Patents by Inventor Isamu Hiraoka

Isamu Hiraoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of heat treatment of low melting-point metal on an electrode of a chip part
    Patent number: 4842654
    Abstract: Disclosed is a method of heat treatment of a low melting-point metal for production of spheroidal bodies formed of a low melting-point metal or alloy or heat treatment of the low-melting point metal coated on the surface of an electrode of a chip part.
    Type: Grant
    Filed: January 19, 1988
    Date of Patent: June 27, 1989
    Assignee: Matsushita Electric Industrial Co. Ltd.
    Inventors: Yasuhiro Shindo, Yukio Tsujimoto, Isami Saito, Isamu Hiraoka, Hiroshi Hirayama
  • Paste for forming a thick conductive film
    Patent number: 4603007
    Abstract: A paste for forming a thick electrically conductive film, which may, for example, be used to produce a touch panel for an electric appliance, contains 40 to 55% by weight of lead borosilicate glass powder containing 1 to 5% by weight of titanium oxide, a total of 15 to 35% by weight of ruthenium oxide powder and silver and/or palladium powder, 1 to 5% by weight of bismuth oxide powder and 1 to 5% by weight of alumina powder in an organic vehicle.
    Type: Grant
    Filed: July 12, 1985
    Date of Patent: July 29, 1986
    Assignees: Sumitomo Metal Mining Company Limited, Shimomoto Giken Co., Ltd.
    Inventors: Koushiro Shibata, Tohru Miyoshi, Isamu Hiraoka, Takeshi Shimomoto