Patents by Inventor Isamu Takaoka

Isamu Takaoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thin electronic circuit component and method and apparatus for producing the same
    Patent number: 6551449
    Abstract: Electric conductor patterns including antenna coils are formed on one surface of a film. Electronic components are fixed onto the film by a temporary fixing material. A cover film is laminated on the film so that the electrically conductive patterns and the electronic components are covered with the cover film. Simultaneously with the lamination, the electronic components are connected to the electric conductor patterns.
    Type: Grant
    Filed: January 4, 2001
    Date of Patent: April 22, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Keiji Fujikawa, Yutaka Hashimoto, Isamu Takaoka, Shinichi Kazui, Hideaki Sasaki, Hitoshi Odashima, Mitsugu Shirai
  • Thin electronic circuit component and method and apparatus for producing the same
    Publication number: 20010050138
    Abstract: Electric conductor patterns including antenna coils are formed on one surface of a film. Electronic components are fixed onto the film by a temporary fixing material. A cover film is laminated on the film so that the electrically conductive patterns and the electronic components are covered with the cover film. Simultaneously with the lamination, the electronic components are connected to the electric conductor patterns.
    Type: Application
    Filed: January 4, 2001
    Publication date: December 13, 2001
    Applicant: Hitachi, Ltd.
    Inventors: Keiji Fujikawa, Yutaka Hashimoto, Isamu Takaoka, Shinichi Kazui, Hideaki Sasaki, Hitoshi Odashima, Mitsugu Shirai
  • Thin electronic circuit component and method and apparatus for producing the same
    Patent number: 6203655
    Abstract: Electric conductor patterns including antenna coils are formed on one surface of a film. Electronic components are fixed onto the film by a temporary fixing material. A cover film is laminated on the film so that the electrically conductive patterns and the electronic components are covered with the cover film. Simultaneously with the lamination, the electronic components are connected to the electric conductor patterns.
    Type: Grant
    Filed: November 23, 1998
    Date of Patent: March 20, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Keiji Fujikawa, Yutaka Hashimoto, Isamu Takaoka, Shinichi Kazui, Hideaki Sasaki, Hitoshi Odashima, Mitsugu Shirai