Patents by Inventor Isao Azumi

Isao Azumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9101066
    Abstract: An outer circumferential groove filled with a seal material and an opposing surface portion are provided to a fit portion of a case. A tray portion opposing the opposing surface portion and an outer circumferential protruding portion entering the outer circumferential groove are provided to the fit portion of a cover. Master dimensions are set so that an outer clearance A0 between the outer circumferential groove and the outer circumferential protruding portion is always larger than an inner clearance C0 between the former and the latter when center positions of the cover and the case coincide with each other.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: August 4, 2015
    Assignee: Mitsubishi Electric Corporation
    Inventors: Isao Azumi, Koji Hashimoto
  • Publication number: 20140076772
    Abstract: An outer circumferential groove filled with a seal material and an opposing surface portion are provided to a fit portion of a case. A tray portion opposing the opposing surface portion and an outer circumferential protruding portion entering the outer circumferential groove are provided to the fit portion of a cover. Master dimensions are set so that an outer clearance A0 between the outer circumferential groove and the outer circumferential protruding portion is always larger than an inner clearance C0 between the former and the latter when center positions of the cover and the case coincide with each other.
    Type: Application
    Filed: March 7, 2013
    Publication date: March 20, 2014
    Inventors: Isao AZUMI, Koji HASHIMOTO
  • Patent number: 8670240
    Abstract: A circuit board is hermetically-sealed and housed in a steel case that is composed of a metal base and a metal cover, the cover disposed opposite to a first board surface has a tall flat portion disposed opposite to a connector housing and a short flat portion disposed opposite to a heating component, and the heat generated from the heating component is directly transferred to a heat transfer base portion of the base via a heat transfer mechanism and a heat transfer filling material. Surface finishing in which the coefficients of heat radiation are mutually 0.7 to 1.0 is applied to the surface of the heating component and the opposite inner surface of the cover, and radiation and heat transfer are efficiently performed to the short flat portion of the cover.
    Type: Grant
    Filed: October 5, 2011
    Date of Patent: March 11, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventors: Koji Hashimoto, Isao Azumi, Yusuke Matsuda, Yoshitake Nishiuma
  • Patent number: 8520397
    Abstract: Seal surfaces in three directions of a base and a cover are mutually fitted as a first seal part in combination of concave threads and convex threads, and sandwich three sides of a circuit board between an innermost peripheral part convex thread at the base side and an innermost peripheral part concave thread at the cover side. A connector member having a second seal part is fixed to one side of the circuit board, a concavo-convex seal surface between the base and the connector member is located on a low step surface, and the concave and convex threads on the seal surface of the connector member provided on the base pass the concave and convex threads of the seal surface in the three directions each other to be continuous.
    Type: Grant
    Filed: February 8, 2011
    Date of Patent: August 27, 2013
    Assignee: Mitsubishi Electric Corporation
    Inventors: Isao Azumi, Koji Hashimoto
  • Publication number: 20120320531
    Abstract: A circuit board is hermetically-sealed and housed in a steel case that is composed of a metal base and a metal cover, the cover disposed opposite to a first board surface has a tall flat portion disposed opposite to a connector housing and a short flat portion disposed opposite to a heating component, and the heat generated from the heating component is directly transferred to a heat transfer base portion of the base via a heat transfer mechanism and a heat transfer filling material. Surface finishing in which the coefficients of heat radiation are mutually 0.7 to 1.0 is applied to the surface of the heating component and the opposite inner surface of the cover, and radiation and heat transfer are efficiently performed to the short flat portion of the cover.
    Type: Application
    Filed: October 5, 2011
    Publication date: December 20, 2012
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Koji HASHIMOTO, Isao AZUMI, Yusuke MATSUDA, Yoshitake NISHIUMA
  • Publication number: 20120069532
    Abstract: Seal surfaces in three directions of a base and a cover are mutually fitted as a first seal part in combination of concave threads and convex threads, and sandwich three sides of a circuit board between an innermost peripheral part convex thread at the base side and an innermost peripheral part concave thread at the cover side. A connector member having a second seal part is fixed to one side of the circuit board, a concavo-convex seal surface between the base and the connector member is located on a low step surface, and the concave and convex threads on the seal surface of the connector member provided on the base pass the concave and convex threads of the seal surface in the three directions each other to be continuous.
    Type: Application
    Filed: February 8, 2011
    Publication date: March 22, 2012
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Isao AZUMI, Koji HASHIMOTO
  • Patent number: 7120030
    Abstract: A housing structure for vehicle-mounted electronic equipment according to the present invention is superior in heat dissipation, water resistance, heat resistance and vibration resistance. An electronic substrate is temporarily fixed onto an annular circumferential wall part of a cover made of fire retardant resin, and connector contact pins are soldered to the electronic substrate. The electronic substrate is fixed and held between a heat-transfer base and the annular circumferential wall part with screws, and heat generated by a heating part on the electronic substrate is transferred to the base and dissipated. The annular circumferential wall part has an annular groove in which a sealant is inserted, and the base has an annular protrusion snapped into the annular groove.
    Type: Grant
    Filed: September 22, 2003
    Date of Patent: October 10, 2006
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Isao Azumi, Tetsushi Watanabe
  • Publication number: 20040095732
    Abstract: A housing structure for vehicle-mounted electronic equipment according to the present invention is superior in heat dissipation, water resistance, heat resistance and vibration resistance. An electronic substrate is temporarily fixed onto an annular circumferential wall part of a cover made of fire retardant resin, and connector contact pins are soldered to the electronic substrate. The electronic substrate is fixed and held between a heat-transfer base and the annular circumferential wall part with screws, and heat generated by a heating part on the electronic substrate is transferred to the base and dissipated. The annular circumferential wall part has an annular groove in which a sealant is inserted, and the base has an annular protrusion snapped into the annular groove.
    Type: Application
    Filed: September 22, 2003
    Publication date: May 20, 2004
    Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA
    Inventors: Isao Azumi, Tetsushi Watanabe