Patents by Inventor Isamu Yonekura
Isamu Yonekura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150262963Abstract: A first bond portion is formed on a first electrode, and for a wire extended from the first bond portion, a tip of a capillary is pressed against a bump formed on a second electrode, to form a second bond portion to which a shape of a pressing surface at the tip of the capillary is transferred. A base end of the second bond portion from which the wire starts becoming thinner is located on the inside of the bump from an end of a bonding surface by 10% or more of the length of the bonding surface, and the wire is cut with the capillary.Type: ApplicationFiled: May 28, 2015Publication date: September 17, 2015Inventors: Kenichi KOYA, Isamu YONEKURA, Daisuke FUKAMACHI, Shinya HARANO
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Patent number: 8552444Abstract: Light from a semiconductor light-emitting element travels in all directions. Thus, light that travels in the directions other than a lighting direction cannot be used effectively. Means for forming a semiconductor light-emitting element having tilted side surfaces, and forming a reflective layer on the tilted side surfaces has been proposed. However, since the tilted surfaces are formed by an etching method or the like, it takes a long time to form the tilted surfaces, and it is difficult to control the tilted surfaces. As a solution to these problems, semiconductor light-emitting elements are placed on a submount substrate and sealed with a sealant, and then a groove is formed in a portion between adjoining ones of the semiconductor light-emitting elements. The grooves formed are filled with a reflective material, and a light-emitting surface is polished. Then, the submount substrate is divided into individual semiconductor light-emitting devices.Type: GrantFiled: November 13, 2008Date of Patent: October 8, 2013Assignee: Panasonic CorporationInventors: Yoshiyuki Ide, Hidenori Kamei, Isamu Yonekura, Kunihiko Obara, Koichi Nakahara, Kouji Nakatsu, Yoshirou Tooya, Toshirou Kitazono, Toshihide Maeda, Kenichi Koya, Takahiro Shirahata
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Publication number: 20120146077Abstract: A light emitting device 1 includes a wiring substrate 4 on which a light emitting element 2 is mounted, a sealing section 5 containing a phosphor and sealing the light emitting element 2, a light diffusion section 7 provided on the sealing section 5 and containing particles for diffusing light emitted from the light emitting element 2, and a light reflection section 6 provided so as to cover part of the sealing section 5 other than a top surface of the sealing section 5 and reflecting light emitted from the light emitting element 2. In the light diffusion section 7, silicone dioxide which is a diffusing material is contained in a transparent medium which is a base material. In the light reflection section 6, titanium dioxide which is a reflective material is contained in a transparent medium which is a base material.Type: ApplicationFiled: August 20, 2010Publication date: June 14, 2012Inventors: Koji Nakatsu, Koichi Nakahara, Toshihide Maeda, Toshirou Kitazono, Isamu Yonekura
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Publication number: 20100258830Abstract: Light from a semiconductor light-emitting element travels in all directions. Thus, light that travels in the directions other than a lighting direction cannot be used effectively. Means for forming a semiconductor light-emitting element having tilted side surfaces, and forming a reflective layer on the tilted side surfaces has been proposed. However, since the tilted surfaces are formed by an etching method or the like, it takes a long time to form the tilted surfaces, and it is difficult to control the tilted surfaces. As a solution to these problems, semiconductor light-emitting elements are placed on a submount substrate and sealed with a sealant, and then a groove is formed in a portion between adjoining ones of the semiconductor light-emitting elements. The grooves formed are filled with a reflective material, and a light-emitting surface is polished. Then, the submount substrate is divided into individual semiconductor light-emitting devices.Type: ApplicationFiled: November 13, 2008Publication date: October 14, 2010Inventors: Yoshiyuki Ide, Hidenori Kamei, Isamu Yonekura, Kunihiko Obara, Koichi Nakahara, Kouji Nakatsu, Yoshirou Tooya, Toshirou Kitazono, Toshihide Maeda, Kenichi Koya, Takahiro Shirahata
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Publication number: 20100216959Abstract: The object of the present invention is to provide a method for production of a photoresist resin which enables to reduce the amount of solvent used, to remove effectively impurities such as low molecular components and metal components and to prepare easily a resin having a narrow molecular weight distribution. The present invention is a method for production of a photoresist resin by polymerizing a polymerizable compound in the presence of a solvent and the method comprises (1) a resin solution preparation process in which a resin solution containing a photoreist resin is prepared, and (2) a purification process in which the resin solution is purified using a ultrafilter membrane.Type: ApplicationFiled: October 21, 2008Publication date: August 26, 2010Applicant: JSR CorporationInventors: Isamu Yonekura, Fumie Honda, Yasuhiro Ito, Masatsugu Niimi
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Patent number: 7429778Abstract: There is provided a method for forming wiring or an electrode by coating a substrate with a composition comprising (A) a complex of an amine compound and a hydrogenated aluminum compound and (B) a titanium compound or a composition comprising the complex and (C) metal particles and subjecting the obtained coating film to heating and/or a light treatment. By the method, a film can be formed that uses a conductive film forming composition with which wiring and an electrode that can be suitably used for electronic devices can be formed easily and inexpensively.Type: GrantFiled: September 29, 2005Date of Patent: September 30, 2008Assignees: JSR Corporation, Sharp CorporationInventors: Michiko Yokoyama, legal representative, Naomi Shinoda, legal representative, Risa Yokoyama, legal representative, Isamu Yonekura, Takashi Satoh, Tamaki Wakasaki, Yasumasa Takeuchi, Masayuki Endo, Yasuaki Yokoyama
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Patent number: 7071084Abstract: There is provided a method for forming wiring or an electrode by coating a substrate with a composition comprising (A) a complex of an amine compound and a hydrogenated aluminum compound and (B) a titanium compound or a composition comprising the complex and (C) metal particles and subjecting the obtained coating film to heating and/or a light treatment. By the method, a film can be formed that uses a conductive film forming composition with which wiring and an electrode that can be suitably used for electronic devices can be formed easily and inexpensively.Type: GrantFiled: March 25, 2004Date of Patent: July 4, 2006Assignees: JSR Corporation, Sharp Corporation, International Center for Materials ResearchInventors: Yasuaki Yokoyama, Isamu Yonekura, Takashi Satoh, Tamaki Wakasaki, Yasumasa Takeuchi, Masayuki Endo
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Publication number: 20060024937Abstract: There is provided a method for forming wiring or an electrode by coating a substrate with a composition comprising (A) a complex of an amine compound and a hydrogenated aluminum compound and (B) a titanium compound or a composition comprising the complex and (C) metal particles and subjecting the obtained coating film to heating and/or a light treatment. By the method, a film can be formed that uses a conductive film forming composition with which wiring and an electrode that can be suitably used for electronic devices can be formed easily and inexpensively.Type: ApplicationFiled: September 29, 2005Publication date: February 2, 2006Applicants: JSR Corporation, SHARP CORPORATION, International Center for Materials ResearchInventors: Yasuaki Yokoyama, Isamu Yonekura, Takashi Satoh, Tamaki Wakasaki, Yasumasa Takeuchi, Masayuki Endo
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Publication number: 20050003085Abstract: A composition for forming a coating film, comprising a reaction product of a tantalum alkoxide and at least one compound selected from carbamic acid, carboxylic acid and carboxylic anhydride and a solvent. A tantalum oxide film is obtained by forming a coating film of this composition and thermally and/or optically treating the coating film. This tantalum oxide film has a large dielectric constant and a small leak current.Type: ApplicationFiled: April 8, 2004Publication date: January 6, 2005Applicant: JSR CorporationInventors: Isamu Yonekura, Sachiko Hashimoto, Hitoshi Kato, Tatsuya Sakai
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Patent number: 6806210Abstract: A composition for forming a high-quality tantalum film which is advantageously used as an capacitor insulating film and a process for forming the high-quality tantalum film. The composition for forming a tantalum oxide film, which comprises at least one tantalum compound selected from the group consisting of a reaction product of a compound capable of reacting with a tantalum alkoxide and a tantalum alkoxide and a hydrolyzate of the reaction product, and a solvent, and the process for forming the tantalum oxide film by applying this composition to a substrate and heating it.Type: GrantFiled: July 22, 2002Date of Patent: October 19, 2004Assignee: JSR CorporationInventors: Hiroshi Shiho, Hitoshi Kato, Sachiko Hashimoto, Isamu Yonekura, Yasuo Matsuki
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Publication number: 20040192038Abstract: There is provided a method for forming wiring or an electrode by coating a substrate with a composition comprising (A) a complex of an amine compound and a hydrogenated aluminum compound and (B) a titanium compound or a composition comprising the complex and (C) metal particles and subjecting the obtained coating film to heating and/or a light treatment. By the method, a film can be formed that uses a conductive film forming composition with which wiring and an electrode that can be suitably used for electronic devices can be formed easily and inexpensively.Type: ApplicationFiled: March 25, 2004Publication date: September 30, 2004Applicants: JSR Corporation, SHARP CORPORATION, International Center for Materials ResearchInventors: Yasuaki Yokoyama, Isamu Yonekura, Takashi Satoh, Tamaki Wakasaki, Yasumasa Takeuchi, Masayuki Endo
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Publication number: 20030003235Abstract: A composition for forming a high-quality tantalum film which is advantageously used as an capacitor insulating film and a process for forming the high-quality tantalum film. The composition for forming a tantalum oxide film, which comprises at least one tantalum compound selected from the group consisting of a reaction product of a compound capable of reacting with a tantalum alkoxide and a tantalum alkoxide and a hydrolyzate of the reaction product, and a solvent, and the process for forming the tantalum oxide film by applying this composition to a substrate and heating it.Type: ApplicationFiled: July 22, 2002Publication date: January 2, 2003Inventors: Hiroshi Shiho, Hitoshi Kato, Sachiko Okada, Isamu Yonekura, Yasuo Matsuki