Patents by Inventor Isao IDA
Isao IDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11919084Abstract: An electronic component includes an element body made of a composite material of a resin material and metal powder. A plurality of particles of the metal powder are exposed from the resin material and make contact with one another on the outer surface of the element.Type: GrantFiled: August 18, 2022Date of Patent: March 5, 2024Assignee: Murata Manufacturing Co., Ltd.Inventors: Keita Muneuchi, Eiji Iso, Isao Ida, Kenichi Araki, Noriko Shimizu, Takashi Tomohiro
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Publication number: 20230191484Abstract: A coil component includes a body that is made of a composite material containing a resin material and metal powder, a coil conductor which is provided in the body and an end portion of which is exposed on an end face of the body, and a metal film that is provided on an outer surface of the body and that is electrically connected to the coil conductor on the end face in the outer surface. The outer surface of the body has a contact area that is in contact with the metal film. Multiple particles of the metal powder escape from the resin material and are in contact with each other in the contact area of the body.Type: ApplicationFiled: February 14, 2023Publication date: June 22, 2023Applicant: Murata Manufacturing Co., Ltd.Inventors: Takashi TOMOHIRO, Noriko SHIMIZU, Kenichi ARAKI, Eiji ISO, Keita MUNEUCHI, Isao IDA
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Patent number: 11615903Abstract: A coil component includes a body that is made of a composite material containing a resin material and metal powder, a coil conductor which is provided in the body and an end portion of which is exposed on an end face of the body, and a metal film that is provided on an outer surface of the body and that is electrically connected to the coil conductor on the end face in the outer surface. The outer surface of the body has a contact area that is in contact with the metal film. Multiple particles of the metal powder escape from the resin material and are in contact with each other in the contact area of the body.Type: GrantFiled: April 30, 2018Date of Patent: March 28, 2023Assignee: Murata Manufacturing Co., Ltd.Inventors: Takashi Tomohiro, Noriko Shimizu, Kenichi Araki, Eiji Iso, Keita Muneuchi, Isao Ida
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Publication number: 20230015749Abstract: A manufacturing method for an electronic component includes preparing a first composite magnetic section provided with a first composite magnetic layer and at least one marker layer disposed on the first composite magnetic layer; and preparing a second composite magnetic section provided with a second composite magnetic layer and at least one coil formed by winding a conductive wire and buried in the second composite magnetic layer with part of the coil being exposed. The manufacturing method further includes obtaining a multilayer body by disposing the first composite magnetic section so that a surface on the opposite side of the first composite magnetic section to a surface where the marker layer is disposed opposes a surface of the second composite magnetic section; and obtaining a molded body having a marker area formed with non-conductive particles pressed into the first composite magnetic layer.Type: ApplicationFiled: September 26, 2022Publication date: January 19, 2023Applicant: Murata Manufacturing Co., Ltd.Inventors: Eiji ISO, Isao IDA, Hiroshi OKUIZUMI, Takao KAWACHI
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Publication number: 20220392687Abstract: An electronic component includes an element body made of a composite material of a resin material and metal powder.Type: ApplicationFiled: August 18, 2022Publication date: December 8, 2022Applicant: Murata Manufacturing Co., Ltd.Inventors: Keita MUNEUCHI, Eiji ISO, Isao IDA, Kenichi ARAKI, Noriko SHIMIZU, Takashi TOMOHIRO
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Patent number: 11488760Abstract: An electronic component includes an element body made of a composite material of a resin material and metal powder. A plurality of particles of the metal powder are exposed from the resin material and make contact with one another on the outer surface of the element.Type: GrantFiled: April 30, 2018Date of Patent: November 1, 2022Assignee: Murata Manufacturing Co., Ltd.Inventors: Keita Muneuchi, Eiji Iso, Isao Ida, Kenichi Araki, Noriko Shimizu, Takashi Tomohiro
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Patent number: 11488753Abstract: A manufacturing method for an electronic component includes preparing a first composite magnetic section provided with a first composite magnetic layer and at least one marker layer disposed on the first composite magnetic layer; and preparing a second composite magnetic section provided with a second composite magnetic layer and at least one coil formed by winding a conductive wire and buried in the second composite magnetic layer with part of the coil being exposed. The manufacturing method further includes obtaining a multilayer body by disposing the first composite magnetic section so that a surface on the opposite side of the first composite magnetic section to a surface where the marker layer is disposed opposes a surface of the second composite magnetic section; and obtaining a molded body having a marker area formed with non-conductive particles pressed into the first composite magnetic layer.Type: GrantFiled: October 3, 2018Date of Patent: November 1, 2022Assignee: Murata Manufacturing Co., Ltd.Inventors: Eiji Iso, Isao Ida, Hiroshi Okuizumi, Takao Kawachi
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Patent number: 10510479Abstract: An electronic component includes a coil, or a coiled conductor, and a molded body including a sealant containing resin and magnetic powder, and encapsulating the coil. The coil is coated with a cured product of a thermosetting composition, and the coated body is embedded in the molded body. A method of manufacturing the electronic component includes forming a coil by winding a conductor, applying a thermosetting composition on the coil, heat treating the coil on which the composition is applied to obtain a coated body, embedding the coated body into a sealant containing resin and magnetic powder, and applying pressure to the sealant to form a molded body.Type: GrantFiled: October 24, 2017Date of Patent: December 17, 2019Assignee: Murata Manufacturing Co., Ltd.Inventors: Koichi Ida, Shun Ozaki, Hou Muramoto, Isao Ida
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Publication number: 20190115127Abstract: A manufacturing method for an electronic component includes preparing a first composite magnetic section provided with a first composite magnetic layer and at least one marker layer disposed on the first composite magnetic layer; and preparing a second composite magnetic section provided with a second composite magnetic layer and at least one coil formed by winding a conductive wire and buried in the second composite magnetic layer with part of the coil being exposed. The manufacturing method further includes obtaining a multilayer body by disposing the first composite magnetic section so that a surface on the opposite side of the first composite magnetic section to a surface where the marker layer is disposed opposes a surface of the second composite magnetic section; and obtaining a molded body having a marker area formed with non-conductive particles pressed into the first composite magnetic layer.Type: ApplicationFiled: October 3, 2018Publication date: April 18, 2019Applicant: Murata Manufacturing Co., Ltd.Inventors: Eiji ISO, Isao IDA, Hiroshi OKUIZUMI, Takao KAWACHI
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Publication number: 20180247747Abstract: A coil component includes a body that is made of a composite material containing a resin material and metal powder, a coil conductor which is provided in the body and an end portion of which is exposed on an end face of the body, and a metal film that is provided on an outer surface of the body and that is electrically connected to the coil conductor on the end face in the outer surface. The outer surface of the body has a contact area that is in contact with the metal film. Multiple particles of the metal powder escape from the resin material and are in contact with each other in the contact area of the body.Type: ApplicationFiled: April 30, 2018Publication date: August 30, 2018Applicant: Murata Manufacturing Co., Ltd.Inventors: Takashi TOMOHIRO, Noriko SHIMIZU, Kenichi ARAKI, Eiji ISO, Keita MUNEUCHI, Isao IDA
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Publication number: 20180247764Abstract: An electronic component includes an element body made of a composite material of a resin material and metal powder.Type: ApplicationFiled: April 30, 2018Publication date: August 30, 2018Applicant: Murata Manufacturing Co., Ltd.Inventors: Keita MUNEUCHI, Eiji ISO, Isao IDA, Kenichi ARAKI, Noriko SHIMIZU, Takashi TOMOHIRO
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Patent number: 10026549Abstract: A method of manufacturing an electronic component includes: a coil forming step of forming a winding coil by a wire-shaped conductor; a press fitting step of embedding the winding coil into a plate-shaped composite magnetic material in a state in which the plate-shaped composite magnetic material is softened, the plate-shaped composite magnetic material being a composite magnetic material that is formed in a plate shape and in which magnetic particles and a resin are mixed; a covering step of covering a part of the winding coil with another plate-shaped composite magnetic material that is softened, the part of the coil being a part remaining uncovered in the press fitting step; a pressurizing step of pressurizing and molding an entirety; and, a hardening step of hardening the composite magnetic material.Type: GrantFiled: November 17, 2014Date of Patent: July 17, 2018Assignee: Murata Manufacturing Co., Ltd.Inventors: Takao Kawachi, Yoshiharu Sato, Takahiro Ogawa, Isao Ida
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Publication number: 20180114631Abstract: An electronic component includes a coil, or a coiled conductor, and a molded body including a sealant containing resin and magnetic powder, and encapsulating the coil. The coil is coated with a cured product of a thermosetting composition, and the coated body is embedded in the molded body. A method of manufacturing the electronic component includes forming a coil by winding a conductor, applying a thermosetting composition on the coil, heat treating the coil on which the composition is applied to obtain a coated body, embedding the coated body into a sealant containing resin and magnetic powder, and applying pressure to the sealant to form a molded body.Type: ApplicationFiled: October 24, 2017Publication date: April 26, 2018Applicant: Murata Manufacturing Co., Ltd.Inventors: Koichi IDA, Shun OZAKI, Hou MURAMOTO, Isao IDA
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Publication number: 20160322160Abstract: A method of manufacturing an electronic component includes: a coil forming step of forming a winding coil by a wire-shaped conductor; a press fitting step of embedding the winding coil into a plate-shaped composite magnetic material in a state in which the plate-shaped composite magnetic material is softened, the plate-shaped composite magnetic material being a composite magnetic material that is formed in a plate shape and in which magnetic particles and a resin are mixed; a covering step of covering a part of the winding coil with another plate-shaped composite magnetic material that is softened, the part of the coil being a part remaining uncovered in the press fitting step; a pressurizing step of pressurizing and molding an entirety; and, a hardening step of hardening the composite magnetic material.Type: ApplicationFiled: November 17, 2014Publication date: November 3, 2016Inventors: Takao KAWACHI, Yoshiharu SATO, Takahiro OGAWA, Isao IDA