Patents by Inventor Isamu Miyamoto

Isamu Miyamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240084458
    Abstract: A substrate processing apparatus includes: a mixer configured to mix sulfuric acid as a first component and a second component different from the first component to prepare an etchant; a nozzle configured to eject the etchant to a substrate; a first component supplier including a first flow path that supplies the first component to the mixer, a first instantaneous flowmeter and a first flow rate controller provided in the first flow path; a second component supplier including a second flow path different from the first flow path and configured to supply the second component to the mixer, a second instantaneous flowmeter and a second flow rate controller provided in the second flow path; and a controller configured to control the first and second flow rate controllers using average flow rates of the first component and the second component during the ejection of the etchant to the substrate.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 14, 2024
    Inventors: Takashi NAKAZAWA, Isamu MIYAMOTO, Keigo SATAKE, Kenji NAKAMIZO
  • Patent number: 11905603
    Abstract: A substrate processing apparatus includes: a mixer configured to mix sulfuric acid as a first component and a second component different from the first component to prepare an etchant; a nozzle configured to eject the etchant to a substrate; a first component supplier including a first flow path that supplies the first component to the mixer, a first instantaneous flowmeter and a first flow rate controller provided in the first flow path; a second component supplier including a second flow path different from the first flow path and configured to supply the second component to the mixer, a second instantaneous flowmeter and a second flow rate controller provided in the second flow path; and a controller configured to control the first and second flow rate controllers using average flow rates of the first component and the second component during the ejection of the etchant to the substrate.
    Type: Grant
    Filed: December 17, 2021
    Date of Patent: February 20, 2024
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Takashi Nakazawa, Isamu Miyamoto, Keigo Satake, Kenji Nakamizo
  • Patent number: 11880213
    Abstract: A substrate liquid processing apparatus includes: at least one liquid pipe through which a processing liquid flows; a discharge nozzle configured to discharge the processing liquid supplied via the at least one liquid pipe; a valve mechanism configured to regulate a flow of the processing liquid in the at least one liquid pipe; and a liquid detection sensor configured to detect presence or absence of the processing liquid in the at least one liquid pipe, wherein in a state in which the valve mechanism is operating so that the processing liquid in the at least one liquid pipe is located at an upstream of a first pipe measurement site of the at least one liquid pipe, the liquid detection sensor detects the presence or absence of the processing liquid at the first pipe measurement site located at a first measurement point.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: January 23, 2024
    Assignee: Tokyo Electron Limited
    Inventors: Mikio Nakashima, Akinori Tanaka, Nobuhiro Ogata, Isamu Miyamoto
  • Publication number: 20220195609
    Abstract: A substrate processing apparatus includes: a mixer configured to mix sulfuric acid as a first component and a second component different from the first component to prepare an etchant; a nozzle configured to eject the etchant to a substrate; a first component supplier including a first flow path that supplies the first component to the mixer, a first instantaneous flowmeter and a first flow rate controller provided in the first flow path; a second component supplier including a second flow path different from the first flow path and configured to supply the second component to the mixer, a second instantaneous flowmeter and a second flow rate controller provided in the second flow path; and a controller configured to control the first and second flow rate controllers using average flow rates of the first component and the second component during the ejection of the etchant to the substrate.
    Type: Application
    Filed: December 17, 2021
    Publication date: June 23, 2022
    Inventors: Takashi NAKAZAWA, Isamu MIYAMOTO, Keigo SATAKE, Kenji NAKAMIZO
  • Publication number: 20210365054
    Abstract: A substrate liquid processing apparatus includes: at least one liquid pipe through which a processing liquid flows; a discharge nozzle configured to discharge the processing liquid supplied via the at least one liquid pipe; a valve mechanism configured to regulate a flow of the processing liquid in the at least one liquid pipe; and a liquid detection sensor configured to detect presence or absence of the processing liquid in the at least one liquid pipe, wherein in a state in which the valve mechanism is operating so that the processing liquid in the at least one liquid pipe is located at an upstream of a first pipe measurement site of the at least one liquid pipe, the liquid detection sensor detects the presence or absence of the processing liquid at the first pipe measurement site located at a first measurement point.
    Type: Application
    Filed: May 14, 2021
    Publication date: November 25, 2021
    Inventors: Mikio NAKASHIMA, Akinori TANAKA, Nobuhiro OGATA, Isamu MIYAMOTO
  • Publication number: 20210257236
    Abstract: A measurement processing process S103 of measuring a cut width of a film based on an image obtained by imaging, with an imaging unit 270, a peripheral portion of a substrate which is processed based on a substrate processing recipe; a creation process S602 of creating a management list in which a set value of the cut width of the film, a measurement value of the cut width of the film measured through the measurement processing process and time information at which the measurement result is obtained are correlated; an analysis process S603 (S606) of analyzing a state of the processed substrate based on the created management list; and a notification process S605 (S608, S609) of making a preset notification to a user based on an analysis result obtained through the analysis process are provided.
    Type: Application
    Filed: April 28, 2021
    Publication date: August 19, 2021
    Inventors: Yoshifumi Amano, Satoshi Morita, Ryoji Ikebe, Isamu Miyamoto
  • Patent number: 11018035
    Abstract: A measurement processing process S103 of measuring a cut width of a film based on an image obtained by imaging, with an imaging unit 270, a peripheral portion of a substrate which is processed based on a substrate processing recipe; a creation process S602 of creating a management list in which a set value of the cut width of the film, a measurement value of the cut width of the film measured through the measurement processing process and time information at which the measurement result is obtained are correlated; an analysis process S603 (S606) of analyzing a state of the processed substrate based on the created management list; and a notification process S605 (S608, S609) of making a preset notification to a user based on an analysis result obtained through the analysis process are provided.
    Type: Grant
    Filed: October 9, 2018
    Date of Patent: May 25, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yoshifumi Amano, Satoshi Morita, Ryoji Ikebe, Isamu Miyamoto
  • Patent number: 11011436
    Abstract: Whether a film on a peripheral portion of a substrate is appropriately removed is rapidly determined without depending on a kind of the film on the peripheral portion to be removed. An acquisition process S502 of acquiring information upon the kind of the film of the substrate; a selection process S503 of selecting a measurement setting corresponding to the acquired kind of the film from a table for measurement settings previously stored in a storage unit; a control process S504 of controlling an imaging unit 270 to image the peripheral portion of the substrate by using the measurement setting selected in the selection process are provided.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: May 18, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yoshifumi Amano, Satoshi Morita, Ryoji Ikebe, Isamu Miyamoto
  • Patent number: 10217628
    Abstract: Imaging can be performed well even when an imaging device is disposed at a position facing a peripheral portion of a substrate. A substrate processing apparatus 16 which performs a processing of removing a film on a peripheral portion of a substrate W includes a rotating/holding unit 210 configured to hold and rotate the substrate; a first processing liquid supply unit 250A configured to supply a first processing liquid for removing the film onto the peripheral portion of the substrate while the substrate is being rotated in a first rotational direction R1 by the rotating/holding unit; and an imaging unit 270 provided at a position in front of an arrival region 902 of the first processing liquid on the substrate with respect to the first rotational direction R1, and configured to image the peripheral portion of the substrate.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: February 26, 2019
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yoshifumi Amano, Satoshi Morita, Ryoji Ikebe, Isamu Miyamoto
  • Publication number: 20190043742
    Abstract: A measurement processing process S103 of measuring a cut width of a film based on an image obtained by imaging, with an imaging unit 270, a peripheral portion of a substrate which is processed based on a substrate processing recipe; a creation process S602 of creating a management list in which a set value of the cut width of the film, a measurement value of the cut width of the film measured through the measurement processing process and time information at which the measurement result is obtained are correlated; an analysis process S603 (S606) of analyzing a state of the processed substrate based on the created management list; and a notification process S605 (S608, S609) of making a preset notification to a user based on an analysis result obtained through the analysis process are provided.
    Type: Application
    Filed: October 9, 2018
    Publication date: February 7, 2019
    Inventors: Yoshifumi Amano, Satoshi Morita, Ryoji Ikebe, Isamu Miyamoto
  • Patent number: 10128137
    Abstract: A measurement processing process S103 of measuring a cut width of a film based on an image obtained by imaging, with an imaging unit 270, a peripheral portion of a substrate which is processed based on a substrate processing recipe; a creation process S602 of creating a management list in which a set value of the cut width of the film, a measurement value of the cut width of the film measured through the measurement processing process and time information at which the measurement result is obtained are correlated; an analysis process S603 (S606) of analyzing a state of the processed substrate based on the created management list; and a notification process S605 (S608, S609) of making a preset notification to a user based on an analysis result obtained through the analysis process are provided.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: November 13, 2018
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yoshifumi Amano, Satoshi Morita, Ryoji Ikebe, Isamu Miyamoto
  • Publication number: 20170287750
    Abstract: A measurement processing process S103 of measuring a cut width of a film based on an image obtained by imaging, with an imaging unit 270, a peripheral portion of a substrate which is processed based on a substrate processing recipe; a creation process S602 of creating a management list in which a set value of the cut width of the film, a measurement value of the cut width of the film measured through the measurement processing process and time information at which the measurement result is obtained are correlated; an analysis process S603 (S606) of analyzing a state of the processed substrate based on the created management list; and a notification process S605 (S608, S609) of making a preset notification to a user based on an analysis result obtained through the analysis process are provided.
    Type: Application
    Filed: March 9, 2017
    Publication date: October 5, 2017
    Inventors: Yoshifumi Amano, Satoshi Morita, Ryoji Ikebe, Isamu Miyamoto
  • Publication number: 20170287704
    Abstract: Whether a film on a peripheral portion of a substrate is appropriately removed is rapidly determined without depending on a kind of the film on the peripheral portion to be removed. An acquisition process S502 of acquiring information upon the kind of the film of the substrate; a selection process S503 of selecting a measurement setting corresponding to the acquired kind of the film from a table for measurement settings previously stored in a storage unit; a control process S504 of controlling an imaging unit 270 to image the peripheral portion of the substrate by using the measurement setting selected in the selection process are provided.
    Type: Application
    Filed: March 9, 2017
    Publication date: October 5, 2017
    Inventors: Yoshifumi Amano, Satoshi Morita, Ryoji Ikebe, Isamu Miyamoto
  • Publication number: 20170287703
    Abstract: Imaging can be performed well even when an imaging device is disposed at a position facing a peripheral portion of a substrate. A substrate processing apparatus 16 which performs a processing of removing a film on a peripheral portion of a substrate W includes a rotating/holding unit 210 configured to hold and rotate the substrate; a first processing liquid supply unit 250A configured to supply a first processing liquid for removing the film onto the peripheral portion of the substrate while the substrate is being rotated in a first rotational direction R1 by the rotating/holding unit; and an imaging unit 270 provided at a position in front of an arrival region 902 of the first processing liquid on the substrate with respect to the first rotational direction R1, and configured to image the peripheral portion of the substrate.
    Type: Application
    Filed: March 9, 2017
    Publication date: October 5, 2017
    Inventors: Yoshifumi Amano, Satoshi Morita, Ryoji Ikebe, Isamu Miyamoto
  • Patent number: 8244439
    Abstract: The compaction vehicle having a speed adjustment member, a displacement detector, and a drive source controller further includes a calculation device between the displacement detector and the drive source controller, receiving the displacement S, and outputting a signal I calculated to the controller; a running speed setting switch for the operator operating ON at a desired running speed; a control signal memory device provided inside the calculation device and memorizing a signal I1 to the controller. In a normal operation, the calculation device outputs the signal I to the controller so that a running speed increases or decreases according to the displacement S, and when the switch is operated to ON, the calculation device maintains the ON state, and the displacement S is not less than a predetermined value, the calculation device outputs the signal I1 memorized in the memory device so as that the vehicle will run at a constant speed.
    Type: Grant
    Filed: August 27, 2008
    Date of Patent: August 14, 2012
    Assignee: Sakai Heavy Industries Ltd.
    Inventors: Sadayoshi Suzuki, Isamu Miyamoto, Shinnosuke Tanaka
  • Patent number: 7689342
    Abstract: The compaction vehicle having a speed adjustment member, a displacement detector, and a drive source controller further includes a calculation device between the displacement detector and the drive source controller, receiving the displacement S, and outputting a signal I calculated to the controller; a running speed setting switch for the operator operating ON at a desired running speed; a control signal memory device provided inside the calculation device and memorizing a signal I1 to the controller, wherein in a normal operation the calculation device outputs the signal I to the controller so that a running speed increases or decreases according to the displacement S, and wherein when the switch is operated to ON, the calculation device maintains the ON state, and the displacement S is not less than a predetermined value, the calculation device outputs the signal I1 memorized in the memory device so as to run the vehicle at a constant speed.
    Type: Grant
    Filed: August 4, 2006
    Date of Patent: March 30, 2010
    Assignee: Sakai Heavy Industries Ltd.
    Inventors: Sadayoshi Suzuki, Isamu Miyamoto, Shinnosuke Tanaka
  • Publication number: 20090005940
    Abstract: The compaction vehicle having a speed adjustment member, a displacement detector, and a drive source controller further includes a calculation device between the displacement detector and the drive source controller, receiving the displacement S, and outputting a signal I calculated to the controller; a running speed setting switch for the operator operating ON at a desired running speed; a control signal memory device provided inside the calculation device and memorizing a signal I1 to the controller. In a normal operation, the calculation device outputs the signal I to the controller so that a running speed increases or decreases according to the displacement S, and when the switch is operated to ON, the calculation device maintains the ON state, and the displacement S is not less than a predetermined value, the calculation device outputs the signal I1 memorized in the memory device so as that the vehicle will run at a constant speed.
    Type: Application
    Filed: August 27, 2008
    Publication date: January 1, 2009
    Applicant: Sakai Heavy Industries, Ltd.
    Inventors: Sadayoshi Suzuki, Isamu Miyamoto, Shinnosuke Tanaka
  • Publication number: 20070032934
    Abstract: The compaction vehicle having a speed adjustment member, a displacement detector, and a drive source controller further includes a calculation device between the displacement detector and the drive source controller, receiving the displacement S, and outputting a signal I calculated to the controller; a running speed setting switch for the operator operating ON at a desired running speed; a control signal memory device provided inside the calculation device and memorizing a signal I1 to the controller, wherein in a normal operation the calculation device outputs the signal I to the controller so that a running speed increases or decreases according to the displacement S, and wherein when the switch is operated to ON, the calculation device maintains the ON state, and the displacement S is not less than a predetermined value, the calculation device outputs the signal I1 memorized in the memory device so as to run the vehicle at a constant speed.
    Type: Application
    Filed: August 4, 2006
    Publication date: February 8, 2007
    Applicant: SAKAI Heavy Industries Ltd.
    Inventors: Sadayoshi Suzuki, Isamu Miyamoto, Shinnosuke Tanaka
  • Patent number: 7063743
    Abstract: The present invention teaches an apparatus for pulling a single crystal, whereby a radial temperature gradient of a seed crystal and/or a neck is reduced to a minimum so as to inhibit occurrence of thermal stress and prevent induction of dislocations, thereby resulting in an improvement in dislocation-free rate of single crystals to be pulled in cases where a single crystal is pulled with a seed crystal and/or a neck being heated using an auxiliary heating device. The apparatus comprises a crucible to be charged with a melt, a heater located around the crucible, and an auxiliary heating device including a heating section which can be located so as to surround a seed crystal in a position near and above the melt, a transfer mechanism for withdrawing the heating section from a passing area of a single crystal, and a covering section to cover a clearance between the heating section and the seed crystal extending from the heating section.
    Type: Grant
    Filed: April 9, 2004
    Date of Patent: June 20, 2006
    Assignee: Sumitomo Mitsubishi Silicon Corporation
    Inventors: Hideki Watanabe, Isamu Miyamoto, Toshiyuki Fujiwara
  • Publication number: 20040206301
    Abstract: The present invention teaches an apparatus for pulling a single crystal, whereby the radial temperature gradient of a seed crystal and/or a neck is reduced to a minimum so as to inhibit the occurrence of thermal stress and prevent induction of dislocations, resulting in an improvement in dislocation-free rate of single crystals to be pulled in cases where a single crystal is pulled with the seed crystal and/or the neck being heated using an auxiliary heating device, comprising a crucible charged with a melt, a heater located around the crucible and an auxiliary heating device including a heating section which can be located so as to surround a seed crystal in a position near above the melt and a transfer mechanism for withdrawing the heating section from a passing area of a single crystal, wherein a covering section to cover a clearance between the heating section and the seed crystal is extended from the heating section.
    Type: Application
    Filed: April 9, 2004
    Publication date: October 21, 2004
    Inventors: Hideki Watanabe, Isamu Miyamoto, Toshiyuki Fujiwara, Shuichi Inami