Abstract: A chip mounted circuit substrate (COF) 4 to be installed on a liquid crystal display panel 1 comprises an arrangement wiring electrodes 42 formed on a base film 41 at a first pitch P1 in a first direction (A-direction) and two of first positioning marks 43 formed at both sides of the arrangement of the wiring electrodes 43 in the first direction. Before installing the COF 4 on the liquid crystal display panel 1 by thermo-compression bonding, the first pitch P1 of the wiring electrodes 42 is selected to be narrower than a second pitch P2 after performing the thermo-compression bonding in consideration with expansion of the base film 41 in the first direction. In addition, a part of each the first positioning mark 43 overlaps a second positioning mark 12 formed on the liquid crystal display panel 1 and protrudes outward from the second positioning mark 12 in the first direction.

Abstract: A method of sensing an abnormal condition in a heat exchange process, capable of promptly sensing leakage of a process fluid in a process of heat exchange between a heat medium and a process fluid, is provided. With attention being paid in a process of heat exchange between a heat medium which is fused salt including nitrate and/or nitrite and a process fluid including secondary alcohols and/or a dehydrated product thereof to generation of a large amount of hydrogen gas resulting from contact between the leaked process fluid and the heat medium, the present invention is directed to a method of sensing an abnormal condition in a heat exchange process having a sensing step of sensing a hydrogen gas in a vapor phase portion in a flow path for the heat medium.

Abstract: A method of sensing an abnormal condition in a heat exchange process, capable of promptly and readily sensing leakage of a heat medium into a process fluid flow path in a process of heat exchange, is provided. The present invention is directed to a method of sensing an abnormal condition in a heat exchange process between the heat medium and the process fluid having a sensing step of sensing a gas component generated as a result of decomposition of a heat medium and/or a gas component generated as a result of contact between the heat medium and the process fluid, in a vapor phase portion in a flow path for the process fluid. The method is preferably applied in a heat exchange process where the heat medium is fused salt including nitrate and/or nitrite and the process fluid includes secondary alcohols or a dehydrated product thereof.

Abstract: A chip mounted circuit substrate (COF) 4 to be installed on a liquid crystal display panel 1 comprises an arrangement wiring electrodes 42 formed on a base film 41 at a first pitch P1 in a first direction (A-direction) and two of first positioning marks 43 formed at both sides of the arrangement of the wiring electrodes 43 in the first direction. Before installing the COF 4 on the liquid crystal display panel 1 by thermo-compression bonding, the first pitch P1 of the wiring electrodes 42 is selected to be narrower than a second pitch P2 after performing the thermo-compression bonding in consideration with expansion of the base film 41 in the first direction. In addition, a part of each the first positioning mark 43 overlaps a second positioning mark 12 formed on the liquid crystal display panel 1 and protrudes outward from the second positioning mark 12 in the first direction.