Abstract: A computer system includes an I/O switch connected to a computer and changing connections between the computer and I/O devices, and a management server for managing configuration of the I/O devices. The management server, with respect to existing I/O devices connected to the I/O switch, stores information representing logical configuration of the existing I/O devices recognized by an OS of the computer and information representing physical configuration of the existing I/O devices managed by the I/O switch in the memory, The management server, upon receipt of a notice indicating a change in the configuration of the existing I/O devices from the I/O switch, changes the physical configuration of the existing I/O devices after the change in the configuration to be matched with the logical configuration of the existing I/O devices and instructs the I/O switch to change the connections in accordance with the changed physical configuration.

Abstract: A computer system includes an I/O switch connected to a computer and changing connections between the computer and I/O devices, and a management server for managing configuration of the I/O devices. The management server, with respect to existing I/O devices connected to the I/O switch, stores information representing logical configuration of the existing I/O devices recognized by an OS of the computer and information representing physical configuration of the existing I/O devices managed by the I/O switch in the memory, The management server, upon receipt of a notice indicating a change in the configuration of the existing I/O devices from the I/O switch, changes the physical configuration of the existing I/O devices after the change in the configuration to be matched with the logical configuration of the existing I/O devices and instructs the I/O switch to change the connections in accordance with the changed physical configuration.

Abstract: When weaving, movable and stationary discs grasp or grip intermittently the weft yarn therebetween. One of the discs has at its contacting surface a circular recess encircled by a bank. The ridge of the bank contacting the flat surface of the other disc does the gripping.

Abstract: A plurality of semiconductor elements alternating in compressive contact relationship hollow heat dissipation blocks are disposed below a coolant reservoir filled with a condensible coolant in its liquid phase having a liquid surface. The hollow blocks are connected to the reservoir through respective connection tubes to be filled with the liquid coolant. A condenser is disposed above the reservoir. One auxiliary tube is disposed within each connection tube and has an upper open end located below the liquid surface and short of a point where a condensed coolant from the condenser flows into the reservoir and a lower end opening within the associated block.

Abstract: An electrical valve circuit apparatus which comprises an electrical valve circuit comprising a plurality of main control electrical valves operationally connected between a main DC circuit system and a main AC circuit system, at least one pair of commutating arms composed of at least two main control electrical valves for sequentially commutating the current, at least one arm of the group of commutating arms is an auxiliary DC circuit system, and an auxiliary electrical valve apparatus and an auxiliary power source connected in series to the auxiliary DC circuit system.

Abstract: A stack including a semiconductor element and the associated components is held within a lower portion of a hermetic envelope between its side wall and a closure block movably secured to its opposite side wall to close an opening on the latter and is immersed into a cooling liquid boilable adjacent the operating temperature of the semiconductor element. A pressing plate fixed to the opposite side wall resiliently presses the closure block to apply a compressible contact force to the semiconductor element. The stack may be sandwiched between two closure blocks closing the opposite opening on the bilateral walls of the lower envelope portion and pressed toward each other by two spherical segment of resilient material arranged back-to-back. Alternatively the stack may be carried between the bilateral envelope walls through a resilient spherical segment.