Abstract: A self-aligned TFT array for liquid crystal display devices and a method of manufacturing the array are disclosed. A protective insulating layer on a semiconductor layer is exactly aligned with a gate electrode. A self-alignment method is used for patterning the protective insulating layer and an impurity-doped semiconductor layer on the semiconductor layer. No lift-off process is necessary.

Abstract: A self-aligned TFT array for liquid crystal display devices and a method of manufacturing the array are disclosed. A protective insulating layer on a semiconductor layer is exactly aligned with a gate electrode. A self-alignment method is used for patterning the protective insulating layer and an impurity-doped semiconductor layer on the semiconductor layer. No lift-off process is necessary.

Abstract: A self-aligned TFT array for liquid-crystal display devices and a method of manufacturing the array are disclosed. A protective insulating layer on a semiconductor layer is exactly aligned with a gate electrode. A self-alignment method is used for patterning the protective insulating layer and an impurity-doped semiconductor layer on the semiconductor layer. No lift-off process is necessary.

Abstract: In a step for bonding a color filter to a solid-state color-image sensor chip with an adhesive which is curable not only by light or more particularly ultraviolet-ray irradiation but also by heating, pre-curing or partial curing is effected by irradiating light rays after the color filter and the chip has been pressed against each other and correctly aligned with each other in a bonding device and then the chip with the partially-bonded color filter is removed from the bonding device and complete curing of the adhesive is accomplished by heating. According to one embodiment of the present invention the bonding step is carried out in an atmosphere containing the oxygen so that the adhesive which has been squeezed out from the space between the color filter and the chip may be prevented from being cured and subsequently removed in a simple manner.

Abstract: A method suitable for connecting a plurality of metal leads at the same time with electrodes of a semiconductor device. Metal leads are provided each of which has a metal bump bonded thereto. The metal of the metal bump is softer than that of the lead. Those metal leads are located above the semiconductor device so that the bumps are contacted with the electrodes and then the bumps are bonded to the electrodes by heating, whereby the metal leads are connected with the electrodes.

Abstract: Proposed is a method for manufacturing a color filter having the steps of: forming a stripe- or lattice-shaped light-shield pattern on one major surface of a transparent glass substrate; forming a photosensitive base film on the same major surface of the glass substrate on which the light-shield pattern is formed; exposing the photosensitive base film by light radiated from the other major surface of the glass substrate, using the light-shield pattern as a mask, developing the base film to remove a nonexposed portion of the photosensitive base film immediately above the light-shield pattern and to divide the photosensitive base film along the light-shield pattern; and selectively dyeing divided base film portions to form color layers.

Abstract: In a step for bonding a color filter to a solid-state image sensor so as to provide a color-sensitive image sensor (to be referred to as "a color-image sensor" in this specification), a method for bonding the color filter to the image sensor with an adhesive which is curable by ultraviolet radiation and also the constructions of color filters and image sensors which can facilitate the bonding step.

Abstract: In a step for bonding a color filter to a solid-state color-image sensor chip with an adhesive which is curable not only by light or more particularly ultraviolet-ray irradiation but also by heating, pre-curing or partial curing is effected by irradiating light rays after the color filter and the chip has been pressed against each other and correctly aligned with each other in a bonding device and then the chip with the partially-bonded color filter is removed from the bonding device and complete curing of the adhesive is accomplished by heating. According to one embodiment of the present invention the bonding step is carried out in an atmosphere containing the oxygen so that the adhesive which has been squeezed out from the space between the color filter and the clip may be prevented from being cured and subsequently removed in a simple manner.