Patents by Inventor Isamu Ohsawa

Isamu Ohsawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • FIBER-REINFORCED BODY AND MEMBER USING SAME
    Publication number: 20200361186
    Abstract: There is provided a fiber-reinforced body comprising a fiber component; a matrix component; and a sheet component, wherein the matrix component and the sheet component exhibit an interpenetrating ability; and a member comprising said fiber-reinforced body. The fiber-reinforced body is excellent in terms of bending impact resistance.
    Type: Application
    Filed: July 13, 2018
    Publication date: November 19, 2020
    Applicants: THE UNIVERSITY OF TOKYO, DUPONT TEIJIN ADVANCED PAPERS (JAPAN), LTD.
    Inventors: Zaoyang LI, Isamu OHSAWA, Hiroaki ZUSHI, Jun TAKAHASHI, Shinji NARUSE, Tatsushi FUJIMORI, Koichi UKIGAYA, Chihiro KONDO, Toshitsugu MATSUKI
  • Electroconductive Bonding Material
    Publication number: 20160010179
    Abstract: An electroconductive bonding material which has a high bonding strength to an inorganic nonmetal such as glass or a ceramic and which has excellent reliability in that it does not undergo peeling even when exposed to a high temperature has an alloy composition which comprises, in mass %, Zn: 0.1-15%, In: 2-16%, Sb: greater than 0% to at most 2%, optionally one or both of Ag: at most 2% and Cu: at most 1%, optionally at least one element selected from the group consisting of Ba, Ti, and Ca in a total amount of 0.01-0.15%, and a remainder of Sn. This electroconductive bonding material peels off when it is heated to at least its melting point and can be reused.
    Type: Application
    Filed: August 30, 2013
    Publication date: January 14, 2016
    Inventors: Minoru Ueshima, Isamu Ohsawa
  • Sensor for measuring velocity of vibration using light waveguide
    Patent number: 7262834
    Abstract: This invention provides a device or method for measuring vibration with high sensitivity and over a wide bandwidth. A curved section is formed in an optical fiber. The curved section is disposed on a place to be measured. Light is input in the optical fiber, and then variation of frequency between the input light and the output light is detected. Infinitesimal vibration applied to the curved section can be measured as variation of frequency between the input light and the output light. Further, it is possible to measure vibration over a wide bandwidth.
    Type: Grant
    Filed: December 23, 2003
    Date of Patent: August 28, 2007
    Assignee: Toudai Tlo, Inc.
    Inventors: Kazuro Kageyama, Isamu Ohsawa, Makoto Kanai, Yukiya Tsuchida, Keiichi Nagata
  • Vibration measurement device and vibration measurement method
    Publication number: 20060152735
    Abstract: This invention provides a device or method for measuring vibration with high sensitivity and over a wide bandwidth. A curved section is formed in an optical fiber. The curved section is disposed on a place to be measured. Light is input in the optical fiber, and then variation of frequency between the input light and the output light is detected. Infinitesimal vibration applied to the curved section can be measured as variation of frequency between the input light and the output light. Further, it is possible to measure vibration over a wide bandwidth.
    Type: Application
    Filed: December 23, 2003
    Publication date: July 13, 2006
    Inventors: Kazuro Kageyama, Isamu Ohsawa, Makoto Kanai, Yukiya Tsuchida, Keiichi Nagata