Patents by Inventor Isamu Ichikawa

Isamu Ichikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9067398
    Abstract: Provided is a method for disassembling a bonded body, whereby the bonded body can be easily disassembled and peeled. The method for disassembling a bonded body formed by bonding substrates with an adhesive comprises irradiating light having a wavelength of 280 nm or more such that irradiation energy is 1000-5000000 mJ/cm2 at a wavelength of 365 nm while heating the bonded body to 150° C.-300° C.
    Type: Grant
    Filed: August 29, 2011
    Date of Patent: June 30, 2015
    Assignee: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Hiroyuki Kurimura, Isamu Ichikawa, Yoshitsugu Goto
  • Patent number: 9061485
    Abstract: Provided is a method for manufacturing a translucent rigid substrate laminate which can improve a thickness precision while decreasing the risk of fractures. In the method for manufacturing a translucent rigid substrate laminate according to the present invention, translucent rigid substrates are placed opposite to each other such that bonding surfaces thereof are parallel to each other, both rigid substrates are brought toward each other while being kept parallel, the both rigid substrates are preliminarily bonded using a photo-curable fixing agent, the bonded translucent rigid substrates are roll-pressed, and the fixing agent is then cured.
    Type: Grant
    Filed: June 1, 2011
    Date of Patent: June 23, 2015
    Assignee: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Hiroyuki Kurimura, Tomoyuki Kanai, Isamu Ichikawa, Gosuke Nakajima, Hayato Miyazaki, Yasunori Hayashi, Kenji Tanaka
  • Patent number: 8901192
    Abstract: Provided is an adhesive (meth)acrylic resin composition being high in adhesiveness and capable of affording an adhered body which can be used at high temperatures of 250° C. or higher, and possessing low outgassing property and heat resistance. A (meth)acrylic resin composition including (A) a polyfunctional (meth)acrylate, and (B) a photopolymerization initiator that exhibits a mass loss on heating of 15% by mass or less when increasing temperature from 30° C. to 250° C. at a temperature increase rate of 10° C./min. under nitrogen flow, wherein the glass transition temperature of a cured body obtained from the composition is 250° C. or higher.
    Type: Grant
    Filed: October 20, 2010
    Date of Patent: December 2, 2014
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hiroyuki Kurimura, Isamu Ichikawa, Takayuki Nagumo, Takako Hoshino, Jun Watanabe
  • Patent number: 8845858
    Abstract: Disclosed is a method for separating a bonded body, whereby the bonded body can be separated easily. Specifically disclosed is a method for separating bonded bodies that includes a step that irradiates excimer light with a central wavelength of 1 to 300 nm on to a bonded body that has been formed by using an adhesive composition to bond substrates together, which includes and is formed by one type or two or more types of meth (acrylate) that have one or more (meth)acryloyl groups, and by hardening of said adhesive composition. At least one of the substrates is permeable to the excimer light.
    Type: Grant
    Filed: June 1, 2011
    Date of Patent: September 30, 2014
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Yoshitsugu Goto, Jun Watanabe, Norihiro Shimizu, Hiroyuki Kurimura, Isamu Ichikawa, Kenji Fukao, Yukihiro Morimoto
  • Publication number: 20130174986
    Abstract: Provided is a method for disassembling a bonded body, whereby the bonded body can be easily disassembled and peeled. The method for disassembling a bonded body formed by bonding substrates with an adhesive comprises irradiating light having a wavelength of 280 nm or more such that irradiation energy is 1000-5000000 mJ/cm2 at a wavelength of 365 nm while heating the bonded body to 150° C.-300° C.
    Type: Application
    Filed: August 29, 2011
    Publication date: July 11, 2013
    Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Hiroyuki Kurimura, Isamu Ichikawa, Yoshitsugu Goto
  • Publication number: 20130092326
    Abstract: Disclosed is a method for separating a bonded body, whereby the bonded body can be separated easily. Specifically disclosed is a method for separating bonded bodies that includes a step that irradiates excimer light with a central wavelength of 1 to 300 nm on to a bonded body that has been formed by using an adhesive composition to bond substrates together, which includes and is formed by one type or two or more types of meth (acrylate) that have one or more (meth)acryloyl groups, and by hardening of said adhesive composition. At least one of the substrates is permeable to the excimer light.
    Type: Application
    Filed: June 1, 2011
    Publication date: April 18, 2013
    Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Yoshitsugu Goto, Jun Watanabe, Norihiro Shimizu, Hiroyuki Kurimura, Isamu Ichikawa, Kenji Fukao, Yukihiro Morimoto
  • Publication number: 20130081752
    Abstract: Provided is a method for manufacturing a translucent rigid substrate laminate which can improve a thickness precision while decreasing the risk of fractures. In the method for manufacturing a translucent rigid substrate laminate according to the present invention, translucent rigid substrates are placed opposite to each other such that bonding surfaces thereof are parallel to each other, both rigid substrates are brought toward each other while being kept parallel, the both rigid substrates are preliminarily bonded using a photo-curable fixing agent, the bonded translucent rigid substrates are roll-pressed, and the fixing agent is then cured.
    Type: Application
    Filed: June 1, 2011
    Publication date: April 4, 2013
    Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Hiroyuki Kurimura, Tomoyuki Kanai, Isamu Ichikawa, Gosuke Nakajima, Hayato Miyazaki, Yasunori Hayashi, Kenji Tanaka
  • Publication number: 20120205043
    Abstract: Provided is an adhesive (meth)acrylic resin composition being high in adhesiveness and capable of affording an adhered body which can be used at high temperatures of 250° C. or higher, and possessing low outgassing property and heat resistance. A (meth)acrylic resin composition including (A) a polyfunctional (meth)acrylate, and (B) a photopolymerization initiator that exhibits a mass loss on heating of 15% by mass or less when increasing temperature from 30° C. to 250° C. at a temperature increase rate of 10° C./min. under nitrogen flow, wherein the glass transition temperature of a cured body obtained from the composition is 250° C. or higher.
    Type: Application
    Filed: October 20, 2010
    Publication date: August 16, 2012
    Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Hiroyuki Kurimura, Isamu Ichikawa, Takayuki Nagumo, Takako Hoshino, Jun Watanabe
  • Publication number: 20110111253
    Abstract: In a plated member (3) that has a pure Sn plating layer (2) of a lead-free material on a surface of a base material 1, the orientation indices of a (101) plane and a (112) plane of the pure Sn plating layer are increased to values higher than the orientation indices of the other crystal orientation planes.
    Type: Application
    Filed: June 18, 2009
    Publication date: May 12, 2011
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yasufumi Shibata, Takashi Nomura, Shigeru Konda, Mitsuru Sakano, Isamu Ichikawa, Katsuhito Azuma, Junichi Honda, Satoshi Mizutani
  • Patent number: 4553696
    Abstract: An air flow rate sensor and throttle valve which controls the opening of a duct in accordance with the detection signals from the air flow rate sensor are provided in a control duct between a supply chamber utilizing double ceilings and the air diffusers in the supply chamber. The quantities of air fed from the respective air diffusers can be equalized or can be set to the desired values. In this case, since the air blowing can be automatically controlled for each diffuser, it is not necessary to individually adjust the quantities of air for the respective air diffusers after the installation of the air conditioner, thereby eliminating the adjusting works of the air diffusers.
    Type: Grant
    Filed: September 30, 1982
    Date of Patent: November 19, 1985
    Assignee: Topre Corporation
    Inventors: Isamu Ichikawa, Yutaka Fukushi, Keiji Kamata, Hikoshiro Suzuki