Patents by Inventor Isamu Matumoto

Isamu Matumoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10022797
    Abstract: A method for manufacturing a three-dimensional shaped object wherein the warping of the base plate is suitably addressed. The method of the present invention comprises: (i) forming a solidified layer by irradiating a predetermined portion of a powder layer on a base plate with a light beam, thereby allowing sintering of the powder of the predetermined portion or melting and subsequent solidification thereof; and (ii) forming another solidified layer by newly forming a powder layer on the resulting solidified layer, and then irradiating another predetermined portion of the new powder layer with the light beam, the steps (i) and (ii) being repeatedly performed; wherein, prior to or upon the manufacturing of the three-dimensional shaped object, the base plate is subjected to a heat treatment, thereby causing the base plate to be warped, and at least a lower surface of the warped base plate is subjected to a flattening process.
    Type: Grant
    Filed: February 16, 2011
    Date of Patent: July 17, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Satoshi Abe, Norio Yoshida, Isao Fuwa, Yoshikazu Higashi, Masataka Takenami, Isamu Matumoto
  • Publication number: 20120308781
    Abstract: A method for manufacturing a three-dimensional shaped object wherein the warping of the base plate is suitably addressed. The method of the present invention comprises: (i) forming a solidified layer by irradiating a predetermined portion of a powder layer on a base plate with a light beam, thereby allowing sintering of the powder of the predetermined portion or melting and subsequent solidification thereof; and (ii) forming another solidified layer by newly forming a powder layer on the resulting solidified layer, and then irradiating another predetermined portion of the new powder layer with the light beam, the steps (i) and (ii) being repeatedly performed; wherein, prior to or upon the manufacturing of the three-dimensional shaped object, the base plate is subjected to a heat treatment, thereby causing the base plate to be warped, and at least a lower surface of the warped base plate is subjected to a flattening process.
    Type: Application
    Filed: February 16, 2011
    Publication date: December 6, 2012
    Applicant: PANASONIC CORPORATION
    Inventors: Satoshi Abe, Norio Yoshida, Isao Fuwa, Yoshikazu Higashi, Masataka Takenami, Isamu Matumoto
  • Patent number: 6349582
    Abstract: A die system for full enclosed die forging with an enclosed cavity (1a, 2a) is formed between an upper die (1) attached to the side of a slide (6) and a lower die (2) mounted to the side of a bolster (17). A workpiece stock (7) disposed in the cavity is pressurized to be diverted with an upper counter-punch (8) in the upper die and a lower counter-punch (22) in the lower die and is thereby forged within the confines of the cavity. A pressure means (11, 19) is disposed above the upper die (1) and/or below the lower die (2) for applying pressure to at least one of the upper and lower dies (1, 2) from at least one of their upper and lower sides to act to enclose or close the cavity (1a, 2a) unilaterally or bilaterally.
    Type: Grant
    Filed: April 30, 1999
    Date of Patent: February 26, 2002
    Assignee: Komatsu, Ltd.
    Inventors: Kunihiko Tanaka, Isamu Matumoto
  • Publication number: 20010037669
    Abstract: A die system for full enclosed die forging with an enclosed cavity (1a, 2a) is formed between an upper die (1) attached to the side of a slide (6) and a lower die (2) mounted to the side of a bolster (17). A workpiece stock (7) disposed in the cavity is pressurized to be diverted with an upper counter-punch (8) in the upper die and a lower counter-punch (22) in the lower die and is thereby forged within the confines of the cavity. A pressure means (11, 19) is disposed above the upper die (1) and/or below the lower die (2) for applying pressure to at least one of the upper and lower dies (1, 2) from at least one of their upper and lower sides to act to enclose or close the cavity (1a, 2a) unilaterally or bilaterally.
    Type: Application
    Filed: April 30, 1999
    Publication date: November 8, 2001
    Inventors: KUNIHIKO TANAKA, ISAMU MATUMOTO