Abstract: An aquaculture system (Sy) includes mineral sensors (22, 24, 26) for detecting the concentrations of minerals contained in rearing water within a rearing tank (50) for rearing an aquatic organism or the rearing water within a circulation passage (70), and an adjustment section which performs instruction issuance or operation for rendering the concentrations of the minerals contained in the rearing water coincident with their standards when the mineral concentrations detected by the mineral sensors (22, 24, 26) deviate from their standards.

Abstract: In a produce management system (1), a production-base-side apparatus (10) outputs management data generated or input in a process of breeding produce at a production base. A management-base-side apparatus (70) stores or outputs at least one of the management data, a piece of relevant information generated as a result of processing or inspection of the management data, and a piece of certification information generated in response to obtainment of the management data, when the management-base-side apparatus obtains the management data.

Abstract: An electronic control device includes a heating element, a substrate, and a housing. The heating element includes an electronic component. The heating element is mounted to the substrate. The substrate is fixed to the housing via a substrate fixing portion. The housing includes a plurality of projecting portions projecting to the substrate side from a reference surface. The plurality of projecting portions have mutually different heights from the reference surface. The reference surface is a surface opposing the substrate and a reference of a height of the housing. The projecting portion highest in the height from the reference surface among the plurality of projecting portions is in contact with a surface of the substrate via a heat dissipation member. The surface of the substrate is on an opposite side of a surface where the heating element is mounted.

Abstract: Provided is a sealing structure including a housing that houses a heat generating member or a heat dissipation member thereinside, and a resin that is filled in the housing. In a sectional view, the housing includes a first recess portion in a position facing the heat generating member or the heat dissipation member.

Abstract: An electronic control device includes a heating element, a substrate, and a housing. The heating element includes an electronic component. The heating element is mounted to the substrate. The substrate is fixed to the housing via a substrate fixing portion. The housing includes a plurality of projecting portions projecting to the substrate side from a reference surface. The plurality of projecting portions have mutually different heights from the reference surface. The reference surface is a surface opposing the substrate and a reference of a height of the housing. The projecting portion highest in the height from the reference surface among the plurality of projecting portions is in contact with a surface of the substrate via a heat dissipation member. The surface of the substrate is on an opposite side of a surface where the heating element is mounted.

Abstract: Provided is a sealing structure including a housing that houses a heat generating member or a heat dissipation member thereinside, and a resin that is filled in the housing. In a sectional view, the housing includes a first recess portion in a position facing the heat generating member or the heat dissipation member.

Abstract: A power module includes a substrate having a surface on which a plurality of wiring patterns are formed, a semiconductor device mounted on the substrate and electrically connected to a part of the plurality of wiring patterns, and a terminal portion with a lead electrically connected to the other part of the plurality of wiring patterns, and is configured that the lead of the terminal portion is formed by laminating a plurality of metal members which contain a material substantially the same as or softer than the material for forming the other part of wiring patterns, and the material of the plurality of metal members, which is the same as or softer than the material for forming the other part of wiring patterns is electrically connected to the other part of wiring patterns through ultrasonic bonding.

Abstract: A power module includes an upper arm circuit unit and a lower arm circuit unit each having a power semiconductor element; an insulating substrate with the units mounted on one surface thereof; a metal base bonded onto the other surface of the substrate opposite to the one surface where the units are mounted; a first connection conductor for supplying a high potential to the upper unit from outside; a second connection conductor for supplying a low potential to the lower unit from outside; an insulating sheet interposed between the conductors; and a resin case disposed on the metal base to support the conductors, the conductors are flat conductors and laminated with the sheet sandwiched therebetween; the sheet extends from one end of the laminated structure to secure the creepage distance between the conductors; and the case is furnished with a recess for containing the laminated structure.

Abstract: A power module includes a substrate having a surface on which a plurality of wiring patterns are formed, a semiconductor device mounted on the substrate and electrically connected to a part of the plurality of wiring patterns, and a terminal portion with a lead electrically connected to the other part of the plurality of wiring patterns, and is configured that the lead of the terminal portion is formed by laminating a plurality of metal members which contain a material substantially the same as or softer than the material for forming the other part of wiring patterns, and the material of the plurality of metal members, which is the same as or softer than the material for forming the other part of wiring patterns is electrically connected to the other part of wiring patterns through ultrasonic bonding.

Abstract: A power module includes an upper arm circuit unit and a lower arm circuit unit each having a power semiconductor element; an insulating substrate with the units mounted on one surface thereof; a metal base bonded onto the other surface of the substrate opposite to the one surface where the units are mounted; a first connection conductor for supplying a high potential to the upper unit from outside; a second connection conductor for supplying a low potential to the lower unit from outside; an insulating sheet interposed between the conductors; and a resin case disposed on the metal base to support the conductors, the conductors are flat conductors and laminated with the sheet sandwiched therebetween; the sheet extends from one end of the laminated structure to secure the creepage distance between the conductors; and the case is furnished with a recess for containing the laminated structure.

Abstract: A semiconductor device has a substrate with an electronic circuit, a semiconductor element provided at a first surface of the substrate and electrically connected by wire bonding to the electronic circuit, a metallic core layer electrically connected to the semiconductor element. A plurality of conductive bumps provided opposite the first surface of the substrate. A thermal hardenable resin seals at least the semiconductor element, and a metal plate is electrically connected to the metal core layer.

Abstract: A semiconductor module of the present invention comprises a first conductive layer (film) and a second conductive layer (film) which are separately formed on the main surface of a packed substrate, a thermal diffusion plate connected by solder to the upper surface of the first conductive layer, a semiconductor element connected by solder to the upper surface of the thermal diffusion plate, and a lead having one end connected by solder to the second conductive layer and the other end connected by solder to the semiconductor element, wherein the outer periphery of the connected region where the semiconductor element is connected by solder to the upper surface of the thermal diffusion plate is formed with protrusion parts protruding up from the connecting region and a turning of the semiconductor element in the upper surface of the thermal diffusion plate in the solder connecting process is suppressed by the protrusion parts.

Abstract: An electronic device comprises a circuit board which has a through hole and uses a resin with a glass transition temperature exceeding 150° C. as a base member, a metal casing which has an opening, and a connector which is fitted to the opening of the metal casing in which a pin of the connector is inserted into the through hole, the pin and the through hole are connected with a conductive member, and a reinforcement member for securing the connector and the board is further provided on the conductive member, thereby improving the reliability of the electronic device.

Abstract: A semiconductor module of the present invention comprises a first conductive layer (film) and a second conductive layer (film) which are separately formed on the main surface of a packed substrate, a thermal diffusion plate connected by solder to the upper surface of the first conductive layer, a semiconductor element connected by solder to the upper surface of the thermal diffusion plate, and a lead having one end connected by solder to the second conductive layer and the other end connected by solder to the semiconductor element, wherein the outer periphery of the connected region where the semiconductor element is connected by solder to the upper surface of the thermal diffusion plate is formed with protrusion parts protruding up from the connecting region and a turning of the semiconductor element in the upper surface of the thermal diffusion plate in the solder connecting process is suppressed by the protrusion parts.

Abstract: A semiconductor device with enhanced heat releasability and low-cost manufacturability is disclosed. This device has a substrate with an electronic circuit disposed on a first principal surface, a semiconductor element which is provided at the first surface of the substrate and electrically connected by wire bonding to the electronic circuit, a metallic core layer which is provided in the substrate and electrically connected to the semiconductor element, a plurality of conductive bumps provided on a second principal surface opposite to the first surface of the substrate, a thermal hardenable sealing resin for sealing at least the semiconductor element and the first surface side of the substrate, and a metal plate provided at the second surface for being electrically connected to the metal core layer. An electronic control module using the device is also disclosed.

Abstract: The present invention is related to an optical communication module for transmitting high frequency signals (e.g., 10 Gbit/s and higher data rates) between an optical element and an external circuit. In an illustrative embodiment, the optical communication module includes signal transmission lines and ground lines formed on a ceramic substrate, a flexible wiring board, and a printed circuit board. The widths of the signal lines and the ground lines vary, as well as the spacing between the signal and ground lines. This facilitates characteristic impedance matching among the signal lines to within about 50?.

Abstract: A ball screw in a continuously variable speed transmission has an axially immovable pulley half (2) and axially movable pulley half (3) both mounted on a rotary shaft (4). The axially movable pulley half (3) is moved by a ball screw (20) so as to infinitely vary the belt wrapping radius and thus the transmission speed. A nut (22), forming one part of the ball screw (20), is immovably secured in both axial and rotational directions. A screw shaft (21), forming the other part of the ball screw (20), is movable in both axial and rotational directions. The screw shaft 21 is connected to the axially movable pulley half (3). The axially movable pulley half (3) is axially moved by rotating the screw shaft (21).

Abstract: An electronic device comprises a circuit board which has a through hole and uses a resin with a glass transition temperature exceeding 150° C. as a base member, a metal casing which has an opening, and a connector which is fitted to the opening of the metal casing in which a pin of the connector is inserted into the through hole, the pin and the through hole are connected with a conductive member, and a reinforcement member for securing the connector and the board is further provided on the conductive member, thereby improving the reliability of the electronic device.

Abstract: A belt type infinite variable-speed drive using a ball-screw mechanism is compact and noise-free. A nut of the ball-screw mechanism is fixed to a casing and a threaded shaft is rotatably coupled to a movable pulley member through a ball bearing so that ball circulating portions on the nut will not rotate while the movable pulley member is movable axially. Also, the ball circulating portions, which are low in load bearing capacity, are oriented in such a direction that a load hardly acts on the ball-screw mechanism. This makes it possible to compactly and rationally design a belt type infinite variable-speed drive and to suppress noise due to vibration of balls in the ball circulating portions.

Abstract: A ball screw mechanism comprises a screw shaft, a nut and balls. The nut has a cylindrical portion in the axial middle on the outer peripheral surface thereof that becomes a fitting surface for fitting in a sleeve, and small diameter step portions in the opposite axial sides on the outer peripheral surface thereof that become non-fitting surfaces not fitting in the sleeve. A portion of a wheel steering shaft is provided with the screw shaft, and a plurality of balls are disposed in a rolling way defined between a thread groove formed in the outer periphery of the screw shaft and a thread groove formed in the inner periphery of the nut.