Patents by Inventor Isamu Miyamoto
Isamu Miyamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240084458Abstract: A substrate processing apparatus includes: a mixer configured to mix sulfuric acid as a first component and a second component different from the first component to prepare an etchant; a nozzle configured to eject the etchant to a substrate; a first component supplier including a first flow path that supplies the first component to the mixer, a first instantaneous flowmeter and a first flow rate controller provided in the first flow path; a second component supplier including a second flow path different from the first flow path and configured to supply the second component to the mixer, a second instantaneous flowmeter and a second flow rate controller provided in the second flow path; and a controller configured to control the first and second flow rate controllers using average flow rates of the first component and the second component during the ejection of the etchant to the substrate.Type: ApplicationFiled: November 22, 2023Publication date: March 14, 2024Inventors: Takashi NAKAZAWA, Isamu MIYAMOTO, Keigo SATAKE, Kenji NAKAMIZO
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Patent number: 11905603Abstract: A substrate processing apparatus includes: a mixer configured to mix sulfuric acid as a first component and a second component different from the first component to prepare an etchant; a nozzle configured to eject the etchant to a substrate; a first component supplier including a first flow path that supplies the first component to the mixer, a first instantaneous flowmeter and a first flow rate controller provided in the first flow path; a second component supplier including a second flow path different from the first flow path and configured to supply the second component to the mixer, a second instantaneous flowmeter and a second flow rate controller provided in the second flow path; and a controller configured to control the first and second flow rate controllers using average flow rates of the first component and the second component during the ejection of the etchant to the substrate.Type: GrantFiled: December 17, 2021Date of Patent: February 20, 2024Assignee: TOKYO ELECTRON LIMITEDInventors: Takashi Nakazawa, Isamu Miyamoto, Keigo Satake, Kenji Nakamizo
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Patent number: 11880213Abstract: A substrate liquid processing apparatus includes: at least one liquid pipe through which a processing liquid flows; a discharge nozzle configured to discharge the processing liquid supplied via the at least one liquid pipe; a valve mechanism configured to regulate a flow of the processing liquid in the at least one liquid pipe; and a liquid detection sensor configured to detect presence or absence of the processing liquid in the at least one liquid pipe, wherein in a state in which the valve mechanism is operating so that the processing liquid in the at least one liquid pipe is located at an upstream of a first pipe measurement site of the at least one liquid pipe, the liquid detection sensor detects the presence or absence of the processing liquid at the first pipe measurement site located at a first measurement point.Type: GrantFiled: May 14, 2021Date of Patent: January 23, 2024Assignee: Tokyo Electron LimitedInventors: Mikio Nakashima, Akinori Tanaka, Nobuhiro Ogata, Isamu Miyamoto
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Publication number: 20220195609Abstract: A substrate processing apparatus includes: a mixer configured to mix sulfuric acid as a first component and a second component different from the first component to prepare an etchant; a nozzle configured to eject the etchant to a substrate; a first component supplier including a first flow path that supplies the first component to the mixer, a first instantaneous flowmeter and a first flow rate controller provided in the first flow path; a second component supplier including a second flow path different from the first flow path and configured to supply the second component to the mixer, a second instantaneous flowmeter and a second flow rate controller provided in the second flow path; and a controller configured to control the first and second flow rate controllers using average flow rates of the first component and the second component during the ejection of the etchant to the substrate.Type: ApplicationFiled: December 17, 2021Publication date: June 23, 2022Inventors: Takashi NAKAZAWA, Isamu MIYAMOTO, Keigo SATAKE, Kenji NAKAMIZO
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Publication number: 20210365054Abstract: A substrate liquid processing apparatus includes: at least one liquid pipe through which a processing liquid flows; a discharge nozzle configured to discharge the processing liquid supplied via the at least one liquid pipe; a valve mechanism configured to regulate a flow of the processing liquid in the at least one liquid pipe; and a liquid detection sensor configured to detect presence or absence of the processing liquid in the at least one liquid pipe, wherein in a state in which the valve mechanism is operating so that the processing liquid in the at least one liquid pipe is located at an upstream of a first pipe measurement site of the at least one liquid pipe, the liquid detection sensor detects the presence or absence of the processing liquid at the first pipe measurement site located at a first measurement point.Type: ApplicationFiled: May 14, 2021Publication date: November 25, 2021Inventors: Mikio NAKASHIMA, Akinori TANAKA, Nobuhiro OGATA, Isamu MIYAMOTO
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Publication number: 20210257236Abstract: A measurement processing process S103 of measuring a cut width of a film based on an image obtained by imaging, with an imaging unit 270, a peripheral portion of a substrate which is processed based on a substrate processing recipe; a creation process S602 of creating a management list in which a set value of the cut width of the film, a measurement value of the cut width of the film measured through the measurement processing process and time information at which the measurement result is obtained are correlated; an analysis process S603 (S606) of analyzing a state of the processed substrate based on the created management list; and a notification process S605 (S608, S609) of making a preset notification to a user based on an analysis result obtained through the analysis process are provided.Type: ApplicationFiled: April 28, 2021Publication date: August 19, 2021Inventors: Yoshifumi Amano, Satoshi Morita, Ryoji Ikebe, Isamu Miyamoto
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Patent number: 11018035Abstract: A measurement processing process S103 of measuring a cut width of a film based on an image obtained by imaging, with an imaging unit 270, a peripheral portion of a substrate which is processed based on a substrate processing recipe; a creation process S602 of creating a management list in which a set value of the cut width of the film, a measurement value of the cut width of the film measured through the measurement processing process and time information at which the measurement result is obtained are correlated; an analysis process S603 (S606) of analyzing a state of the processed substrate based on the created management list; and a notification process S605 (S608, S609) of making a preset notification to a user based on an analysis result obtained through the analysis process are provided.Type: GrantFiled: October 9, 2018Date of Patent: May 25, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Yoshifumi Amano, Satoshi Morita, Ryoji Ikebe, Isamu Miyamoto
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Patent number: 11011436Abstract: Whether a film on a peripheral portion of a substrate is appropriately removed is rapidly determined without depending on a kind of the film on the peripheral portion to be removed. An acquisition process S502 of acquiring information upon the kind of the film of the substrate; a selection process S503 of selecting a measurement setting corresponding to the acquired kind of the film from a table for measurement settings previously stored in a storage unit; a control process S504 of controlling an imaging unit 270 to image the peripheral portion of the substrate by using the measurement setting selected in the selection process are provided.Type: GrantFiled: March 9, 2017Date of Patent: May 18, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Yoshifumi Amano, Satoshi Morita, Ryoji Ikebe, Isamu Miyamoto
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Patent number: 10217628Abstract: Imaging can be performed well even when an imaging device is disposed at a position facing a peripheral portion of a substrate. A substrate processing apparatus 16 which performs a processing of removing a film on a peripheral portion of a substrate W includes a rotating/holding unit 210 configured to hold and rotate the substrate; a first processing liquid supply unit 250A configured to supply a first processing liquid for removing the film onto the peripheral portion of the substrate while the substrate is being rotated in a first rotational direction R1 by the rotating/holding unit; and an imaging unit 270 provided at a position in front of an arrival region 902 of the first processing liquid on the substrate with respect to the first rotational direction R1, and configured to image the peripheral portion of the substrate.Type: GrantFiled: March 9, 2017Date of Patent: February 26, 2019Assignee: TOKYO ELECTRON LIMITEDInventors: Yoshifumi Amano, Satoshi Morita, Ryoji Ikebe, Isamu Miyamoto
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Publication number: 20190043742Abstract: A measurement processing process S103 of measuring a cut width of a film based on an image obtained by imaging, with an imaging unit 270, a peripheral portion of a substrate which is processed based on a substrate processing recipe; a creation process S602 of creating a management list in which a set value of the cut width of the film, a measurement value of the cut width of the film measured through the measurement processing process and time information at which the measurement result is obtained are correlated; an analysis process S603 (S606) of analyzing a state of the processed substrate based on the created management list; and a notification process S605 (S608, S609) of making a preset notification to a user based on an analysis result obtained through the analysis process are provided.Type: ApplicationFiled: October 9, 2018Publication date: February 7, 2019Inventors: Yoshifumi Amano, Satoshi Morita, Ryoji Ikebe, Isamu Miyamoto
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Patent number: 10128137Abstract: A measurement processing process S103 of measuring a cut width of a film based on an image obtained by imaging, with an imaging unit 270, a peripheral portion of a substrate which is processed based on a substrate processing recipe; a creation process S602 of creating a management list in which a set value of the cut width of the film, a measurement value of the cut width of the film measured through the measurement processing process and time information at which the measurement result is obtained are correlated; an analysis process S603 (S606) of analyzing a state of the processed substrate based on the created management list; and a notification process S605 (S608, S609) of making a preset notification to a user based on an analysis result obtained through the analysis process are provided.Type: GrantFiled: March 9, 2017Date of Patent: November 13, 2018Assignee: TOKYO ELECTRON LIMITEDInventors: Yoshifumi Amano, Satoshi Morita, Ryoji Ikebe, Isamu Miyamoto
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Publication number: 20170287750Abstract: A measurement processing process S103 of measuring a cut width of a film based on an image obtained by imaging, with an imaging unit 270, a peripheral portion of a substrate which is processed based on a substrate processing recipe; a creation process S602 of creating a management list in which a set value of the cut width of the film, a measurement value of the cut width of the film measured through the measurement processing process and time information at which the measurement result is obtained are correlated; an analysis process S603 (S606) of analyzing a state of the processed substrate based on the created management list; and a notification process S605 (S608, S609) of making a preset notification to a user based on an analysis result obtained through the analysis process are provided.Type: ApplicationFiled: March 9, 2017Publication date: October 5, 2017Inventors: Yoshifumi Amano, Satoshi Morita, Ryoji Ikebe, Isamu Miyamoto
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Publication number: 20170287704Abstract: Whether a film on a peripheral portion of a substrate is appropriately removed is rapidly determined without depending on a kind of the film on the peripheral portion to be removed. An acquisition process S502 of acquiring information upon the kind of the film of the substrate; a selection process S503 of selecting a measurement setting corresponding to the acquired kind of the film from a table for measurement settings previously stored in a storage unit; a control process S504 of controlling an imaging unit 270 to image the peripheral portion of the substrate by using the measurement setting selected in the selection process are provided.Type: ApplicationFiled: March 9, 2017Publication date: October 5, 2017Inventors: Yoshifumi Amano, Satoshi Morita, Ryoji Ikebe, Isamu Miyamoto
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Publication number: 20170287703Abstract: Imaging can be performed well even when an imaging device is disposed at a position facing a peripheral portion of a substrate. A substrate processing apparatus 16 which performs a processing of removing a film on a peripheral portion of a substrate W includes a rotating/holding unit 210 configured to hold and rotate the substrate; a first processing liquid supply unit 250A configured to supply a first processing liquid for removing the film onto the peripheral portion of the substrate while the substrate is being rotated in a first rotational direction R1 by the rotating/holding unit; and an imaging unit 270 provided at a position in front of an arrival region 902 of the first processing liquid on the substrate with respect to the first rotational direction R1, and configured to image the peripheral portion of the substrate.Type: ApplicationFiled: March 9, 2017Publication date: October 5, 2017Inventors: Yoshifumi Amano, Satoshi Morita, Ryoji Ikebe, Isamu Miyamoto
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Patent number: 8244439Abstract: The compaction vehicle having a speed adjustment member, a displacement detector, and a drive source controller further includes a calculation device between the displacement detector and the drive source controller, receiving the displacement S, and outputting a signal I calculated to the controller; a running speed setting switch for the operator operating ON at a desired running speed; a control signal memory device provided inside the calculation device and memorizing a signal I1 to the controller. In a normal operation, the calculation device outputs the signal I to the controller so that a running speed increases or decreases according to the displacement S, and when the switch is operated to ON, the calculation device maintains the ON state, and the displacement S is not less than a predetermined value, the calculation device outputs the signal I1 memorized in the memory device so as that the vehicle will run at a constant speed.Type: GrantFiled: August 27, 2008Date of Patent: August 14, 2012Assignee: Sakai Heavy Industries Ltd.Inventors: Sadayoshi Suzuki, Isamu Miyamoto, Shinnosuke Tanaka
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Patent number: 7689342Abstract: The compaction vehicle having a speed adjustment member, a displacement detector, and a drive source controller further includes a calculation device between the displacement detector and the drive source controller, receiving the displacement S, and outputting a signal I calculated to the controller; a running speed setting switch for the operator operating ON at a desired running speed; a control signal memory device provided inside the calculation device and memorizing a signal I1 to the controller, wherein in a normal operation the calculation device outputs the signal I to the controller so that a running speed increases or decreases according to the displacement S, and wherein when the switch is operated to ON, the calculation device maintains the ON state, and the displacement S is not less than a predetermined value, the calculation device outputs the signal I1 memorized in the memory device so as to run the vehicle at a constant speed.Type: GrantFiled: August 4, 2006Date of Patent: March 30, 2010Assignee: Sakai Heavy Industries Ltd.Inventors: Sadayoshi Suzuki, Isamu Miyamoto, Shinnosuke Tanaka
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Publication number: 20090005940Abstract: The compaction vehicle having a speed adjustment member, a displacement detector, and a drive source controller further includes a calculation device between the displacement detector and the drive source controller, receiving the displacement S, and outputting a signal I calculated to the controller; a running speed setting switch for the operator operating ON at a desired running speed; a control signal memory device provided inside the calculation device and memorizing a signal I1 to the controller. In a normal operation, the calculation device outputs the signal I to the controller so that a running speed increases or decreases according to the displacement S, and when the switch is operated to ON, the calculation device maintains the ON state, and the displacement S is not less than a predetermined value, the calculation device outputs the signal I1 memorized in the memory device so as that the vehicle will run at a constant speed.Type: ApplicationFiled: August 27, 2008Publication date: January 1, 2009Applicant: Sakai Heavy Industries, Ltd.Inventors: Sadayoshi Suzuki, Isamu Miyamoto, Shinnosuke Tanaka
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Publication number: 20070032934Abstract: The compaction vehicle having a speed adjustment member, a displacement detector, and a drive source controller further includes a calculation device between the displacement detector and the drive source controller, receiving the displacement S, and outputting a signal I calculated to the controller; a running speed setting switch for the operator operating ON at a desired running speed; a control signal memory device provided inside the calculation device and memorizing a signal I1 to the controller, wherein in a normal operation the calculation device outputs the signal I to the controller so that a running speed increases or decreases according to the displacement S, and wherein when the switch is operated to ON, the calculation device maintains the ON state, and the displacement S is not less than a predetermined value, the calculation device outputs the signal I1 memorized in the memory device so as to run the vehicle at a constant speed.Type: ApplicationFiled: August 4, 2006Publication date: February 8, 2007Applicant: SAKAI Heavy Industries Ltd.Inventors: Sadayoshi Suzuki, Isamu Miyamoto, Shinnosuke Tanaka
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Patent number: 7063743Abstract: The present invention teaches an apparatus for pulling a single crystal, whereby a radial temperature gradient of a seed crystal and/or a neck is reduced to a minimum so as to inhibit occurrence of thermal stress and prevent induction of dislocations, thereby resulting in an improvement in dislocation-free rate of single crystals to be pulled in cases where a single crystal is pulled with a seed crystal and/or a neck being heated using an auxiliary heating device. The apparatus comprises a crucible to be charged with a melt, a heater located around the crucible, and an auxiliary heating device including a heating section which can be located so as to surround a seed crystal in a position near and above the melt, a transfer mechanism for withdrawing the heating section from a passing area of a single crystal, and a covering section to cover a clearance between the heating section and the seed crystal extending from the heating section.Type: GrantFiled: April 9, 2004Date of Patent: June 20, 2006Assignee: Sumitomo Mitsubishi Silicon CorporationInventors: Hideki Watanabe, Isamu Miyamoto, Toshiyuki Fujiwara
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Publication number: 20040206301Abstract: The present invention teaches an apparatus for pulling a single crystal, whereby the radial temperature gradient of a seed crystal and/or a neck is reduced to a minimum so as to inhibit the occurrence of thermal stress and prevent induction of dislocations, resulting in an improvement in dislocation-free rate of single crystals to be pulled in cases where a single crystal is pulled with the seed crystal and/or the neck being heated using an auxiliary heating device, comprising a crucible charged with a melt, a heater located around the crucible and an auxiliary heating device including a heating section which can be located so as to surround a seed crystal in a position near above the melt and a transfer mechanism for withdrawing the heating section from a passing area of a single crystal, wherein a covering section to cover a clearance between the heating section and the seed crystal is extended from the heating section.Type: ApplicationFiled: April 9, 2004Publication date: October 21, 2004Inventors: Hideki Watanabe, Isamu Miyamoto, Toshiyuki Fujiwara, Shuichi Inami