terminals and output terminals (U, V, W).
    Type: Grant
    Filed: May 23, 2014
    Date of Patent: March 20, 2018
    Assignee: MEIDENSHA CORPORATION
    Inventors: Isamu Hasegawa, Takashi Kodama, Takeshi Kondo, Shota Urushibata
  • Publication number: 20160181949
    Abstract: A multilevel power conversion device includes: N (N?1) direct current voltage sources; a first flying capacitor; a second flying capacitor; and a phase module of a M phase (M?2) being configured to output, from the output terminal, a potential of one of the input terminals, or a potential obtained by adding or subtracting the voltage of the capacitor to or from the potential of the one of the input terminals, by selectively controlling the respective switching elements in an ON/OFF manner.
    Type: Application
    Filed: May 28, 2014
    Publication date: June 23, 2016
    Applicant: MEIDENSHA CORPORATION
    Inventors: Isamu HASEGAWA, Takashi KODAMA, Takeshi KONDO, Shota URUSHIBATA, Hiromi SAKO, Kenji KOBORI, Shizunori HAMADA, Keiichi KODACHI
  • Publication number: 20160141870
    Abstract: Basic circuit of U phase includes first to fourth semiconductor elements (SU1.1 to SU1.4) connected between positive and negative ends of DC voltage source (DCC1), fifth semiconductor element (SU1.5) connected to a common connection point of the first and second semiconductor elements (SU1.1, SU1.2), and sixth semiconductor element (SU1.6) connected to a common connection point of the third and fourth semiconductor elements (SU1.3, SU1.4). Flying capacitor (FC1) is inserted between the fifth semiconductor element (SU1.5) and the sixth semiconductor element (SU1.6). Voltage selection circuits have the common connection points of the second and third semiconductor elements (SU1.2, SU1.3) of the respective basic circuits as input terminals, and includes semiconductor elements (SU1 to SU4) between the input terminals and output terminals (U, V, W).
    Type: Application
    Filed: May 23, 2014
    Publication date: May 19, 2016
    Applicant: MEIDENSHA CORPORATION
    Inventors: Isamu HASEGAWA, Takashi KODAMA, Takeshi KONDO, Shota URUSHIBATA
  • Patent number: 7318872
    Abstract: A bonding method of a magnetic head micro-motion actuator includes measuring clearances between the adhesive surfaces of the pair of movable arms and the magnetic head by locating the magnetic head at the center of the pair of movable arms during bonding the adhesion surfaces of both sides of the magnetic head between the pair of movable arms; calculating the optimum amount of an adhesive resin corresponding to the measured clearances; applying the calculated amount of the adhesive resin on the adhesive surfaces of the magnetic head by pulling the magnetic head out of the pair of movable arms; and bonding the magnetic head having the adhesive resin applied on its adhesive surfaces between the pair of movable arms by inserting the magnetic head therebetween.
    Type: Grant
    Filed: May 24, 2005
    Date of Patent: January 15, 2008
    Assignee: Alps Electric Co., Ltd.
    Inventors: Hiroshi Aimura, Isamu Hasegawa
  • Publication number: 20050263235
    Abstract: A bonding method of a magnetic head micro-motion actuator includes measuring clearances between the adhesive surfaces of the pair of movable arms and the magnetic head by locating the magnetic head at the center of the pair of movable arms during bonding the adhesion surfaces of both sides of the magnetic head between the pair of movable arms; calculating the optimum amount of an adhesive resin corresponding to the measured clearances; applying the calculated amount of the adhesive resin on the adhesive surfaces of the magnetic head by pulling the magnetic head out of the pair of movable arms; and bonding the magnetic head having the adhesive resin applied on its adhesive surfaces between the pair of movable arms by inserting the magnetic head therebetween.
    Type: Application
    Filed: May 24, 2005
    Publication date: December 1, 2005
    Inventors: Hiroshi Aimura, Isamu Hasegawa
  • Patent number: 5254545
    Abstract: A preparation containing a cephalosporin medicament is disclosed. The preparation comprises a cephalosporin derivative represented by the following formula: ##STR1## namely, 7.beta.-{2-(5-amino-1,2,4-thiadiazol-3-yl)-(Z)-2-fluoromethoxyiminoacetami do}-3-{(E)-3-(carbamoylmethylethylmethylammonio) -1-propen-1-yl}-3-cephem-4-carboxylate or a pharmaceutically acceptable salt thereof salt, lactose, citric acid or a sodium salt thereof, and arginine or a hydrochloride thereof; or the cephalosporin derivative represented by the formula (I) or a pharmaceutically acceptable salt thereof, lactose, citric acid or a sodium salt thereof, and sodium chloride.
    Type: Grant
    Filed: September 28, 1990
    Date of Patent: October 19, 1993
    Assignee: Eisai Co., Ltd.
    Inventors: Yasuo Ishibashi, Isamu Hasegawa, Masanori Kayano, Ryoichi Machida, Masahiro Kawahara, Sumio Watanabe