Abstract: A culture medium for preparation of feeder cells for embryonic stem cells, which can efficiently establish feeder cells for use in culture of embryonic stem cells including human's from limited donor-derived materials and culture them in a condition of a reduced risk of infection, is provided. Further, a preparation method of feeder cells, which is relatively safe even when subjected to coculture with embryonic stem cells including human's, and the resulting feeder cells therefrom are provided. With the culture medium for preparation of feeder cells for embryonic stem cells comprising at least a serum albumin and insulin in a basal medium, a cell population comprising at least one kind of cells selected from fetal skin fibroblasts, fetal myofibroblasts, fetal lung fibroblasts, fetal epithelial cells, fetal endothelial cells, adult skin fibroblasts, adult lung fibroblasts, adult epithelial cells and endothelial cells which can become feeder cells for embryonic stem cells can be stably proliferated.

Abstract: A cryopreservation medium and a cryopreservation method which make it possible to cryopreserve ES cells from primates simply with high viability are provided. A cryopreservation medium containing a cryoprotectant at a Concentration of from 12% (W/V) to 50% (W/V) and a cryopreservation method for primate embryonic stem cells, which comprises a step of suspending primate embryonic stem cells in the cryopreservation medium, and a refrigeration step of freezing the suspension of the primate embryonic stem cells in the cryopreservation medium by cooling it to ?80° C. or below at a rate of from 0.5° C. to 10° C. per minute, and a preservation step of storing the frozen suspension of primate embryonic stem cells in the cryopreservation medium enable simple cryopreservation of primate embryonic stem cells with high viability.

Abstract: A system and method suitable for inspecting a semiconductor device whose terminals are formed from solder balls and protrude from a package is provided, thus enabling high-speed inspection of a semiconductor device having a plurality of pins. Metal protuberances corresponding to respective terminals projecting from the bottom of a package of a semiconductor device are provided on an interface substrate. Contact sections corresponding to the respective metal protuberances are provided within each of a plurality of slide sections. The semiconductor device is set on the slide section such that the terminals are disposed opposite the respective metal protuberances. The slide sections are slid over the interface substrate, thereby bringing the side surfaces of the terminals of the semiconductor device into contact with the contact sections. Each of the contact sections is formed from a conductive contact plate, an elastic film, and a slide guide having rigidity.

Abstract: There are described contact terminals which enable stable measurement of electrical characteristics of semiconductor devices. A heat-resistant insulating film having a plurality of apertures formed therein is sandwiched between an upper metal mold and a lower metal mold. The upper and lower metal molds are positioned, and conductive resin is poured into the cavity defined between the upper and lower metal molds, thereby producing a plurality of contact terminals. After removal of the upper and lower metal molds, there is produced a heat-resistant film having a plurality of contact terminals formed thereon.

Abstract: There are described contact terminals which enable stable measurement of electrical characteristics of semiconductor devices. A heat-resistant insulating film having a plurality of apertures formed therein is sandwiched between an upper metal mold and a lower metal mold. The upper and lower metal molds are positioned, and conductive resin is poured into the cavity defined between the upper and lower metal molds, thereby producing a plurality of contact terminals. After removal of the upper and lower metal molds, there is produced a heat-resistant film having a plurality of contact terminals formed thereon.

Abstract: The present invention provides a system and method suitable for inspecting a semiconductor device whose terminals are formed from solder balls and protrude from a package, thus enabling high-speed inspection of a semiconductor device having a plurality of pins. Metal protuberances corresponding to respective terminals projecting from the bottom of a package of a semiconductor device are provided on an interface substrate. Contact sections corresponding to the respective metal protuberances are provided within each of a plurality of slide sections. The semiconductor device is set on the slide section such that the terminals are disposed opposite the respective metal protuberances. The slide sections are slid over the interface substrate, thereby bringing the side surfaces of the terminals of the semiconductor device into contact with the contact sections. Each of the contact sections is formed from a conductive contact plate, a elastic film, and a slide guide having rigidity.