Patents by Inventor Isamu Oguma

Isamu Oguma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip component manufacturing method
    Patent number: 11538983
    Abstract: Provided is a chip component manufacturing method which enables a plurality of chip pieces to be handled while being pasted to a sheet, and in which it is possible to apply at least a surface treatment to a plurality of chip pieces while being pasted to a sheet. This chip component manufacturing method comprises: a step for retaining a green sheet or the like on a carrier sheet; a step for cutting, together with a portion of the carrier sheet, the green sheet or the like retained on the carrier sheet; a step for removing, together with a portion of the carrier sheet, at least a dummy portion of the green sheet or the like that has been cut, so as to leave a plurality of chip pieces on the carrier sheet; and a step for applying at least a surface treatment to lateral surface portions of the plurality of chip pieces that have become exposed due to the removing while the plurality of chip pieces are being retained on the carrier sheet.
    Type: Grant
    Filed: March 9, 2020
    Date of Patent: December 27, 2022
    Assignees: NGK Insulators, Ltd., NGK Ceramic Device Co., Ltd.
    Inventors: Isamu Oguma, Takatomo Ogata, Shigeru Funabashi, Hidetake Ota
  • CHIP COMPONENT MANUFACTURING METHOD
    Publication number: 20200212289
    Abstract: Provided is a chip component manufacturing method which enables a plurality of chip pieces to be handled while being pasted to a sheet, and in which it is possible to apply at least a surface treatment to a plurality of chip pieces while being pasted to a sheet. This chip component manufacturing method comprises: a step for retaining a green sheet or the like on a carrier sheet; a step for cutting, together with a portion of the carrier sheet, the green sheet or the like retained on the carrier sheet; a step for removing, together with a portion of the carrier sheet, at least a dummy portion of the green sheet or the like that has been cut, so as to leave a plurality of chip pieces on the carrier sheet; and a step for applying at least a surface treatment to lateral surface portions of the plurality of chip pieces that have become exposed due to the removing while the plurality of chip pieces are being retained on the carrier sheet.
    Type: Application
    Filed: March 9, 2020
    Publication date: July 2, 2020
    Applicants: NGK Insulators, Ltd., NGK Ceramic Device Co., Ltd.
    Inventors: Isamu Oguma, Takatomo Ogata, Shigeru Funabashi, Hidetake Ota