Abstract: An adhesive composition is characterized by including an acrylic polymer, an epoxy thermosetting resin having an unsaturated hydrocarbon group and a thermosetting agent. The adhesive composition achieves high reliability in a package in which a semiconductor chip of reduced thickness is mounted even when exposed to severe reflow conditions. An adhesive sheet having an adhesive layer comprising the above adhesive composition and a production process for a semiconductor device using the above adhesive sheet are also provided.

Abstract: In a process for manufacturing a semiconductor device comprising heating a wiring board on which a chip and an uncured adhesive layer are laminated for curing the adhesive layer, the improvement includes performing a statically pressurizing step before the adhesive layer is cured, in which step the wiring board on which the chip and the uncured adhesive layer are laminated is subjected to a static pressure greater than atmospheric pressure by not less than 0.05 MPa. According to the invention, voids are easily eliminated irrespective of a design of the wiring board, and the adhesive is prevented from curling up on the chip.

Abstract: The adhesive composition according to the present invention is characterized by including an acrylic copolymer (A), an epoxy thermosetting resin (B) and a compound (C) having a functional group which can react with an epoxy group and having an unsaturated hydrocarbon group. According to the present invention, the high package reliability can be achieved even when exposed to severe reflow conditions in a package in which a thin semiconductor chip is mounted.