Patents by Inventor Isamu Sorimachi

Isamu Sorimachi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5866942
    Abstract: A laminate package structure for a semiconductor device having a high resistance to humidity, reliability and electrical performance. A polyimide layer and copper foil patterns are formed on a metal base in the form of metal sheet. The metal base comprises a ground pattern maintained at the ground potential, and a plurality of land patterns on which solder balls are formed. The copper foil pattern comprises an island pattern on which an LSI chip is mounted, and an internal wiring patterns connected to electrodes of the LSI chip. The metal base pattern and the internal wiring patterns are electrically interconnected through via-plugs formed in through-holes by an electrolytic plating. A cap is adhesively bonded to the laminated metal base or one of the metal foil patterns.
    Type: Grant
    Filed: April 26, 1996
    Date of Patent: February 2, 1999
    Assignee: NEC Corporation
    Inventors: Katsunobu Suzuki, Katsuhiko Suzuki, Akira Haga, Isamu Sorimachi, Hiroyuki Uchida
  • Patent number: 5783426
    Abstract: The semiconductor device disclosed has a cap in which, at an undersurface periphery portion, a plurality of looped projections are formed for intercepting a continuous bubble path that may be formed for a gas to escape. The preparatory stage steps of assembling the device includes forming a plated layer on a lead frame, adhesively fixing the lead frame on a base plate, cutting and separating leads from the lead frame, and shaping the leads into a predetermined form. The assembling stage steps of the device includes mounting a semiconductor chip on the base plate and bonding electrodes on the semiconductor chip and the leads, and mounting the cap which has the looped projections for intercepting a continuous bubble path that may be formed for a gas to escape. Since the steps such as forming a plated layer and shaping the leads have been completed in the preparatory stage, the assembling steps which include the mounting of the cap having the looped projections can be efficiently carried out.
    Type: Grant
    Filed: August 7, 1995
    Date of Patent: July 21, 1998
    Assignee: NEC Corporation
    Inventors: Katsuhiko Suzuki, Isamu Sorimachi, Akira Haga, Hiroyuki Uchida, Katsunobu Suzuki