Abstract: The invention concerns a lift-off process for patterning layers that are deposited and/or sputtered. The invention provides a two-layer resist and a patterning method using the resist. The patterning method can readily produce burr-free layers on a substrate. The method comprises the steps of: sequentially applying positive radiation-sensitive resin compositions 1 and 2 to form a two-layer laminate; subjecting the two-layer resist to single exposure and development to produce fine patterns having an undercut cross section; depositing and/or sputtering an organic or inorganic thin layer with use of the resist pattern as a mask; and lifting off the resist pattern to leave a pattern of the thin layer in desired shape.

Abstract: The invention concerns a lift-off process for patterning layers that are deposited and/or sputtered. The invention provides a two-layer resist and a patterning method using the resist. The patterning method can readily produce burr-free layers on a substrate.

Abstract: A semiconductor device is connected to a CPU, a memory and I/O devices to serve as a data transfer bridge for efficient data transfer between the memory and the I/O devices. A CPU interface and a plurality of I/O interfaces included in a bridge chip are connected through an internal bus to a memory interface included in the bridge chip. Each I/O interface has a read/write buffer and a DMAC. An arbiter included in the bridge chip determines a bus master for which data transfer is permitted in response to requests for data transfer from each of the CPU interface and the DMAC to the memory. Each of the I/O interfaces has a control function to skip part of areas in the memory when transferring data between the memory and the I/O interface.

Abstract: A positive-tone photosensitive resin composition for forming a thick film which is suitably used for photofabrication such as manufacture of circuit boards, a photosensitive resin film, and a method of forming a bump using the same. The photosensitive resin composition comprising (A) a novolac resin with a weight average molecular weight of 2,000-30,000, (B) a polyvinyl lower alkyl ether, (C) a polyphenol derivative compound with a molecular weight of 200-1,000, and (D) a compound containing a naphthoquinonediazido group.

Abstract: A microcomputer that is easy to use and connected direct to such memories as dynamic and static RAM's and to other peripheral circuits. The microcomputer has strobe signal output terminals CASH*, CASL* and RAS* for direct connection to a dynamic RAM, and chip select signal output terminals CS0* through CS6* for outputting a chip select signal in parallel with the output from the strobe signal output terminals. The microcomputer further includes address output terminals for outputting a non-multiplexed or multiplexed address signal as needed, and data I/O terminals for selectively outputting the address signal to comply with a multiple-bus interface scheme.

Abstract: A microcomputer that is easy to use and connected direct to such memories as dynamic and static RAM's and to other peripheral circuits. The microcomputer has strobe signal output terminals CASH*, CASL* and RAS* for direct connection to a dynamic RAM, and chip select signal output terminals CS0* through CS6* for outputting a chip select signal in parallel with the output from the strobe signal output terminals. The microcomputer further includes address output terminals for outputting a non-multiplexed or multiplexed address signal as needed, and data I/O terminals for selectively outputting the address signal to comply with a multiple-bus interface scheme.