Abstract: To provide a minute foreign matter analysis method and device wherein the observation, analysis and estimation of minute foreign matter is permitted by linking the device coordinate of a particle inspection device and those of other analysis devices with by far higher accuracy.

Abstract: To enable observation, analysis and evaluation of minute foreign substances by adopting a method for enabling performance of linkage between equipment coordinates of a particle examination equipment and apparatus coordinates of an analyzing apparatus such as SEM which is not a particle examination equipment with a precision higher than that with which coordinate linkage is performed between conventional equipment and apparatus coordinates. An analyzing method for analyzing minute foreign substances comprises the steps of determining the position of a minute foreign substance on the surface of a sample in a particle examination equipment, transferring the sample to a coordinate stage of an analyzing apparatus and inputting the position of the minute foreign substance determined by the particle examination equipment to thereby analyze the contents of this minute foreign substance.

Abstract: To provide a minute foreign matter analysis method and device wherein the observation, analysis and estimation of minute foreign matter is permitted by linking the device coordinate of a particle inspection device and those of other analysis devices with by far higher accuracy.

Abstract: To enable observation, analysis and evaluation of minute foreign substances by adopting a method for enabling performance of linkage between equipment coordinates of a particle examination equipment and apparatus coordinates of an analyzing apparatus such as SEM which is not a particle examination equipment with a precision higher than that with which coordinate linkage is performed between conventional equipment and apparatus coordinates. An analyzing method for analyzing minute foreign substances includes the steps of determining the position of a minute foreign substance on the surface of a sample in a particle examination equipment, transferring the sample to a coordinate stage of an analyzing apparatus and inputting the position of the minute foreign substance determined by the particle examination equipment to thereby analyze the contents of this minute foreign substance.

Abstract: An object of the present invention is to provide a method of recovering the insulation by means of simple steps rapidly and easily at low cost, and paints used therefor. For that purpose, the insulating paint of the present invention which comprises an electric insulation film forming agent and an ion-exchangeable material is applied on the part of a printed circuit board where the insulation was lowered or is expected to be lowered.

Abstract: Methods wherein a partial region of a fine foreign matter which is detected first in a particle counter is detected again, observed, analyzed and evaluated by irradiating a spot of beam light to the region, observing a scattered light from a dark field or a dark part in the spot from a blight field, a coordinate of the analyzer being linked with a coordinate of the partial counter and registered in the analyzer. Thereby semiconductor devices or liquid crystal display devices are inspected accurately and immediately.

Abstract: Method for detecting and examining a slightly irregular surface state is provided which includes the steps of: illuminating a surface of a sample with light beam for detecting the slightly irregular surface state; observing a variation of the light beam occurring due to the slightly irregular surface state to specify the location of the slightly irregular surface state in an x-y plane of the sample; making the location of a probe needle of a scanning probe microscope and the location of the slightly irregular surface state on the sample coincide with each other; and measuring a three-dimensional image of the slightly irregular surface state by means of the scanning probe microscope. The scanning probe microscope for use in the aforementioned method and a method for fabricating a semiconductor device or a liquid crystal display device which utilizes the aforementioned method are also provided.