Patents by Inventor Isamu OGURO

Isamu OGURO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate polishing method and device
    Patent number: 8814635
    Abstract: A substrate polishing method includes starting to rotate a circular substrate and polishing an inner peripheral edge surface of a center circular hole formed in the circular substrate into a chamfered or rounded surface by pressing the inner peripheral edge surface against a bypass polishing part of a polishing tape that is conveyed intermittently or continuously and by oscillating the bypass polishing part of the polishing tape about a direction perpendicular to a direction that the center circular hole penetrates through the circular substrate. The polishing tape is guided so as to have an advancing portion advancing toward the circular substrate, a returning portion returning from the circular substrate, and a turning-back portion between the advancing portion and the returning portion guided along a side bypass. The bypass polishing part of the polishing tape is the turning-back portion of the polishing tape.
    Type: Grant
    Filed: January 27, 2011
    Date of Patent: August 26, 2014
    Assignees: Sanshin Co., Ltd., Nihon Micro Coating Co., Ltd.
    Inventors: Nobukazu Hosokai, Isamu Oguro, Jun Watanabe, Tetsujiro Tada
  • SUBSTRATE POLISHING METHOD AND DEVICE
    Publication number: 20120045968
    Abstract: A substrate polishing method includes starting to rotate a circular substrate and polishing an inner peripheral edge surface of a center circular hole formed in the circular substrate into a chamfered or rounded surface by pressing the inner peripheral edge surface against a bypass polishing part of a polishing tape that is conveyed intermittently or continuously and by oscillating the bypass polishing part of the polishing tape about a direction perpendicular to a direction that the center circular hole penetrates through the circular substrate. The polishing tape is guided so as to have an advancing portion advancing toward the circular substrate, a returning portion returning from the circular substrate, and a turning-back portion between the advancing portion and the returning portion guided along a side bypass. The bypass polishing part of the polishing tape is the turning-back portion of the polishing tape.
    Type: Application
    Filed: January 27, 2011
    Publication date: February 23, 2012
    Applicants: NIHON MICRO COATING CO., LTD., SANSHIN CO., LTD.
    Inventors: Nobukazu HOSOKAI, Isamu OGURO, Jun WATANABE, Tetsujiro TADA