Abstract: In a lead frame transporting apparatus for transporting lead frames on which package portions are located, slide shafts are included on a frame conveyor plate. Pad support members are slidably mounted on the slide shafts. Suction pads for holding the package portions with suction are mounted on respective pad support members. The sliding of the slide members is limited by a slide limiting device on the frame conveyor plate. The slide limit of the pad support members is removed by a pad moving mechanism and the pad support members are moved along the slide shafts. Information regarding the lead frames is input into a controlling section so that the pad moving mechanism can be controlled and the positions of all the pad support members automatically adjusted.

Abstract: In a laser marking apparatus, a rotatable index table is provided in an index unit. The index table is provided with first and second support sections for supporting lead frames. Positions of the first and second sections are alternately switched between a stand-by position and a processing position by the rotation of the index table. Laser marking is subjected to IC package surfaces of the lead frame supported at the support potions located at the processing position. The lead frames after the laser marking process are transported from the stand-by position to a discharging section by a transporting device. The lead frames before the laser marking process are transported from a supplying section to the stand-by position by the transporting device.

Abstract: An IC mounting/demounting system in which a centering tool 27 including a socket pusher 27c and a centering recess portion 27b constructed integrally with the tool is detachably attached to a head body 57. Also provided is a centering tool stocker for supporting a plurality of centering tools. This construction eliminates the need for the replacement of a mounting/demounting head with each change of the kind of IC, thus enhancing working efficiency.

Abstract: An IC mounting/demounting system wherein a plurality of holding sections are fixedly secured to an index plate rotatable by a servo motor. A plurality of IC's are successively mounted and demounted on a socket board or a tray, and the plurality of IC's are simultaneously held and transferred. This improves the efficiency of the IC transferring work between the socket board and the tray and shortens working time.

Abstract: An IC mounting/demounting system comprising a centering unit including first and second centering tools where socket pushers are constructed integrally with centering recess portions respectively. The centering unit is detachably fitted to a head body and replaceable with a centering unit corresponding to an IC having a different size. Accordingly, the replacement of the whole mounting/demounting head that normally accompanies the change in the kind of IC becomes unnecessary, thus enhancing work efficiency.

Abstract: The IC mounting/demounting system of the present invention makes it possible to adjust the interval between socket pushers 42 and 43 of mounting/demounting head 25 in accordance with the size of IC socket 1A. Therefore, it is unnecessary to replace mounting/demounting head 25 when changing types of IC's and therefore, the operation efficiency is greatly improved.

Abstract: A pipe coupling includes an inner tubular member cut with an external thread and an outer tubular member cut with an internal thread and posseses a sealing portion where the metal-to-metal contact of conical surfaces establishes a seal. The tip of the sealing portion of the inner tubular member is substantially not in contact with the tip of the outer tubular member. An external peripheral shoulder having an inversely conical surface is provided on the inner tubular member while an internal peripheral shoulder having a conical surface is provided on the outer tubular member. The two peripheral shoulders are firmly engaged with each other.