Patents by Inventor Isao Furuya

Isao Furuya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240105436
    Abstract: The performance of a power supply module is to be improved. The occurrence of discharge in the power supply module is to be prevented, and the size of the power supply module is to be reduced. In a power supply module, substrates are provided being stacked in a planar view. A low voltage circuit and a high voltage circuit are formed on a first substrate such that a distance is kept for preventing surface discharge, and a low voltage circuit is formed on a second substrate. A distance between a component of a high voltage alternating current circuit on the high voltage circuit and a component of the low voltage circuit is three times a shortest distance, at which space discharge does not occurs, between a component that constitutes a high voltage direct current circuit on the high voltage circuit and a component that constitutes the low voltage circuit.
    Type: Application
    Filed: September 4, 2020
    Publication date: March 28, 2024
    Inventors: Zihao Ong, Takuma Nishimoto, Isao Furuya, Hiroshi Touda
  • Publication number: 20230343572
    Abstract: A high-voltage module HVMD includes: an error amplifier configured to output a control signal based on a reference signal Vin and a feedback signal; a high voltage output circuit configured to output a high voltage Vout for supply based on the control signal; and a feedback circuit configured to output the feedback signal based on the high voltage Vout for supply. Here, the feedback circuit includes: a first partial circuit configured to receive an input of the high voltage Vout for supply and to output an intermediate signal, the first partial circuit including a resistance element; and a second partial circuit configured to receive an input of the intermediate signal and to output the feedback signal. The high-voltage module HVMD further includes a substrate SUB including: a high voltage substrate region where the high voltage output circuit and a part of the first partial circuit are mounted.
    Type: Application
    Filed: December 28, 2021
    Publication date: October 26, 2023
    Inventors: Zihao ONG, Takuma NISHIMOTO, Isao FURUYA, Hiroshi TOUDA
  • Publication number: 20230056978
    Abstract: In a mass spectrometer, due to impurities accumulated inside a frame, a withstand voltage may decrease, and electric discharge may occur in an ion source, thereby making it impossible to perform normal measurement. Since a result of abnormality measurement due to the electric discharge cannot be distinguished from measurement abnormality caused by clogging of a tube between a pretreatment unit and a needle, there is a problem in that time is required to identify abnormal portions, and a maintenance property is lowered. As a unit for solving the problem, a return current detection unit connected in series between the frame and an ion source power supply that applies a voltage to the needle and a return current detection unit connected in series between the frame and a counter electrode power supply that applies a voltage to a counter electrode are provided.
    Type: Application
    Filed: December 2, 2020
    Publication date: February 23, 2023
    Applicant: Hitachi High-Tech Corporation
    Inventors: Takuma NISHIMOTO, Zihao ONG, Isao FURUYA, Hiroshi TOUDA, Yuichiro HASHIMOTO, Masuyuki SUGIYAMA
  • Patent number: 11349476
    Abstract: A positive high voltage, a first terminal of a semiconductor element, and a first terminal of a first resistance element are connected to a first terminal of a first current controller. A current input terminal of a first active element is connected to a second terminal of the first current controller, and a second terminal of the semiconductor element and a second terminal of the first resistance element are connected to a control terminal of the first active element. A second resistance element is connected between a current output terminal and a control terminal of the first active element. The first current controller allows a drive current corresponding to an input signal to flow in the first active element and allows the drive current output from the first active element to flow into a load, thereby generating an output voltage.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: May 31, 2022
    Assignee: HITACHI HIGH-TECH CORPORATION
    Inventors: Yuki Nakamura, Takuma Nishimoto, Hiroshi Touda, Isao Furuya, Suguru Kondo
  • Publication number: 20210044293
    Abstract: A positive high voltage, a first terminal of a semiconductor element, and a first terminal of a first resistance element are connected to a first terminal of a first current controller. A current input terminal of a first active element is connected to a second terminal of the first current controller, and a second terminal of the semiconductor element and a second terminal of the first resistance element are connected to a control terminal of the first active element. A second resistance element is connected between a current output terminal and a control terminal of the first active element. The first current controller allows a drive current corresponding to an input signal to flow in the first active element and allows the drive current output from the first active element to flow into a load, thereby generating an output voltage.
    Type: Application
    Filed: December 26, 2018
    Publication date: February 11, 2021
    Inventors: Yuki Nakamura, Takuma Nishimoto, Hiroshi Touda, Isao Furuya, Suguru Kondo
  • Patent number: 5447294
    Abstract: A vertical heat treatment system for heat treating a large number of semiconductor wafers housed in a boat at once includes a heat treatment unit having a boat loading/unloading port, a boat section communicating with the heat treatment unit through the boat loading/unloading port, an elevator mechanism for loading/unloading the boat between the boat section and the heat treatment unit through the boat loading/unloading port, a cassette section provided adjacent to the boat section, a wafer transfer mechanism for transferring wafers between a cassette and the boat, a gas supply mechanism for supplying a non-oxidization gas into the boat section, and a gas shower means for blowing the non-oxidization gas to the wafers in the vicinity of the boat loading/unloading port.
    Type: Grant
    Filed: January 21, 1994
    Date of Patent: September 5, 1995
    Assignees: Tokyo Electron Limited, Tokyo Electron Tohoku Limited
    Inventors: Kazunari Sakata, Masato Kadobe, Isao Furuya, Shingo Watanabe, Hiroki Fukushima, Hiroyuki Iwai