Abstract: A method of manufacturing a composite electronic part includes: a part arrangement step of arranging a film circuit element and a chip-like electronic part on one substrate surface of a ceramic substrate; a protective layer disposition step of disposing a protective layer that protects the film circuit element and the chip-like electronic part on the one substrate surface of the ceramic substrate, and flattening an upper surface of the protective layer; and a conductive material arrangement step of, after both of the steps, arranging a plurality of conductive projections that become terminals of the film circuit element and the chip-like electronic part on the other surface of the ceramic substrate in a state where the upper surface of the protective layer abuts on a horizontal plane.