Abstract: A device for treating a substrate in which the cagelike body of the device can be made smaller and in which the waiting time in the treatment parts and the workpiece exchange time can be shortened is achieved as follows: there are two cassette receiving parts, one exposure part and one alignment part arranged in two rows. Furthermore the alignment part and the first cassette receiving part are located in the direction in which a first arm and a second arm of a workpiece transport device extend. Moreover, the two treatment parts and a second cassette receiving part are arranged such that the distances between them are identical to the distance between the first arm and the second arm. The first arm and the second arm move in the Y-direction, are extended or retracted in the X-direction at the same time, and fix the workpiece by the workpiece holding parts which are located on their tips. The workpiece is removed from the cassette of the first cassette receiving part and transported to the treatment parts.

Abstract: A process for exposing the peripheral area of a wafer and a device for executing the process is provided to enable both step-shaped exposure and also ring-shaped exposure of part of the peripheral area of a wafer using a single arrangement. The device includes a rotary carrier for receiving a wafer having resist thereon, which is moved and rotated based on the position of the wafer on the carrier, the position of a singular point formed on an edge of the wafer, such as an "ori-fla" and the like, and furthermore alignment mark position information, to position the wafer in a stipulated position. Then, using an X-Y carrier, the rotary carrier is moved as exposure light is radiated from a first exit part to expose some of the peripheral area of the wafer in a step shape. Next, the rotary carrier is moved again and rotated, and exposure light emitted from a second exit part to expose a not yet exposed part of the peripheral area of the wafer in a ring-shape.