Patents by Inventor Isamu Ichikawa
Isamu Ichikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9067398Abstract: Provided is a method for disassembling a bonded body, whereby the bonded body can be easily disassembled and peeled. The method for disassembling a bonded body formed by bonding substrates with an adhesive comprises irradiating light having a wavelength of 280 nm or more such that irradiation energy is 1000-5000000 mJ/cm2 at a wavelength of 365 nm while heating the bonded body to 150° C.-300° C.Type: GrantFiled: August 29, 2011Date of Patent: June 30, 2015Assignee: DENKI KAGAKU KOGYO KABUSHIKI KAISHAInventors: Hiroyuki Kurimura, Isamu Ichikawa, Yoshitsugu Goto
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Patent number: 9061485Abstract: Provided is a method for manufacturing a translucent rigid substrate laminate which can improve a thickness precision while decreasing the risk of fractures. In the method for manufacturing a translucent rigid substrate laminate according to the present invention, translucent rigid substrates are placed opposite to each other such that bonding surfaces thereof are parallel to each other, both rigid substrates are brought toward each other while being kept parallel, the both rigid substrates are preliminarily bonded using a photo-curable fixing agent, the bonded translucent rigid substrates are roll-pressed, and the fixing agent is then cured.Type: GrantFiled: June 1, 2011Date of Patent: June 23, 2015Assignee: DENKI KAGAKU KOGYO KABUSHIKI KAISHAInventors: Hiroyuki Kurimura, Tomoyuki Kanai, Isamu Ichikawa, Gosuke Nakajima, Hayato Miyazaki, Yasunori Hayashi, Kenji Tanaka
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Patent number: 8901192Abstract: Provided is an adhesive (meth)acrylic resin composition being high in adhesiveness and capable of affording an adhered body which can be used at high temperatures of 250° C. or higher, and possessing low outgassing property and heat resistance. A (meth)acrylic resin composition including (A) a polyfunctional (meth)acrylate, and (B) a photopolymerization initiator that exhibits a mass loss on heating of 15% by mass or less when increasing temperature from 30° C. to 250° C. at a temperature increase rate of 10° C./min. under nitrogen flow, wherein the glass transition temperature of a cured body obtained from the composition is 250° C. or higher.Type: GrantFiled: October 20, 2010Date of Patent: December 2, 2014Assignee: Denki Kagaku Kogyo Kabushiki KaishaInventors: Hiroyuki Kurimura, Isamu Ichikawa, Takayuki Nagumo, Takako Hoshino, Jun Watanabe
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Patent number: 8845858Abstract: Disclosed is a method for separating a bonded body, whereby the bonded body can be separated easily. Specifically disclosed is a method for separating bonded bodies that includes a step that irradiates excimer light with a central wavelength of 1 to 300 nm on to a bonded body that has been formed by using an adhesive composition to bond substrates together, which includes and is formed by one type or two or more types of meth (acrylate) that have one or more (meth)acryloyl groups, and by hardening of said adhesive composition. At least one of the substrates is permeable to the excimer light.Type: GrantFiled: June 1, 2011Date of Patent: September 30, 2014Assignee: Denki Kagaku Kogyo Kabushiki KaishaInventors: Yoshitsugu Goto, Jun Watanabe, Norihiro Shimizu, Hiroyuki Kurimura, Isamu Ichikawa, Kenji Fukao, Yukihiro Morimoto
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Publication number: 20130174986Abstract: Provided is a method for disassembling a bonded body, whereby the bonded body can be easily disassembled and peeled. The method for disassembling a bonded body formed by bonding substrates with an adhesive comprises irradiating light having a wavelength of 280 nm or more such that irradiation energy is 1000-5000000 mJ/cm2 at a wavelength of 365 nm while heating the bonded body to 150° C.-300° C.Type: ApplicationFiled: August 29, 2011Publication date: July 11, 2013Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHAInventors: Hiroyuki Kurimura, Isamu Ichikawa, Yoshitsugu Goto
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Publication number: 20130092326Abstract: Disclosed is a method for separating a bonded body, whereby the bonded body can be separated easily. Specifically disclosed is a method for separating bonded bodies that includes a step that irradiates excimer light with a central wavelength of 1 to 300 nm on to a bonded body that has been formed by using an adhesive composition to bond substrates together, which includes and is formed by one type or two or more types of meth (acrylate) that have one or more (meth)acryloyl groups, and by hardening of said adhesive composition. At least one of the substrates is permeable to the excimer light.Type: ApplicationFiled: June 1, 2011Publication date: April 18, 2013Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHAInventors: Yoshitsugu Goto, Jun Watanabe, Norihiro Shimizu, Hiroyuki Kurimura, Isamu Ichikawa, Kenji Fukao, Yukihiro Morimoto
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Publication number: 20130081752Abstract: Provided is a method for manufacturing a translucent rigid substrate laminate which can improve a thickness precision while decreasing the risk of fractures. In the method for manufacturing a translucent rigid substrate laminate according to the present invention, translucent rigid substrates are placed opposite to each other such that bonding surfaces thereof are parallel to each other, both rigid substrates are brought toward each other while being kept parallel, the both rigid substrates are preliminarily bonded using a photo-curable fixing agent, the bonded translucent rigid substrates are roll-pressed, and the fixing agent is then cured.Type: ApplicationFiled: June 1, 2011Publication date: April 4, 2013Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHAInventors: Hiroyuki Kurimura, Tomoyuki Kanai, Isamu Ichikawa, Gosuke Nakajima, Hayato Miyazaki, Yasunori Hayashi, Kenji Tanaka
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Publication number: 20120205043Abstract: Provided is an adhesive (meth)acrylic resin composition being high in adhesiveness and capable of affording an adhered body which can be used at high temperatures of 250° C. or higher, and possessing low outgassing property and heat resistance. A (meth)acrylic resin composition including (A) a polyfunctional (meth)acrylate, and (B) a photopolymerization initiator that exhibits a mass loss on heating of 15% by mass or less when increasing temperature from 30° C. to 250° C. at a temperature increase rate of 10° C./min. under nitrogen flow, wherein the glass transition temperature of a cured body obtained from the composition is 250° C. or higher.Type: ApplicationFiled: October 20, 2010Publication date: August 16, 2012Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHAInventors: Hiroyuki Kurimura, Isamu Ichikawa, Takayuki Nagumo, Takako Hoshino, Jun Watanabe
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Publication number: 20110111253Abstract: In a plated member (3) that has a pure Sn plating layer (2) of a lead-free material on a surface of a base material 1, the orientation indices of a (101) plane and a (112) plane of the pure Sn plating layer are increased to values higher than the orientation indices of the other crystal orientation planes.Type: ApplicationFiled: June 18, 2009Publication date: May 12, 2011Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Yasufumi Shibata, Takashi Nomura, Shigeru Konda, Mitsuru Sakano, Isamu Ichikawa, Katsuhito Azuma, Junichi Honda, Satoshi Mizutani
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Patent number: 4553696Abstract: An air flow rate sensor and throttle valve which controls the opening of a duct in accordance with the detection signals from the air flow rate sensor are provided in a control duct between a supply chamber utilizing double ceilings and the air diffusers in the supply chamber. The quantities of air fed from the respective air diffusers can be equalized or can be set to the desired values. In this case, since the air blowing can be automatically controlled for each diffuser, it is not necessary to individually adjust the quantities of air for the respective air diffusers after the installation of the air conditioner, thereby eliminating the adjusting works of the air diffusers.Type: GrantFiled: September 30, 1982Date of Patent: November 19, 1985Assignee: Topre CorporationInventors: Isamu Ichikawa, Yutaka Fukushi, Keiji Kamata, Hikoshiro Suzuki